2024年3月20日发(作者：买月桂)
Memory Module Specifi cations
KHX16C9T2K2/8X
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR3-1600 CL9 240-Pin DIMM Kit
SPECIFICATIONS
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
9 cycles
49.5ns (min.)
160ns (min.)
36ns (min.)
2.400 W*
94 V - 0
0
o
C to 85
o
C
-55
o
C to +100
o
C
*Power will vary depending on the SDRAM used.
DESCRIPTION
Kingston's KHX16C9T2K2/8X is a kit of two 512M x 64-bit
(4GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) 2Rx8
memory modules, based on sixteen 256M x 8-bit DDR3 FBGA
components per module. Each module kit supports Intel
®
XMP
(Extreme Memory Profiles). Total kit capacity is 8GB. Each
module kit has been tested to run at DDR3-1600 at a low
latency timing of 9-9-9 at 1.65V. The SPDs are programmed to
JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V.
Each 240-pin DIMM uses gold contact fingers and requires
+1.5V. The JEDEC standard electrical and mechanical specifi-
cations are as follows:
FEATURES
•
•
•
•
•
•
•
•
•
•
JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
VDDQ = 1.5V (1.425V ~ 1.575V)
667MHz fCK for 1333Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 9, 8, 7, 6
Posted CAS
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
Asynchronous Reset
PCB : Height 2.122” (53.90mm) w/ heatsink, double sided
component
Continued >>
XMP TIMING PARAMETERS
•
•
JEDEC:*********************
XMPProfile#1:********************
•
•
•
•
•
•
Document No. 4806480-001.A00 08/15/12 Page 1
continuedHyperX
MODULE DIMENSIONS
30.00
Units: millimeters
133.35
18.80
15.80
11.00
8.00
0.00
0
.
0
0
5
4
.
7
0
MODULE WITH HEAT SPREADER
53.90mm (2.122
2024年3月20日发(作者：买月桂)
Memory Module Specifi cations
KHX16C9T2K2/8X
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR3-1600 CL9 240-Pin DIMM Kit
SPECIFICATIONS
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
9 cycles
49.5ns (min.)
160ns (min.)
36ns (min.)
2.400 W*
94 V - 0
0
o
C to 85
o
C
-55
o
C to +100
o
C
*Power will vary depending on the SDRAM used.
DESCRIPTION
Kingston's KHX16C9T2K2/8X is a kit of two 512M x 64-bit
(4GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) 2Rx8
memory modules, based on sixteen 256M x 8-bit DDR3 FBGA
components per module. Each module kit supports Intel
®
XMP
(Extreme Memory Profiles). Total kit capacity is 8GB. Each
module kit has been tested to run at DDR3-1600 at a low
latency timing of 9-9-9 at 1.65V. The SPDs are programmed to
JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V.
Each 240-pin DIMM uses gold contact fingers and requires
+1.5V. The JEDEC standard electrical and mechanical specifi-
cations are as follows:
FEATURES
•
•
•
•
•
•
•
•
•
•
JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
VDDQ = 1.5V (1.425V ~ 1.575V)
667MHz fCK for 1333Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 9, 8, 7, 6
Posted CAS
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
Asynchronous Reset
PCB : Height 2.122” (53.90mm) w/ heatsink, double sided
component
Continued >>
XMP TIMING PARAMETERS
•
•
JEDEC:*********************
XMPProfile#1:********************
•
•
•
•
•
•
Document No. 4806480-001.A00 08/15/12 Page 1
continuedHyperX
MODULE DIMENSIONS
30.00
Units: millimeters
133.35
18.80
15.80
11.00
8.00
0.00
0
.
0
0
5
4
.
7
0
MODULE WITH HEAT SPREADER
53.90mm (2.122