2024年5月16日发(作者：彤远航)
Memory Module Specifi cations
KHX2133C10D3W1K2/4GX
4GB (2GB 256M x 64-Bit x 2 pcs.)
DDR3-2133 CL10 240-Pin DIMM Kit
SPECIFICATIONS
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Power (Operating)
UL Rating
Operating Temperature
Storage Temperature
9 cycles
49.5ns (min.)
160ns (min.)
36ns (min.)
0.795 W* (per module)
94 V - 0
0
o
C to 85
o
C
-55
o
C to +100
o
C
*Power will vary depending on the SDRAM used.
DESCRIPTION
Kingston's KHX2133C10D3W1K2/4GX is a kit of two 256M x
64-bit (2GB) DDR3-2133 CL10 SDRAM (Synchronous DRAM),
water cooled, 1Rx8 memory modules, based on eight
256M x 8-bit DDR3 FBGA components per module. Each
module kit supports Intel
®
XMP (Extreme Memory Profiles).
Total kit capacity is 4GB. Each module kit has been tested to
run at DDR3-2133 at a low latency timing of 10-11-10 at 1.65V.
The SPDs are programmed to JEDEC standard latency DDR3-
1333 timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold
contact fingers. The JEDEC standard electrical and mechanical
specifications are as follows:
FEATURES
•
•
•
•
•
•
•
•
•
JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
VDDQ = 1.5V (1.425V ~ 1.575V)
667MHz fCK for 1333Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 9, 8, 7, 6
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
Asynchronous Reset
PCB : Height 1.88” (48.00mm) w/ heatsink, single sided
component
Continued >>
XMP TIMING PARAMETERS
•
•
•
JEDEC:*********************
XMPProfile#1:**********************
XMPProfile#2:***********************
•
•
•
•
•
•
Document No. 4806197-001.A00 09/27/11 Page 1
continuedHyperX
MODULE DIMENSIONSMODULE WITH HEAT SPREADER
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2024年5月16日发(作者：彤远航)
Memory Module Specifi cations
KHX2133C10D3W1K2/4GX
4GB (2GB 256M x 64-Bit x 2 pcs.)
DDR3-2133 CL10 240-Pin DIMM Kit
SPECIFICATIONS
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Power (Operating)
UL Rating
Operating Temperature
Storage Temperature
9 cycles
49.5ns (min.)
160ns (min.)
36ns (min.)
0.795 W* (per module)
94 V - 0
0
o
C to 85
o
C
-55
o
C to +100
o
C
*Power will vary depending on the SDRAM used.
DESCRIPTION
Kingston's KHX2133C10D3W1K2/4GX is a kit of two 256M x
64-bit (2GB) DDR3-2133 CL10 SDRAM (Synchronous DRAM),
water cooled, 1Rx8 memory modules, based on eight
256M x 8-bit DDR3 FBGA components per module. Each
module kit supports Intel
®
XMP (Extreme Memory Profiles).
Total kit capacity is 4GB. Each module kit has been tested to
run at DDR3-2133 at a low latency timing of 10-11-10 at 1.65V.
The SPDs are programmed to JEDEC standard latency DDR3-
1333 timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold
contact fingers. The JEDEC standard electrical and mechanical
specifications are as follows:
FEATURES
•
•
•
•
•
•
•
•
•
JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
VDDQ = 1.5V (1.425V ~ 1.575V)
667MHz fCK for 1333Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 9, 8, 7, 6
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
Asynchronous Reset
PCB : Height 1.88” (48.00mm) w/ heatsink, single sided
component
Continued >>
XMP TIMING PARAMETERS
•
•
•
JEDEC:*********************
XMPProfile#1:**********************
XMPProfile#2:***********************
•
•
•
•
•
•
Document No. 4806197-001.A00 09/27/11 Page 1
continuedHyperX
MODULE DIMENSIONSMODULE WITH HEAT SPREADER
m
0
m
8
.
7
3
4
2