2024年5月23日发(作者：鞠歌)
SODIMM
DDR2 SDRAM
DDR2 Unbuffered SODIMM
200pin Unbuffered SODIMM based on 1Gb Q-die
64-bit Non-ECC
60FBGA & 84FBGA with Lead-Free and Halogen-Free
(RoHS compliant)
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE
CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHER-
WISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOL-
OGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT
GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar
applications where Product failure could result in loss of life or personal or physical harm, or any military or
defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.
1 of 19
Rev. 1.1 July 2008
SODIMM
Table of Contents
DDR2 SDRAM
1.0 DDR2 Unbuffered SODIMM Ordering Information .....................................................................4
2.0 Features .........................................................................................................................................4
3.0 Address Configuration .................................................................................................................4
4.0 Pin Configurations (Front side/Back side) .................................................................................5
5.0 5
6.0 Input/Output Function Description .............................................................................................6
7.0 Functional Block Diagram :......................................................................................................... 7
7.1 2GB, 256Mx64 Module - M470T5663QZ(H)3
.......................................................................................7
7.2 1GB, 128Mx64 Module - M470T2864QZ(H)3
.......................................................................................8
7.3 512MB, 64Mx64 Module - M470T6464QZ(H)3
......................................................................................9
8.0 Absolute Maximum DC Ratings ................................................................................................10
9.0 AC & DC Operating Conditions .................................................................................................10
9.1 Recommended DC Operating Conditions (SSTL - 1.8)
......................................................................10
9.2 Operating Temperature Condition
..................................................................................................11
9.3 Input DC Logic Level
....................................................................................................................11
9.4 Input AC Logic Level
....................................................................................................................11
9.5 AC Input Test Conditions
..............................................................................................................11
10.0 IDD Specification Parameters Definition ................................................................................12
11.0 Operating Current Table : ........................................................................................................13
11.1 M470T5663QZ(H)3 : 256Mx64 2GB Module
......................................................................................13
11.2 M470T2864QZ(H)3 : 128Mx64 1GB Module
......................................................................................13
11.3 M470T6464QZ(H)3 : 64Mx64 512MB Module
....................................................................................13
12.0 Input/Output Capacitance ........................................................................................................14
13.0 Electrical Characteristics & AC Timing for DDR2-800/667 ...................................................14
13.1 Refresh Parameters by Device Density
...........................................................................................14
13.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin
...............................................14
13.3 Timing Parameters by Speed Grade
..............................................................................................15
14.0 Physical Dimensions : .............................................................................................................17
14.1 128Mbx8 based 256Mx64 Module (2 Rank)
.....................................................................................17
14.2 64Mbx16 based 128Mx64 Module (2 Rank)
......................................................................................18
14.3 64Mbx16 based 64Mx64 Module (1 Rank)
.......................................................................................19
2 of 19
Rev. 1.1 July 2008
2024年5月23日发(作者：鞠歌)
SODIMM
DDR2 SDRAM
DDR2 Unbuffered SODIMM
200pin Unbuffered SODIMM based on 1Gb Q-die
64-bit Non-ECC
60FBGA & 84FBGA with Lead-Free and Halogen-Free
(RoHS compliant)
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE
CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHER-
WISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOL-
OGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT
GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar
applications where Product failure could result in loss of life or personal or physical harm, or any military or
defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.
1 of 19
Rev. 1.1 July 2008
SODIMM
Table of Contents
DDR2 SDRAM
1.0 DDR2 Unbuffered SODIMM Ordering Information .....................................................................4
2.0 Features .........................................................................................................................................4
3.0 Address Configuration .................................................................................................................4
4.0 Pin Configurations (Front side/Back side) .................................................................................5
5.0 5
6.0 Input/Output Function Description .............................................................................................6
7.0 Functional Block Diagram :......................................................................................................... 7
7.1 2GB, 256Mx64 Module - M470T5663QZ(H)3
.......................................................................................7
7.2 1GB, 128Mx64 Module - M470T2864QZ(H)3
.......................................................................................8
7.3 512MB, 64Mx64 Module - M470T6464QZ(H)3
......................................................................................9
8.0 Absolute Maximum DC Ratings ................................................................................................10
9.0 AC & DC Operating Conditions .................................................................................................10
9.1 Recommended DC Operating Conditions (SSTL - 1.8)
......................................................................10
9.2 Operating Temperature Condition
..................................................................................................11
9.3 Input DC Logic Level
....................................................................................................................11
9.4 Input AC Logic Level
....................................................................................................................11
9.5 AC Input Test Conditions
..............................................................................................................11
10.0 IDD Specification Parameters Definition ................................................................................12
11.0 Operating Current Table : ........................................................................................................13
11.1 M470T5663QZ(H)3 : 256Mx64 2GB Module
......................................................................................13
11.2 M470T2864QZ(H)3 : 128Mx64 1GB Module
......................................................................................13
11.3 M470T6464QZ(H)3 : 64Mx64 512MB Module
....................................................................................13
12.0 Input/Output Capacitance ........................................................................................................14
13.0 Electrical Characteristics & AC Timing for DDR2-800/667 ...................................................14
13.1 Refresh Parameters by Device Density
...........................................................................................14
13.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin
...............................................14
13.3 Timing Parameters by Speed Grade
..............................................................................................15
14.0 Physical Dimensions : .............................................................................................................17
14.1 128Mbx8 based 256Mx64 Module (2 Rank)
.....................................................................................17
14.2 64Mbx16 based 128Mx64 Module (2 Rank)
......................................................................................18
14.3 64Mbx16 based 64Mx64 Module (1 Rank)
.......................................................................................19
2 of 19
Rev. 1.1 July 2008