2024年8月16日发(作者：阳明钰)
KOMPSAT-3A Satellite Sensor Specifications
Spectral bands
Optics
GSD (Ground Sample
Distance)
Swath width
Pan CCD detector module
MS CCD detector module
Antiblooming
PRNU (Photo Response
Non-Uniformity)
DSNU (Dark Signal
Non-Uniformity)
SNR (Signal-to-Noise
Ratio)
PAN: 450-900 µm
MS1 (Blue): 450-520 µm
MS2 (Green): 520-600 µm
MS3 (Red): 630-690 µm
MS4 (NIR): 760-900 µm
MWIR: 3.3 - 5.2 µm
- Korsch-type telescope design on a CFRP
optical bench
- 80 cm diameter of primary mirror aperture
(the mirrors are lightweighted)
- All mirrors (5) are of Zerodur design
- Focal length = 8.6 m
- F number = f/11.5
PAN: 0.55m at nadir
MS: 2.2m at nadir
IR: 5.5 m at nadir
12 km (at nadir)
- Line array of 24,000 pixels consisting of
2 stacks of 12 k pixels each
- TDI (Time Delay Integration), up to 64 TDI
in 4 stages
- Pixel pitch = 8.75 µm
- Source data rate = 16 x 15 Mpixel/s (or 3.84
Gbit/s)
- Line array of 6,000 pixels, provision of 8
stacks, TDI capability
- Pixel pitch = 2 x 17.5 µm
- Binning of MS pixels (MS pixels are 4 times
longer than Pan pixels)
- Source data rate = 4 x 240 Mbit/s
Yes
Yes
Yes
> 100 for Pan and MS
Data quantization
Data compression
Payload data memory
Data rate
14 bit
CCSDS 120.1-G-1E
512 Gbit
1 GB/s
2024年8月16日发(作者：阳明钰)
KOMPSAT-3A Satellite Sensor Specifications
Spectral bands
Optics
GSD (Ground Sample
Distance)
Swath width
Pan CCD detector module
MS CCD detector module
Antiblooming
PRNU (Photo Response
Non-Uniformity)
DSNU (Dark Signal
Non-Uniformity)
SNR (Signal-to-Noise
Ratio)
PAN: 450-900 µm
MS1 (Blue): 450-520 µm
MS2 (Green): 520-600 µm
MS3 (Red): 630-690 µm
MS4 (NIR): 760-900 µm
MWIR: 3.3 - 5.2 µm
- Korsch-type telescope design on a CFRP
optical bench
- 80 cm diameter of primary mirror aperture
(the mirrors are lightweighted)
- All mirrors (5) are of Zerodur design
- Focal length = 8.6 m
- F number = f/11.5
PAN: 0.55m at nadir
MS: 2.2m at nadir
IR: 5.5 m at nadir
12 km (at nadir)
- Line array of 24,000 pixels consisting of
2 stacks of 12 k pixels each
- TDI (Time Delay Integration), up to 64 TDI
in 4 stages
- Pixel pitch = 8.75 µm
- Source data rate = 16 x 15 Mpixel/s (or 3.84
Gbit/s)
- Line array of 6,000 pixels, provision of 8
stacks, TDI capability
- Pixel pitch = 2 x 17.5 µm
- Binning of MS pixels (MS pixels are 4 times
longer than Pan pixels)
- Source data rate = 4 x 240 Mbit/s
Yes
Yes
Yes
> 100 for Pan and MS
Data quantization
Data compression
Payload data memory
Data rate
14 bit
CCSDS 120.1-G-1E
512 Gbit
1 GB/s