RNAS-1200系列产品兼容性指南说明书-USB迷|专注于互联网分享

2024年8月22日发(作者：森晴丽)

RNAS-1200 Series

Component Compatibility Guide

A list of peripheral components suitable for use with the RNAS-1200 series of computers

2016/07/05 Version 2.0

Trademarks

The MOXA logo is a registered trademark of Moxa Inc.

All other trademarks or registered marks in this manual belong to their respective manufacturers.

Disclaimer

Information in this document is subject to change without notice and does not represent a commitment on the part of

Moxa.

Moxa provides this document as is, without warranty of any kind, either expressed or implied, including, but not limited to,

its particular purpose. Moxa reserves the right to make improvements and/or changes to this manual, or to the products

and/or the programs described in this manual, at any time.

Information provided in this manual is intended to be accurate and reliable. However, Moxa assumes no responsibility for

its use, or for any infringements on the rights of third parties that may result from its use.

This document might contain unintentional technical or typographical errors. Changes are periodically made to the

information herein to correct such errors, and these changes are incorporated into new editions of the publication.

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RNAS-1200 Series CCG V 2.0 Page 2 of 6

1. Introduction

This document lists hardware components that are proven to provide the performance listed in the

specification when used with the Moxa RNAS-1200 series of embedded computers, or computers

that share basic design features with the RNAS-1200 series. Moxa computers come with multiple

peripheral options and are engineered to work with components having different hardware

specifications. This flexibility could sometimes lead to compatibility issues. When used with the

RNAS-1200 series of embedded computers, peripherals from one manufacturer may not work as

well as the ones made by another manufacturer. Moxa provides this list of RNAS-1200

series-compatible components, so that users can be certain of a reliable performance from the

RNAS-1200 series, when it is used with the components listed in this document.

2. Testing Methods

To validate that a component meets the Moxa standards for quality and performance, the following

five key compatibility tests are run:

•

Ambient temperature burn-in

Low temperature hard start

Heat/humidity burn-in

Cyclic high-low temperature burn-in

Vibration test

Additionally, tests for compliance with safety and performance standards may also be run.

For this device, the following compatibility and compliance tests have been run:

• Ambient temperature burn-in

• Low temperature hard start

• EN-50155-T1 test

• EN-50155-TX test

The tests are described below:

Ambient Temperature Burn-In

The component is mounted on to a RNAS-1200 computer and put through a series of stress tests

at an ambient temperature of around 25˚C, for a specified period of time. The duration of the test is

determined based on the class of peripherals being tested.

RNAS-1200 Series CCG V 2.0 Page 3 of 6

Low Temperature Hard Start

The component is mounted on to an unpowered RNAS-1200 computer and then the system is

booted up at an extremely low temperature. The designated low temperature value depends on the

computer model being tested.

EN-50155 T1 Mode Confirmation

Components are mounted on to an unpowered RNAS-1200 computer and then the system is

booted up at -25˚C.

EN-50155 TX Mode Confirmation

Components are mounted on to an unpowered RNAS-1200 computer and then the system is

booted up at -40˚C.

3. Storage Endurance

Storage media, such as SSDs, CF cards, SD cards, Disk on Module, and Cfast, are composed of

different electrical components. The main electrical components in these storage media, the

NAND-flash memory and NAND-flash controller, impact the storage endurance and lifespan of the

storage media.

NAND-Flash Memory Endurance

NAND-flash memories have a limit on the number of times they can be programmed and erased

(P/E). The P/E cycle as well as the erase count of a NAND-flash memory can be used to determine

this limit. For example, an SLC (single-level cell) flash memory has a 60,000 P/E cycle, an MLC

(multi-level cell) flash memory has a 3,000 P/E cycle, and TLC NAND flash memories have P/E

cycle values up to 1,000. Each flash memory type has a different endurance level, which is why the

storage lifespan is based on the flash memory type. Storage that uses SLC type flash memory

could have the best endurance level compared with the MLC type storage. SLC storage usually

comes with a 5-year OEM warranty (the actual warranty period depends on the original

manufacturer). MLC storage only comes with a 1- to 3-year warranty. The major differences

between SLC and MLC are: (a) The SLC NAND flash has a lifespan that is around 20 times that of

an MLC, and (b) The price can differ by a factor of 4 to 5. The SLC type of storage is recommended

for systems that are expected to have high reliability, and for applications that need to frequently

write data to a storage medium.

Terabytes Written (TBW)

TBW is the unit used to evaluate SSD endurance. In actual applications, storage is used for routine

operations and data access. Therefore the physical P/E cycle is not appropriate for describing the

total rewritable data capacity. The management efficiency of the storage controller also affects the

total rewritable data capacity result. For these reasons, Joint Electron Device Engineering Council

RNAS-1200 Series CCG V 2.0 Page 4 of 6

(JEDEC) has defined a standard for SSD endurance evaluation called JESD218, which uses TBW

to measure the endurance of the storage memory. By referring to this TBW value, users can easily

estimate the storage specification and select a suitable storage for real-life use cases. For example,

when routine operations need a maximum of 20 GB and the expected storage lifespan is 3 years,

the total rewritable data demand would be 21.9 TBW (20 GB x 365 x 3). In this case, a storage that

has more than 21.9 TBW will meet the requirement. We recommend selecting a storage media

with a TBW that is greater than the calculated value.

4. Declaration for Liability Exclusion

The specifications, warranty terms, and liability of items listed in this guide are the sole

responsibility of the original manufacturers. Moxa does not take any responsibility in this regard.

Please visit the manufacturers’ official websites for up-to-date product information before

purchasing the components.

5. Compatible Components

Peripheral components that have been tested and found suitable for use with the RNAS-1200

series of computers are listed in this section. The following table lists the Test Codes and their

descriptions:

Test Code

Description

The component passed ambient temperature verification

The component passed EN50155 T1 verification

The component passed EN50155 TX verification

Component has not been tested, but shares materials and design with

another component that has been verified.

RNAS-1200 Series CCG V 2.0 Page 5 of 6

HDD

Vendor

HGST

Samsung

Seagate

TOSHIBA

Storage Size

100 GB

250 GB

320 GB

500 GB

640 GB

750 GB

1 TB

2TB

500 GB

100 GB

500 GB

750 GB

1 TB

Moxa’s PN

N/A

Vendor’s MPN

HEJ421010G9SA00

HCC545025A7E380

HCC545025A7E680

HCC545032A7E380

HCC545032A7E680

HCC545050A7E380

HCC545050A7E680

HCC547550A9E380

HTS725050A7E630 / 0J38075

HCC541064A9E680

HCC547564A9E380

HTS541064A9E680

HTS541064A9E681

HCC541075A9E680

HCC547575A9E380

HTS541075A9E680

HTS541075A9E681

HTS721010A9E630 / 0J22423

HCC541010A9E680

HTE541010A9E680

HTS541010A9E680

HTS541010A9E681

ST2000LM003

ST9500325AS

MK1060GSC

MK5061GSYN

WD5000BUCT

WD5000LPVT

WD7500BPKT

WD10JPVT

WD10JUCT

WD10SPCX

Controller

N/A

Firmware

N/A

Condition Code

B, C

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