2024年9月17日发(作者：稽幻桃)
Absolute Maximum Ratings
Symbol
V
s
Iout
PEAK
Iout
AVmax
f
max
V
CE
Conditions
Supply voltage primary
Output peak current
Output average current
Max. switching frequency
Collector emitter voltage sense across
the IGBT
Isolation test voltage input - output (AC,
rms, 2s)
Partial discharge extinction voltage,
rms, Q
PD
≤ 10pC
Isolation test voltage output 1 - output 2
(AC, rms, 2s)
Minimum rating for external R
Gon
Minimum rating for external R
Goff
Operating temperature
Storage temperature
Values
16
30
150
100
1700
4000
1200
1500
0.8
0.8
-40...85
-40...85
Unit
V
A
mA
kHz
V
V
V
V
Ω
Ω
°C
°C
®
IGBT Driver Core
Board 2//3S SKYPER 42 R
V
isol IO
V
isolPD
V
isol12
R
Gon min
R
Goff min
T
op
T
stg
Features
•Two output channels
•Failure management
Characteristics
SymbolConditions
Supply voltage primary side
Input signal voltage on / off
Input treshold voltage HIGH
input threshold voltage (LOW)
Turn on output voltage
Turn off output voltage
Input-output turn-on propagation time
Input-output turn-off propagation time
4.6
15
-8
1.1
1.1
min.
14.4
typ.
15
15 / 0
max.
15.6
12.3
Unit
V
V
V
V
V
V
µs
µs
Typical Applications*
•Adaptor board for SKYPER IGBT
drivers in bridge circuits for industrial
applications
•DC bus up to 1000V
V
s
V
i
V
IT+
V
IT-
V
G(on)
V
G(off)
t
d(on)IO
t
d(off)IO
Footnote
Isolation test voltage with external high
voltage diode
The isolation test is not performed as a
series test at SEMIKRON
The driver power can be expanded to 50µC
with external boost capacitors
Isolation coordination in compliance with
EN50178 PD2
Operating temperature is real ambient
temperature around the driver core
Degree of protection: IP00
Adaptor board
Rev. 4–14.04.20151
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.
2Rev. 4–14.04.2015© by SEMIKRON
Adaptor Board 2 parallel 3S SKYPER 42 R
Technical Explanations
Revision 04
®
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
This Technical Explanation is valid for the following parts:
part number
L5059201
type
Board 2 // 3S SKYPER 42 R
®
date code (YYWW)
≥ 1515
Related documents:
title
Technical Explanations SKYPER
®
42 R
Prepared by: Johannes Krapp
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Content
Application and Handling Instructions .................................................................................................................... 2
Further application support ..................................................................................................................................... 2
General Description ................................................................................................................................................ 2
Dimensions ............................................................................................................................................................. 1
PIN Array ................................................................................................................................................................ 2
Setting Dynamic Short Circuit Protection ............................................................................................................... 3
Collector Series Resistance .................................................................................................................................... 4
Adaptation Gate Resistors ...................................................................................................................................... 5
Boost Capacitors .................................................................................................................................................... 5
Temperature Signal ................................................................................................................................................ 5
Mounting Notes ....................................................................................................................................................... 6
Parts List ................................................................................................................................................................. 6
1 2015-04-14 – Rev04 © by SEMIKRON
Application and Handling Instructions
Please provide for static discharge protection during handling. As long as the hybrid driver is not completely assembled,
the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any
synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be
short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements
apply to MOSFET- and IGBT-modules.
Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or RCD-
snubber networks between main terminals for PLUS and MINUS of the power module.
When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and load current
in the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and
the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case
temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions,
short-circuit testing may be done, starting again with low collector voltage.
It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events.
Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.
The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than V
S
+0,3V or below -0,3V may destroy
these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided.
The connecting leads between hybrid driver and the power module should be as short as possible (max. 20cm), the
driver leads should be twisted.
Further application support
Latest information is available at . For design support please read the SEMIKRON Application
Manual Power Modules available at .
General Description
®®
The Board 2 parallel 3S SKYPER 42 R is an adaptor board for the IGBT module SEMiX (spring pin version) with size 3.
The board is paralleling two SEMiX modules and realising a symmetrical gate control. The board can be customized
allowing adaptation and optimization to the used IGBT module.
The switching characteristic of the IGBT can be influenced through user settings, e.g. changing turn-on and turn-off speed
by variation of R
Gon
and R
Goff
. Furthermore, it is possible to adjust the monitoring level and blanking time for the DSCP (see
®
Technical Explanations SKYPER 42).
Please note:
This technical explanation is based on the Technical Explanations for SKYPER
®
42PRO. Please read the Technical Explanations
SKYPER
®
42PRO before using the Adaptor Board.
Symmetric and decoupled gate control
Easy plug and play solution with SKYPER 42 R
Expandable up to 50 µC gate charge
Dynamic Short Circuit Protection (DSCP)
including high voltage diode
Optimized paralleling of SEMiX 3S modules
Board 2 // 3S SKYPER
®
42 R – not yet generated
2 © by SEMIKRON
Quality
The following table show the type and end tests of the adapter board.
End
test
AOI
ICT
Type
test
EP
SP
Iso
TC
PD
TH
VB
SH
test category
Automated Optical Inspection
In-Circuit Test
test category
Electrical Parameters
STEP Test, Interrupted PS
Isolation Test
Thermal Cycling
Partial discharge test
Temperature Humidity
Vibration
Shock
test describtion
Control of accurate placement of components/ of solder joints
Test of the populated PCB, checking the correctly fabrication
test conditions
amb = -40°C / +85°C
20x 10µs to 2s
High voltage test 4kV, 60s
200 cycles, Tstgmax – Tstgmin
>1,2 kV; suitable for 1000V DC Link
85°C, 85% RH, 96h
Sinus 20/2000Hz Random 10/2000Hz, 5g, 26 per x,y,z
Half-sinus pulse, 30g, 6000 shocks, 6ms, ±x, ± y, ± z
standard
SEMIKRON
SEMIKRON
standard
SEMIKRON
EN61000-4-29
EN 61800-5-1
IEC60068-2-14
VDE 0110-20
IEC 60068-2-67
IEC 60068-2-6
IEC 60068-2-29
Dimensions
Adaptor Board
135mm
103mm
1 2015-04-14 – Rev04 © by SEMIKRON
PIN Array
Connector X3 (male), RM2,54, 14p
Product information of suitable female connectors and
distributor contact information is available
.
PIN
X3:01
Signal
IF_PWR_GND
Function
GND for power supply and GND for digital
signals
Switching signal input (BOTTOM switch)
Specification
Digital 15 V; 10 kOhm impedance;
LOW = BOT switch off; HIGH = BOT
switch on
LOW = NO ERROR; open collector
output; max. 30V / 15mA (external pull up
resistor necessary)
Digital 15 V; 10 kOhm impedance;
LOW = TOP switch off; HIGH = TOP
switch on
Stabilised +15V ±4%
Stabilised +15V ±4%
X3:02 IF_HB_BOT
X3:03 IF_nERROR_OUT ERROR output
X3:04 IF_HB_TOP Switching signal input (TOP switch)
GND for power supply and GND for digital
signals
Drive power supply
Drive power supply
GND for power supply and GND for digital
signals
X3:05
X3:06
X3:07
X3:08
X3:09
X3:10-14
IF_PWR_GND
reserved
reserved
IF_PWR_15P
IF_PWR_15P
IF_PWR_GND
2 2015-04-14 – Rev04 © by SEMIKRON
Setting Dynamic Short Circuit Protection
R
CE
& C
CE
Designation
R102
C110
R202
C210
Shape
0805
0603
0805
0603
Setting
R
CE
Factory setting: not equipped
C
CE
Factory setting: not equipped
R
CE
Factory setting: not equipped
C
CE
Factory setting: not equipped
TOP
TOP
BOT
BOT
Please refer to the data sheet of SKYPER 42 R for V
CE
formula.
3 2015-04-14 – Rev04 © by SEMIKRON
Collector Series Resistance
R
VCE
Designation
R103
R203
Setting
R
VCE
*
Factory setting: not equipped
R
VCE
*
Factory setting: not equipped
TOP
BOT
Please consider that the RVCE resistor has to be equipped before operation.
* 1200V IGBT operation: 0Ω
* 1700V IGBT operation: 1kΩ / 0,4W
4 2015-04-14 – Rev04 © by SEMIKRON
Adaptation Gate Resistors
R
Gon
& R
Goff
Boost Capacitors
C
boost15P
& C
boost8N
Designation
C105, C106,
C107,C108, C109
C100, C101,
C102,C103, C104
C205, C206,
C207,C208, C209
C200, C201,
C202,C203, C204
Pattern Name
1210
Setting
C
boos+15V
Factory setting: C104, C106 = 10µF/25V*
C107,C108, C109 = not equipped
C
boost-8V
Factory setting: C100, C101=10µF/25V *
C102,C103, C104 = not equipped
C
boos+15V
Factory setting: C205, C206 = 10µF/25V*
C207,C208, C209 = not equipped
C
boos-8V
Factory setting: C200, C201=10µF/25V *
C202,C203, C204 = not equipped
TOP
1210 TOP
1210 BOT
1210 BOT
* Output charge pulse
Formula: 4µF=1µC ->20µF capacitors on the adapter board =5µC gate charge (SKYPER 42 R: 10µF)
Temperature Signal
®
The temperature sensor inside the SEMiX module is directly connected to contacting points P1 and P2. For details to the
®
temperature sensor, see Modules Explanations SEMiX.
Safety Warnings:
The contacting points T1 and T2 are not electrical isolated. Due to high voltage that may be present at the
contacting points T1 and T2, some care must be taken in order to avoid accident. There is no cover or potential
isolation that protect the high voltage sections / wires from accidental human contact.
5 2015-04-14 – Rev04 © by SEMIKRON
Mounting Notes
Driver Core Mounting
1. Soldering of components (e.g. R
Gon
, R
Goff
, etc.) on adaptor board.
2. Insert driver core into the box connector on adaptor board.
3. The connecting leads between board and power module should be as short as possible (max. 20cm), the leads should be twisted.
The connection between driver core and adaptor board should be
mechanical reinforced by using support posts. The posts have to be
spaced between driver core and adaptor board.
Product information of suitable support posts and distributor contact
information is available .
Parts List
Parts List Adaptor Board
Describtion
Resistor Chip
Reference
R101, R201
R130, R131, R132, R133, R134, R135, R170, R171,
R172, R173, R174, R175, R230, R231, R232, R233,
R234, R235, R270, R271, R272, R273, R274, R275
R307, R309
V103, V203
D130, D132, D134, D170, D172, D174, D230, D232,
D234, D270, D272, D274
C302, C303
R301
X10, X11, X100, X200
X3
C100, C101, C105, C106, C200, C201, C205, C206,
C301
V101, V102, V201, V202
Valure
10,0KOhm
Shape
1206 (SMD)
Count
2
Resistor Melf
Resistor Chip
Diode High Voltage
Diode Schottky
Capacitor NP0
Resistor Melf
Connector
Connector
Capacitor X7R
Diode Suppressor
1,00Ohm
10,0KOhm
BY203/20S
10BQ100
1,0nF
10,0KOhm
(female) RM2.54 10p
(male) RM2.54 14p
10uF
SMAJ15CA
MiniMelf (SMD)
0805 (SMD)
SMD
DO214AA (SMD)
0603 (SMD)
MicroMelf (SMD)
SMD 2ROW
SMD
1210 (SMD)
DO214AC (SMD)
24
2
2
12
2
1
4
1
9
4
DISCLAIMER
SEMIKRON reserves the right to make changes without further notice herein to improve reliability, function or design.
Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is
given and no liability is assumed with respect to the accuracy or use of such information. SEMIKRON does not assume
any liability arising out of the application or use of any product or circuit described herein. Furthermore, this technical
information may not be considered as an assurance of component characteristics. No warranty or guarantee expressed
or implied is made regarding delivery, performance or suitability. This document supersedes and replaces all information
previously supplied and may be superseded by updates without further notice.
SEMIKRON products are not authorized for use in life support appliances and systems without the express written
approval by SEMIKRON.
6 2015-04-14 – Rev04 © by SEMIKRON
2024年9月17日发(作者：稽幻桃)
Absolute Maximum Ratings
Symbol
V
s
Iout
PEAK
Iout
AVmax
f
max
V
CE
Conditions
Supply voltage primary
Output peak current
Output average current
Max. switching frequency
Collector emitter voltage sense across
the IGBT
Isolation test voltage input - output (AC,
rms, 2s)
Partial discharge extinction voltage,
rms, Q
PD
≤ 10pC
Isolation test voltage output 1 - output 2
(AC, rms, 2s)
Minimum rating for external R
Gon
Minimum rating for external R
Goff
Operating temperature
Storage temperature
Values
16
30
150
100
1700
4000
1200
1500
0.8
0.8
-40...85
-40...85
Unit
V
A
mA
kHz
V
V
V
V
Ω
Ω
°C
°C
®
IGBT Driver Core
Board 2//3S SKYPER 42 R
V
isol IO
V
isolPD
V
isol12
R
Gon min
R
Goff min
T
op
T
stg
Features
•Two output channels
•Failure management
Characteristics
SymbolConditions
Supply voltage primary side
Input signal voltage on / off
Input treshold voltage HIGH
input threshold voltage (LOW)
Turn on output voltage
Turn off output voltage
Input-output turn-on propagation time
Input-output turn-off propagation time
4.6
15
-8
1.1
1.1
min.
14.4
typ.
15
15 / 0
max.
15.6
12.3
Unit
V
V
V
V
V
V
µs
µs
Typical Applications*
•Adaptor board for SKYPER IGBT
drivers in bridge circuits for industrial
applications
•DC bus up to 1000V
V
s
V
i
V
IT+
V
IT-
V
G(on)
V
G(off)
t
d(on)IO
t
d(off)IO
Footnote
Isolation test voltage with external high
voltage diode
The isolation test is not performed as a
series test at SEMIKRON
The driver power can be expanded to 50µC
with external boost capacitors
Isolation coordination in compliance with
EN50178 PD2
Operating temperature is real ambient
temperature around the driver core
Degree of protection: IP00
Adaptor board
Rev. 4–14.04.20151
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.
2Rev. 4–14.04.2015© by SEMIKRON
Adaptor Board 2 parallel 3S SKYPER 42 R
Technical Explanations
Revision 04
®
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
This Technical Explanation is valid for the following parts:
part number
L5059201
type
Board 2 // 3S SKYPER 42 R
®
date code (YYWW)
≥ 1515
Related documents:
title
Technical Explanations SKYPER
®
42 R
Prepared by: Johannes Krapp
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Content
Application and Handling Instructions .................................................................................................................... 2
Further application support ..................................................................................................................................... 2
General Description ................................................................................................................................................ 2
Dimensions ............................................................................................................................................................. 1
PIN Array ................................................................................................................................................................ 2
Setting Dynamic Short Circuit Protection ............................................................................................................... 3
Collector Series Resistance .................................................................................................................................... 4
Adaptation Gate Resistors ...................................................................................................................................... 5
Boost Capacitors .................................................................................................................................................... 5
Temperature Signal ................................................................................................................................................ 5
Mounting Notes ....................................................................................................................................................... 6
Parts List ................................................................................................................................................................. 6
1 2015-04-14 – Rev04 © by SEMIKRON
Application and Handling Instructions
Please provide for static discharge protection during handling. As long as the hybrid driver is not completely assembled,
the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any
synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be
short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements
apply to MOSFET- and IGBT-modules.
Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or RCD-
snubber networks between main terminals for PLUS and MINUS of the power module.
When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and load current
in the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and
the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case
temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions,
short-circuit testing may be done, starting again with low collector voltage.
It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events.
Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.
The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than V
S
+0,3V or below -0,3V may destroy
these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided.
The connecting leads between hybrid driver and the power module should be as short as possible (max. 20cm), the
driver leads should be twisted.
Further application support
Latest information is available at . For design support please read the SEMIKRON Application
Manual Power Modules available at .
General Description
®®
The Board 2 parallel 3S SKYPER 42 R is an adaptor board for the IGBT module SEMiX (spring pin version) with size 3.
The board is paralleling two SEMiX modules and realising a symmetrical gate control. The board can be customized
allowing adaptation and optimization to the used IGBT module.
The switching characteristic of the IGBT can be influenced through user settings, e.g. changing turn-on and turn-off speed
by variation of R
Gon
and R
Goff
. Furthermore, it is possible to adjust the monitoring level and blanking time for the DSCP (see
®
Technical Explanations SKYPER 42).
Please note:
This technical explanation is based on the Technical Explanations for SKYPER
®
42PRO. Please read the Technical Explanations
SKYPER
®
42PRO before using the Adaptor Board.
Symmetric and decoupled gate control
Easy plug and play solution with SKYPER 42 R
Expandable up to 50 µC gate charge
Dynamic Short Circuit Protection (DSCP)
including high voltage diode
Optimized paralleling of SEMiX 3S modules
Board 2 // 3S SKYPER
®
42 R – not yet generated
2 © by SEMIKRON
Quality
The following table show the type and end tests of the adapter board.
End
test
AOI
ICT
Type
test
EP
SP
Iso
TC
PD
TH
VB
SH
test category
Automated Optical Inspection
In-Circuit Test
test category
Electrical Parameters
STEP Test, Interrupted PS
Isolation Test
Thermal Cycling
Partial discharge test
Temperature Humidity
Vibration
Shock
test describtion
Control of accurate placement of components/ of solder joints
Test of the populated PCB, checking the correctly fabrication
test conditions
amb = -40°C / +85°C
20x 10µs to 2s
High voltage test 4kV, 60s
200 cycles, Tstgmax – Tstgmin
>1,2 kV; suitable for 1000V DC Link
85°C, 85% RH, 96h
Sinus 20/2000Hz Random 10/2000Hz, 5g, 26 per x,y,z
Half-sinus pulse, 30g, 6000 shocks, 6ms, ±x, ± y, ± z
standard
SEMIKRON
SEMIKRON
standard
SEMIKRON
EN61000-4-29
EN 61800-5-1
IEC60068-2-14
VDE 0110-20
IEC 60068-2-67
IEC 60068-2-6
IEC 60068-2-29
Dimensions
Adaptor Board
135mm
103mm
1 2015-04-14 – Rev04 © by SEMIKRON
PIN Array
Connector X3 (male), RM2,54, 14p
Product information of suitable female connectors and
distributor contact information is available
.
PIN
X3:01
Signal
IF_PWR_GND
Function
GND for power supply and GND for digital
signals
Switching signal input (BOTTOM switch)
Specification
Digital 15 V; 10 kOhm impedance;
LOW = BOT switch off; HIGH = BOT
switch on
LOW = NO ERROR; open collector
output; max. 30V / 15mA (external pull up
resistor necessary)
Digital 15 V; 10 kOhm impedance;
LOW = TOP switch off; HIGH = TOP
switch on
Stabilised +15V ±4%
Stabilised +15V ±4%
X3:02 IF_HB_BOT
X3:03 IF_nERROR_OUT ERROR output
X3:04 IF_HB_TOP Switching signal input (TOP switch)
GND for power supply and GND for digital
signals
Drive power supply
Drive power supply
GND for power supply and GND for digital
signals
X3:05
X3:06
X3:07
X3:08
X3:09
X3:10-14
IF_PWR_GND
reserved
reserved
IF_PWR_15P
IF_PWR_15P
IF_PWR_GND
2 2015-04-14 – Rev04 © by SEMIKRON
Setting Dynamic Short Circuit Protection
R
CE
& C
CE
Designation
R102
C110
R202
C210
Shape
0805
0603
0805
0603
Setting
R
CE
Factory setting: not equipped
C
CE
Factory setting: not equipped
R
CE
Factory setting: not equipped
C
CE
Factory setting: not equipped
TOP
TOP
BOT
BOT
Please refer to the data sheet of SKYPER 42 R for V
CE
formula.
3 2015-04-14 – Rev04 © by SEMIKRON
Collector Series Resistance
R
VCE
Designation
R103
R203
Setting
R
VCE
*
Factory setting: not equipped
R
VCE
*
Factory setting: not equipped
TOP
BOT
Please consider that the RVCE resistor has to be equipped before operation.
* 1200V IGBT operation: 0Ω
* 1700V IGBT operation: 1kΩ / 0,4W
4 2015-04-14 – Rev04 © by SEMIKRON
Adaptation Gate Resistors
R
Gon
& R
Goff
Boost Capacitors
C
boost15P
& C
boost8N
Designation
C105, C106,
C107,C108, C109
C100, C101,
C102,C103, C104
C205, C206,
C207,C208, C209
C200, C201,
C202,C203, C204
Pattern Name
1210
Setting
C
boos+15V
Factory setting: C104, C106 = 10µF/25V*
C107,C108, C109 = not equipped
C
boost-8V
Factory setting: C100, C101=10µF/25V *
C102,C103, C104 = not equipped
C
boos+15V
Factory setting: C205, C206 = 10µF/25V*
C207,C208, C209 = not equipped
C
boos-8V
Factory setting: C200, C201=10µF/25V *
C202,C203, C204 = not equipped
TOP
1210 TOP
1210 BOT
1210 BOT
* Output charge pulse
Formula: 4µF=1µC ->20µF capacitors on the adapter board =5µC gate charge (SKYPER 42 R: 10µF)
Temperature Signal
®
The temperature sensor inside the SEMiX module is directly connected to contacting points P1 and P2. For details to the
®
temperature sensor, see Modules Explanations SEMiX.
Safety Warnings:
The contacting points T1 and T2 are not electrical isolated. Due to high voltage that may be present at the
contacting points T1 and T2, some care must be taken in order to avoid accident. There is no cover or potential
isolation that protect the high voltage sections / wires from accidental human contact.
5 2015-04-14 – Rev04 © by SEMIKRON
Mounting Notes
Driver Core Mounting
1. Soldering of components (e.g. R
Gon
, R
Goff
, etc.) on adaptor board.
2. Insert driver core into the box connector on adaptor board.
3. The connecting leads between board and power module should be as short as possible (max. 20cm), the leads should be twisted.
The connection between driver core and adaptor board should be
mechanical reinforced by using support posts. The posts have to be
spaced between driver core and adaptor board.
Product information of suitable support posts and distributor contact
information is available .
Parts List
Parts List Adaptor Board
Describtion
Resistor Chip
Reference
R101, R201
R130, R131, R132, R133, R134, R135, R170, R171,
R172, R173, R174, R175, R230, R231, R232, R233,
R234, R235, R270, R271, R272, R273, R274, R275
R307, R309
V103, V203
D130, D132, D134, D170, D172, D174, D230, D232,
D234, D270, D272, D274
C302, C303
R301
X10, X11, X100, X200
X3
C100, C101, C105, C106, C200, C201, C205, C206,
C301
V101, V102, V201, V202
Valure
10,0KOhm
Shape
1206 (SMD)
Count
2
Resistor Melf
Resistor Chip
Diode High Voltage
Diode Schottky
Capacitor NP0
Resistor Melf
Connector
Connector
Capacitor X7R
Diode Suppressor
1,00Ohm
10,0KOhm
BY203/20S
10BQ100
1,0nF
10,0KOhm
(female) RM2.54 10p
(male) RM2.54 14p
10uF
SMAJ15CA
MiniMelf (SMD)
0805 (SMD)
SMD
DO214AA (SMD)
0603 (SMD)
MicroMelf (SMD)
SMD 2ROW
SMD
1210 (SMD)
DO214AC (SMD)
24
2
2
12
2
1
4
1
9
4
DISCLAIMER
SEMIKRON reserves the right to make changes without further notice herein to improve reliability, function or design.
Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is
given and no liability is assumed with respect to the accuracy or use of such information. SEMIKRON does not assume
any liability arising out of the application or use of any product or circuit described herein. Furthermore, this technical
information may not be considered as an assurance of component characteristics. No warranty or guarantee expressed
or implied is made regarding delivery, performance or suitability. This document supersedes and replaces all information
previously supplied and may be superseded by updates without further notice.
SEMIKRON products are not authorized for use in life support appliances and systems without the express written
approval by SEMIKRON.
6 2015-04-14 – Rev04 © by SEMIKRON