TDA7850中文资料_数据手册_参数-USB迷|专注于互联网分享

2024年10月30日发(作者：利斯乔)

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3Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.1Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.2Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.3Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.4Electrical characteristic curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

4.1SVR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

4.2Input stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

4.3Standby and muting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

4.4DC offset detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

4.5Heatsink definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5Package information . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . 15 6Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

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TDA7850List of tables List of tables

Table summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table te maximum

ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table l data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table ical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8 Table nt revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3/18

List of figures TDA7850 List of figures

Figure diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure rd test and

application circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure connection (top view) . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure /doc/

ponents and top copper layer of the Figure2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure copper layer Figure2. . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure ent current vs. supply voltage . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . 11 Figure power vs. supply voltage (R L = 4Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure

power vs. supply voltage (R L = 2Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure tion vs. output

power (R L = 4Ω). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure tion vs. output power (R L = 2Ω). . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure tion vs. frequency (R L = 4Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . 11 Figure tion vs. frequency (R L = 2Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure

alk vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure voltage rejection

vs. frequency. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure attenuation vs. supply voltage. . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure dissipation and efficiency vs. output power (R L = 4Ω, SINE) . . . . . . . . . . . .

. . . . . 12 Figure dissipation and efficiency vs. output power (R L = 2Ω, SINE) . . . . . . . . . . . . . . . . . 12 Figure

dissipation vs. output power (R L = 4Ω, audio program simulation). . . . . . . . . . . . . 13 Figure dissipation

vs. output power (R L = 2Ω, audio program simulation). . . . . . . . . . . . . 13 Figure R-ARM frequency response,

weighting filter for transient pop. . . . . . . . . . . . . . . . . . . 13 Figure att25 (vertical) mechanical data and package

dimensions. . . . . . . . . . . . . . . . . . . . 15 Figure att25 (horizontal) mechanical data and package dimensions. . . . . . . . .

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TDA7850Block diagram and application circuit

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1 Block diagram and application circuit

1.1 Block diagram

1.2 Standard test and application circuit

Pin description TDA7850

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2 Pin description

TDA7850Electrical specifications

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3 Electrical specifications

3.1

Absolute maximum ratings

3.2 Thermal data

Table 2.

Absolute maximum ratings

Symbol Parameter

Value Unit V S Operating supply voltage 18V V S (DC)DC supply voltage

28V V S (pk)Peak supply voltage (for t = 50 ms)50V I O Output peak current

repetitive (duty cycle 10 % at f = 10 Hz)non repetitive (t = 100 s)910A A P tot Power dissipation T case = 70 °C 80W T j

Junction temperature 150°C T stg

Storage temperature

-55 to 150

°C

Table 3.

Thermal data

Symbol Parameter

Value Unit R th j-case

Thermal resistance junction to case

Max.

°C/W

Electrical specifications TDA7850

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3.3 Electrical characteristics

Table 4.

Electrical characteristics

(Refer to the test and application diagram, V S = 14.4 V; R L = 4 Ω; R g = 600 Ω; f = 1 kHz;T amb = 25 °C; unless otherwise

specified).

Symbol Parameter

Test condition

Min. I q1Quiescent current R L = ∞

100

180

280mA V OS

Output offset voltage Play mode / Mute mode ±50mV dV OS

During mute ON/OFF output offset voltage

ITU R-ARM weighted see Figure 20

-10+10mV During Standby ON/OFF output offset voltage -10+10mV G v Voltage gain

27dB dG v

Channel gain unbalance

±1

P o Output power

V S = 13.2 V; THD = 10 %V S = 13.2 V; THD = 1 %V S = 14.4 V; THD = 10 %V S = 14.4 V; THD = 1 %23023W

V S = 14.4 V; THD = 10 %, 2 Ω

55W P o . output power (1)V S = 14.4 V; R L = 4 ΩV S = 14.4 V; R L = 2 Ω5085W THD

Distortion

P o = 4W

P o = 15W; R L = 2Ω0.0060.0150.020.03%e No Output noise "A" Weighted

Bw = 20 Hz to 20 kHz 35505070

µV SVR Supply voltage rejection f = 100 Hz; V r = 1Vrms 5075dB f ch High cut-off frequency P O = 0.5 W

100300KHz R i Input impedance 80

100120K ΩC T Cross talk

f = 1 kHz P O = 4 W f = 10 kHz P O = 4 W 607060

--dB I SB Standby current consumption V ST-BY = 1.5 V 20µA V ST-BY = 0 V

10I pin5ST -BY pin current

V ST-BY = 1.5 V to 3.5 V ±1µA V SB out Standby out threshold voltage (Amp: ON) 2.75

V V SB in Standby in threshold voltage (Amp: OFF) 1.5

V A M Mute attenuation

P Oref = 4 W 8090

dB V M out Mute out threshold voltage (Amp: Play) 3.5

V V M in

Mute in threshold voltage

(Amp: Mute)

1.5

TDA7850Electrical specifications

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V AM in V S automute threshold

(Amp: Mute)

Att ≥ 80 dB; P Oref = 4 W (Amp: Play)

Att < 0.1 dB; P O = 0. 5W 6.5

77.5

I pin23

Muting pin current

V MUTE = 1.5 V (Sourced Current)712

18µA V MUTE = 3.5 V

-5

µA

HSD section V dropout Dropout voltage I O = 0.35 A; V S = 9 to 16 V

0.25

0.6V I prot

Current limits

400

800

Offset detector (Pin 25)V M_ON Mute voltage for DC offset detection enabled

V ST-BY = 5 V

V V M_OFF 6

V V OFF Detected differential output offset V ST-BY = 5 V; V mute = 8 V ±2±3

±4V V 25_T Pin 25 voltage for detection = TRUE

V ST-BY = 5 V; V mute = 8 V V OFF > ±4 V

0 1.5

V V 25_F

Pin 25 Voltage for detection = FALSE

V ST-BY = 5 V; V mute = 8 V V OFF > ±2 V

ted square wave output.

Table 4.

Electrical characteristics (continued)

(Refer to the test and application diagram, V S = 14.4 V; R L = 4 Ω; R g = 600 Ω; f = 1 kHz;T amb = 25 °C; unless otherwise

specified).

Symbol

Parameter

Test condition

Min. .

Unit

Electrical specifications TDA7850

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Figure /doc/

ponents and top copper layer of the Figure

2. Figure copper layer Figure2.

TDA7850Electrical specifications

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3.4

Electrical characteristic curves

Figure 6.

Quiescent current vs. supply voltage

Figure 7.

Output power vs. supply voltage (R L = 4Ω)

Figure 8.

Output power vs. supply voltage (R L = 2Ω)

Figure 9.

Distortion vs. output power (R L = 4Ω)

Figure tion vs. output power

(R L = 2Ω)

Figure tion vs. frequency

(R L = 4Ω)

Electrical specifications TDA7850

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Figure tion vs. frequency

(R L = 2Ω)

Figure alk vs. frequency

Figure voltage rejection vs.

frequency

Figure attenuation vs. supply

voltage

Figure dissipation and efficiency

vs. output power (R L = 4Ω, SINE)

Figure dissipation and efficiency

vs. output power (R L = 2Ω, SINE)

TDA7850Electrical specifications

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Figure dissipation vs. output power (R L = 4Ω, audio program simulation)

Figure dissipation vs. output power

(R L = 2Ω, audio program simulation)

Figure R-ARM frequency response,

weighting filter for transient pop

Application hints TDA7850

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4 Application hints

Referred to the circuit of Figure 2.

4.1 SVR

Besides its contribution to the ripple rejection, the SVR capacitor governs the turn ON/OFF

time sequence and, consequently, plays an essential role in the pop optimization during ON/OFF transients. To conveniently

serve both needs, Its minimum recommended value is 10µF .

4.2 Input stage

The TDA7850's inputs are ground-compatible and can stand very high input signals (±

8Vpk) without any performance degradation.

If the standard value for the input capacitors (0.1µF) is adopted, the low frequency cut-off will amount to 16 Hz.

4.3 Standby and muting

Standby and Muting facilities are both CMOS compatible. In absence of true CMOS ports or

microprocessors, a direct connection to Vs of these two pins is admissible but a 470k equivalent resistance should be

present between the power supply and the muting and ST -BY pins.

R-C cells have always to be used in order to smooth down the transitions for preventing any audible transient noises.

About the standby, the time constant to be assigned in order to obtain a virtually pop-free transition has to be slower than 2.5

V/ms.

4.4 DC offset detector

The TDA7850 integrates a DC offset detector to avoid that an anomalous DC offset on the

inputs of the amplifier may be multiplied by the gain and result in a dangerous large offset on the outputs which may lead to

speakers damage for overheating. The feature is enabled by the MUTE pin (according to table 3) and works with the

amplifier unmuted and with no signal on the inputs.

The DC offset detection is signaled out on the HSD pin. To ensure the correct functionality of the Offset Detector it is

necessary to connect a pulldown 10 kW resistor between HSD and ground.

4.5 Heatsink definition

Under normal usage (4 Ohm speakers) the heatsink's thermal requirements have to be

deduced from Figure 18, which reports the simulated power dissipation when real

music/speech programmes are played out. Noise with gaussian-distributed amplitude was employed for this simulation.

Based on that, frequent clipping occurrence (worst-case) will cause P diss = 26 W. Assuming T amb = 70 °C and T CHIP =

150 °C as boundary conditions, the heatsink's thermal resistance should be approximately 2°C/W. This would avoid any

thermal shutdown occurrence even after long-term and full-volume operation.

TDA7850Package information

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5 Package information

In order to meet environmental requirements, ST (also) offers these devices in ECOPACK ?

packages. ECOPACK ? packages are lead-free. The category of second Level Interconnect is marked on the package and

on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions

are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: /doc/

Package information TDA7850

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TDA7850Revision history

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6 Revision history

Table 5.

Document revision history

Date Revision

Changes

22-Nov-20061Initial release.

27-Feb-20072Added Chapter 3.4: Electrical characteristic curves .

09-Oct-2007

Updated the values for the dV OS and I q1 parameters on the Table 4.

Added Figure 20 on page 13.

12-Sep-20084

Updated Figure 2: Standard test and application circuit .

Updated Section 4.4: DC offset detector and Section 4.3: Standby and muting .

Updated the values of V OS and THD parameters on the T able 4.07-Nov-20085Modified max. values of the THD distortion

in Table 4: Electrical characteristics on page 8.17-Sep-2013

Updated Disclaimer.

TDA7850

18/18Please Read Carefully:

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