2024年10月30日发(作者：明高明)
TDA7850
4 x 50 W MOSFET quad bridge power amplifier
Features
■
High output power capability:
– 4 x50 W/4 Ω max.
– 4 x30 W/4 Ω @ 14.4 V, 1 kHz, 10 %
– 4 x80 W/2 Ω max.
– 4 x55 W/2 Ω @ 14.4V, 1 kHz, 10 %
MOSFET output power stage
Excellent 2 Ω driving capability
Hi-Fi class distortion
Low output noise
ST-BY function
Mute function
Automute at min. supply voltage detection
Low external component count:
–Internally fixed gain (26 dB)
–No external compensation
–No bootstrap capacitors
On board 0.35 A high side driver
■
■
■
■
■
■
■
■
■
Flexiwatt25
(Vertical)
Flexiwatt25
(Horizontal)
■
Protections:
■
■
■
■
■
■
■
ESD
Output short circuit to gnd, to V
s
, across the
load
Very inductive loads
Overrating chip temperature with soft thermal
limiter
Output DC offset detection
Load dump voltage
Fortuitous open gnd
Reversed battery
Description
The TDA7850 is a breakthrough MOSFET
technology class AB audio power amplifier in
Flexiwatt 25 package designed for high power car
radio. The fully complementary P-Channel/N-
Channel output structure allows a rail to rail
output voltage swing which, combined with high
output current and minimized saturation losses
sets new power references in the car-radio field,
with unparalleled distortion performances.
The TDA7850 integrates a DC offset detector.
Table 1.
Device summary
Order code
TDA7850
TDA7850H
Package
Flexiwatt25 (Vertical)
Flexiwatt25 (Horizontal
Packing
Tube
Tube
November 2008 Rev 51/18
1
ContentsTDA7850
Contents
1Block diagram and application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1
1.2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Standard test and application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1
3.2
3.3
3.4
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical characteristic curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1
4.2
4.3
4.4
4.5
SVR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Input stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Standby and muting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
DC offset detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Heatsink definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5
6
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2/18
TDA7850List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3/18
List of figuresTDA7850
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Standard test and application circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Components and top copper layer of the Figure2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Bottom copper layer Figure2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Quiescent current vs. supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Output power vs. supply voltage (R
L
= 4Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Output power vs. supply voltage (R
L
= 2Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Distortion vs. output power (R
L
= 4Ω). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Distortion vs. output power (R
L
= 2Ω). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Distortion vs. frequency (R
L
= 4Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Distortion vs. frequency (R
L
= 2Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Crosstalk vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Supply voltage rejection vs. frequency. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Output attenuation vs. supply voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Power dissipation and efficiency vs. output power (R
L
= 4Ω, SINE) . . . . . . . . . . . . . . . . . 12
Power dissipation and efficiency vs. output power (R
L
= 2Ω, SINE) . . . . . . . . . . . . . . . . . 12
Power dissipation vs. output power (R
L
= 4Ω, audio program simulation). . . . . . . . . . . . . 13
Power dissipation vs. output power (R
L
= 2Ω, audio program simulation). . . . . . . . . . . . . 13
ITU R-ARM frequency response, weighting filter for transient pop. . . . . . . . . . . . . . . . . . . 13
Flexiwatt25 (vertical) mechanical data and package dimensions. . . . . . . . . . . . . . . . . . . . 15
Flexiwatt25 (horizontal) mechanical data and package dimensions. . . . . . . . . . . . . . . . . . 16
4/18
TDA7850Block diagram and application circuit
1 Block diagram and application circuit
1.1 Block diagram
Figure diagram
Vcc1
ST-BY
MUTE
IN1
0.1μF
HSDHSD/V
OFF_DET
OUT1+
OUT1-
PW-GND
OUT2+
IN2
0.1μF
OUT2-
PW-GND
OUT3+
IN3
0.1μF
OUT3-
PW-GND
OUT4+
IN4
0.1μF
AC-GND
0.47μF
SVR
47μF
D94AU158D
Vcc2
470μF100nF
OUT4-
PW-GND
TABS-GND
1.2 Standard test and application circuit
Figure rd test and application circuit
C8
0.1μF
C7
2200μF
Vcc1-2
R1
ST-BY
10K
MUTE
R2
47K
C1
IN1
0.1μF
IN2
C2 0.1μF
IN3
C3 0.1μF
IN4
C4 0.1μF
S-GND
14
13
16
C5
0.47μF
SVR
C6
47μF
1025
HSD/OD
R3
*)
Vcc3-4
620
9
8
OUT1
7
5
4
C9
1μF
22
C10
1μF
11
2
3
17
18
OUT2
12
OUT3
15
19
21
24
23
1
TAB
OUT4
*) R3 = 10kΩ to be placed when pin 25 is used as offset detector.
D95AU335C
5/18
Pin descriptionTDA7850
2 Pin description
Figure connection (top view)
TAB
P-GND2
OUT2-
ST-BY
OUT2+
V
CC
OUT1-
P-GND1
OUT1+
SVR
IN1
IN2
S-GND
IN4
IN3
AC-GND
OUT3+
P-GND3
OUT3-
V
CC
OUT4+
MUTE
OUT4-
P-GND4
HSD25
D94AU159A
1
Vertical
TAB
P-GND2
OUT2-
ST-BY
OUT2+
V
CC
OUT1-
P-GND1
OUT1+
SVR
IN1
IN2
S-GND
IN4
IN3
AC-GND
OUT3+
P-GND3
OUT3-
V
CC
OUT4+
MUTE
OUT4-
P-GND4
HSD
1
Horizontal
25
D06AU1655
6/18
TDA7850Electrical specifications
3 Electrical specifications
3.1 Absolute maximum ratings
Table 2.
Symbol
V
S
V
S (DC)
V
S (pk)
I
O
P
tot
T
j
T
stg
Absolute maximum ratings
Parameter
Operating supply voltage
DC supply voltage
Peak supply voltage (for t = 50 ms)
Output peak current
repetitive (duty cycle 10 % at f = 10 Hz)
non repetitive (t = 100 μs)
Power dissipation T
case
= 70 °C
Junction temperature
Storage temperature
Value
18
28
50
9
10
80
150
-55 to 150
Unit
V
V
V
A
A
W
°C
°C
3.2 Thermal data
Table 3.
Symbol
R
th j-case
Thermal data
Parameter
Thermal resistance junction to caseMax.
Value
1
Unit
°C/W
7/18
Electrical specificationsTDA7850
3.3 Electrical characteristics
Table ical characteristics
(Refer to the test and application diagram, V
S
= 14.4 V; R
L
= 4 Ω; R
g
= 600 Ω; f = 1 kHz;
T
amb
= 25 °C; unless otherwise specified).
Parameter
Quiescent current
Output offset voltage
During mute ON/OFF output
offset voltage
During Standby ON/OFF output
offset voltage
Voltage gain
Channel gain unbalance
V
S
= 13.2 V; THD = 10 %
V
S
= 13.2 V; THD = 1 %
V
S
= 14.4 V; THD = 10 %
V
S
= 14.4 V; THD = 1 %
V
S
= 14.4 V; THD = 10 %, 2 Ω
P
o max.
THD
Max. output power
(1)
Distortion
V
S
= 14.4 V; R
L
= 4 Ω
V
S
= 14.4 V; R
L
= 2 Ω
P
o
= 4W
P
o
= 15W; R
L
= 2Ω
"A" Weighted
Bw = 20 Hz to 20 kHz
f = 100 Hz; V
r
= 1Vrms
P
O
= 0.5 W
50
100
80
f = 1 kHz P
O
= 4 W
f = 10 kHz P
O
= 4 W
V
ST-BY
= 1.5 V
V
ST-BY
= 0 V
V
ST-BY
= 1.5 V to 3.5 V
(Amp: ON)
(Amp: OFF)
P
Oref
= 4 W
(Amp: Play)
(Amp: Mute)
80
3.5
1.5
90
2.75
1.5
60
23
16
28
20
50
25
19
30
23
55
50
85
0.006
0.015
35
50
75
300
100
70
60
120
-
-
20
10
±1
0.02
0.03
50
70
R
L
= ∞
Play mode / Mute mode
ITU R-ARM weighted
see Figure20
-10
-10
2526
Test conditionMin.
100
Typ.
180
Max.
280
±50
+10
+10
27
±1
Unit
mA
mV
mV
mV
dB
dB
Symbol
I
q1
V
OS
dV
OS
G
v
dG
v
P
o
Output power
W
W
W
%
μV
dB
KHz
KΩ
dB
μA
μA
V
V
dB
V
V
e
No
Output noise
SVR
f
ch
R
i
C
T
I
SB
I
pin5
V
SB out
V
SB in
A
M
V
M out
V
M in
Supply voltage rejection
High cut-off frequency
Input impedance
Cross talk
Standby current consumption
ST-BY pin current
Standby out threshold voltage
Standby in threshold voltage
Mute attenuation
Mute out threshold voltage
Mute in threshold voltage
8/18
TDA7850
Table 4.
Electrical specifications
Electrical characteristics (continued)
(Refer to the test and application diagram, V
S
= 14.4 V; R
L
= 4 Ω; R
g
= 600 Ω; f = 1 kHz;
T
amb
= 25 °C; unless otherwise specified).
ParameterTest condition
(Amp: Mute)
Att
≥
80 dB; P
Oref
= 4 W
(Amp: Play)
Att < 0.1 dB; P
O
= 0. 5W
V
MUTE
= 1.5 V
(Sourced Current)
V
MUTE
= 3.5 V
Min.
6.5
Typ.
7
7.5
7
-5
12
8
18
18
μA
μA
mbol
V
AM in
V
S
automute threshold
V
I
pin23
Muting pin current
HSD section
V
dropout
I
prot
Dropout voltage
Current limits
I
O
= 0.35 A; V
S
= 9 to 16 V
400
0.250.6
800
V
mA
Offset detector (Pin 25)
V
M_ON
V
M_OFF
V
OFF
V
25_T
V
25_F
Mute voltage for DC offset
detection enabled
V
ST-BY
= 5 V
8
6
±2
0
12
±3±4
1.5
V
V
V
V
V
Detected differential output offsetV
ST-BY
= 5 V; V
mute
= 8 V
Pin 25 voltage for detection =
TRUE
Pin 25 Voltage for detection =
FALSE
V
ST-BY
= 5 V; V
mute
= 8 V
V
OFF
> ±4 V
V
ST-BY
= 5 V; V
mute
= 8 V
V
OFF
> ±2 V
ted square wave output.
9/18
Electrical specifications
Figure ents and top copper layer of the Figure2.
TDA7850
Figure copper layer Figure2.
10/18
TDA7850Electrical specifications
3.4
Figure 6.
Electrical characteristic curves
Quiescent current vs. supply
voltage
Figure 7.
Output power vs. supply voltage
(R
L
= 4Ω)
200
190
180
170
160
150
140
130
120
110
100
I
d
(mA)
V
i
= 0
R
L
=
∞
P
o
(W)
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
THD= 1%
R
L
= 4Ω
f = 1 KHz
Po-max
THD= 10%
81012
V
s
(V)
141618
AC00064
8910111213
V
s
(V)
1415161718
AC00064
Figure 8.
Output power vs. supply voltage
(R
L
= 2Ω)
Figure 9.
Distortion vs. output power
(R
L
= 4Ω)
P
o
(W)
130
120
110
100
90
80
70
60
50
40
30
20
10
0
8910111213
V
s
(V)
1415161718
AC00066
THD (%)
10
R
L
= 2Ω
f = 1 KHz
Po-max
V
S
= 14.4 V
R
L
= 4Ω
1
THD=10%
f = 10 KHz
0.1
THD=1%
0.01
f = 1 KHz
0.001
0.11
P
o
(W)
10100
AC00067
Figure tion vs. output power
(R
L
= 2Ω)
Figure tion vs. frequency
(R
L
= 4Ω)
THD (%)
10
V
S
= 14.4 V
R
L
= 2Ω
1
f = 10 KHz
0.1
10
THD (%)
1
V
S
= 14.4 V
R
L
= 4Ω
P
o
= 4 W
0.1
f = 1 KHz
0.01
0.01
0.001
0.1
0.001
1
P
o
(W)
10100
AC00068
101001000
f (Hz)
1
AC00069
11/18
Electrical specificationsTDA7850
Figure tion vs. frequency
(R
L
= 2Ω)
Figure alk vs. frequency
10
THD (%)
-20
-30
-40
-50
CROSSTALK (dB)
1
V
S
= 14.4 V
R
L
= 2Ω
P
o
= 8 W
R
L
= 4Ω
P
o
= 4 W
R
g
= 600Ω
0.1
-60
-70
0.01
-80
-90
0.001
101001000
f (Hz)
1
AC00070
-100
101001000
f (Hz)
1
AC00071
Figure voltage rejection vs.
frequency
Figure attenuation vs. supply
voltage
-20
-30
-40
-50
-60
-70
-80
SVR (dB)
R
g
= 600Ω
Vripple = 1 Vrms
OUTPUT ATTN (dB)
0
R
L
= 4Ω
P
o
= 4 W ref
-20
-40
-60
-80
-90
-100
101001000
f (Hz)
1
AC00072
-100
567
Vs (V)
8910
AC00073
Figure dissipation and efficiency
vs. output power (R
L
= 4Ω, SINE)
Figure dissipation and efficiency
vs. output power (R
L
= 2Ω, SINE)
90
80
70
60
50
40
P
tot
(W)
η
V
S
= 14.4 V
R
L
= 4 x 4Ω
f = 1 KHz SINE
η
(%)
Ptot (W)
90
80
70
60
50
180
160
140
120
100
80
60
40
20
0
P
o
(W)
30354045
P
tot
V
S
= 14.4 V
R
L
= 4 x 2Ω
f = 1 KHz SINE
η
η
(%)
90
80
70
60
50
40
30
20
10
0
P
tot
30
20
10
0
P
o
(W)
16182
40
30
20
10
0
5055
AC00075
AC00074
12/18
TDA7850Electrical specifications
Figure dissipation vs. output power Figure dissipation vs. output power
(R
L
= 4Ω, audio program simulation)
(R
L
= 2Ω, audio program simulation)
30
P
tot
(W)
V
S
= 13.2 V
4 x 4Ω
R
L
=
GAUSSIAN NOISE
CLIP START
60
55
50
45
P
tot
(W)
V
S
= 13.2 V
R
L
= 4 x 2Ω
GAUSSIAN NOISE
CLIP START
25
20
40
35
30
15
25
20
10
15
10
5
0123
P
o
(W)
456
AC00076
5
024
P
o
(W)
6810
AC00077
Figure R-ARM frequency response,
weighting filter for transient pop
Output attenuation (dB)
10
0
-10
-20
-30
-40
-50
101001000
Hz
1
AC00343
13/18
Application hintsTDA7850
4 Application hints
Referred to the circuit of Figure2.
4.1 SVR
Besides its contribution to the ripple rejection, the SVR capacitor governs the turn ON/OFF
time sequence and, consequently, plays an essential role in the pop optimization during
ON/OFF transients. To conveniently serve both needs, Its minimum recommended value
is 10µF.
4.2 Input stage
The TDA7850's inputs are ground-compatible and can stand very high input signals (±
8Vpk) without any performance degradation.
If the standard value for the input capacitors (0.1µF) is adopted, the low frequency cut-off
will amount to 16 Hz.
4.3 Standby and muting
Standby and Muting facilities are both CMOS compatible. In absence of true CMOS ports or
microprocessors, a direct connection to Vs of these two pins is admissible but a 470kΩ
equivalent resistance should be present between the power supply and the muting and
ST-BY pins.
R-C cells have always to be used in order to smooth down the transitions for preventing any
audible transient noises.
About the standby, the time constant to be assigned in order to obtain a virtually pop-free
transition has to be slower than 2.5 V/ms.
4.4 DC offset detector
The TDA7850 integrates a DC offset detector to avoid that an anomalous DC offset on the
inputs of the amplifier may be multiplied by the gain and result in a dangerous large offset on
the outputs which may lead to speakers damage for overheating. The feature is enabled by
the MUTE pin (according to table 3) and works with the amplifier unmuted and with no signal
on the inputs.
The DC offset detection is signaled out on the HSD pin. To ensure the correct functionality of
the Offset Detector it is necessary to connect a pulldown 10 kW resistor between HSD and
ground.
4.5 Heatsink definition
Under normal usage (4 Ohm speakers) the heatsink's thermal requirements have to be
deduced from Figure18, which reports the simulated power dissipation when real
music/speech programmes are played out. Noise with gaussian-distributed amplitude was
employed for this simulation. Based on that, frequent clipping occurrence (worst-case) will
cause P
diss
= 26 W. Assuming T
amb
= 70 °C and T
CHIP
= 150 °C as boundary conditions, the
heatsink's thermal resistance should be approximately 2°C/W. This would avoid any thermal
shutdown occurrence even after long-term and full-volume operation.
14/18
TDA7850Package information
5 Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK
®
packages. ECOPACK
®
packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: .
Figure att25 (vertical) mechanical data and package dimensions
DIM.
A
B
C
D0.751.050.029
E0.370.420.014
F (1)0.57
G0.801.001.200.031
G123.7524.0024.250.935
H (2)28.9029.2329.301.139
H117.00
H212.80
H30.80
L (2)22.0722.4722.870.869
L118.5718.9719.370.731
L2 (2)15.5015.7015.900.610
L37.707.857.950.303
L45
L53.5
M3.704.004.300.145
M13.604.004.400.142
N2.20
O2
R1.70
R10.5
R20.3
R31.25
R40.50
V 5˚(Tp.)
V13˚ (Typ.)
V220˚ (Typ.)
V345˚ (Typ.)
(1): dam-bar protusion not included
(2): molding protusion included
MIN.
4.45
1.80
mm
TYP.
4.50
1.90
1.40
0.90
0.39
MAX.
4.65
2.00
MIN.
0.175
0.070
inch
TYP.
0.177
0.074
0.055
0.035
0.015
0.040
0.945
1.150
0.669
0.503
0.031
0.884
0.747
0.618
0.309
0.197
0.138
0.157
0.157
0.086
0.079
0.067
0.02
0.12
0.049
0.019
MAX.
0.183
0.079
0.041
0.016
0.022
0.047
0.955
1.153
OUTLINE AND
MECHANICAL DATA
0.904
0.762
0.626
0.313
0.169
0.173
Flexiwatt25 (vertical)
V
C
B
V
V3
H3
H
H1
H2
R3
R4
V1
R2
R
LL1
A
L
4
O
L
2
N
L
3
V1
V2
D
R1R1
E
G
G1
F
R2
L5
R1
Pin 1
MM1
7034862
15/18
Package informationTDA7850
Figure att25 (horizontal) mechanical data and package dimensions
DIM.
A
B
C
D
E0.370.420.014
F (1)0.57
G0.751.001.250.029
G123.7024.0024.300.933
H (2)28.9029.2329.301.139
H117.00
H212.80
H30.80
L (2)21.6422.0422.440.852
L110.1510.510.850.40
L2 (2)15.5015.7015.900.610
L37.707.857.950.303
L45
L55.155.455.850.203
L61.801.952.100.070
M2.753.003.500.108
M14.73
M25.61
N2.20
P3.203.503.800.126
R1.70
R10.50
R20.30
R31.25
R40.50
V 5˚(Typ.)
V13˚ (Typ.)
V220˚ (Typ.)
V345˚ (Typ.)
MIN.
4.45
1.80
mm
TYP.
4.50
1.90
1.40
2.00
0.39
MAX.
4.65
2.00
MIN.
0.175
0.070
inch
TYP.
0.177
0.074
0.055
0.079
0.015
0.040
0.945
1.150
0.669
0.503
0.031
0.868
0.413
0.618
0.309
0.197
0.214
0.077
0.118
0.186
0.220
0.086
0.138
0.067
0.02
0.12
0.049
0.02
MAX.
0.183
0.079
0.016
0.022
0.049
0.957
1.153
OUTLINE AND
MECHANICAL DATA
0.883
0.427
0.626
0.313
0.23
0.083
0.138
0.15
Flexiwatt25
(Horizontal)
(1): dam-bar protusion not included; (2): molding protusionincluded
7399733 A
16/18
TDA7850Revision history
6 Revision history
Table 5.
Date
22-Nov-2006
27-Feb-2007
09-Oct-2007
Document revision history
Revision
1
2
3
Initial release.
Added Chapter3.4: Electrical characteristic curves.
Updated the values for the dV
OS
and I
q1
parameters on the Table4.
Added Figure20 on page13.
Updated Figure2: Standard test and application circuit.
Updated Section4.4: DC offset detector and Section4.3: Standby
and muting.
Updated the values of V
OS
and THD parameters on the Table4.
Modified max. values of the THD distortion in Table4: Electrical
characteristics on page8.
Changes
12-Sep-20084
07-Nov-20085
17/18
TDA7850
Please Read Carefully:
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right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
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Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
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STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
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18/18
2024年10月30日发(作者：明高明)
TDA7850
4 x 50 W MOSFET quad bridge power amplifier
Features
■
High output power capability:
– 4 x50 W/4 Ω max.
– 4 x30 W/4 Ω @ 14.4 V, 1 kHz, 10 %
– 4 x80 W/2 Ω max.
– 4 x55 W/2 Ω @ 14.4V, 1 kHz, 10 %
MOSFET output power stage
Excellent 2 Ω driving capability
Hi-Fi class distortion
Low output noise
ST-BY function
Mute function
Automute at min. supply voltage detection
Low external component count:
–Internally fixed gain (26 dB)
–No external compensation
–No bootstrap capacitors
On board 0.35 A high side driver
■
■
■
■
■
■
■
■
■
Flexiwatt25
(Vertical)
Flexiwatt25
(Horizontal)
■
Protections:
■
■
■
■
■
■
■
ESD
Output short circuit to gnd, to V
s
, across the
load
Very inductive loads
Overrating chip temperature with soft thermal
limiter
Output DC offset detection
Load dump voltage
Fortuitous open gnd
Reversed battery
Description
The TDA7850 is a breakthrough MOSFET
technology class AB audio power amplifier in
Flexiwatt 25 package designed for high power car
radio. The fully complementary P-Channel/N-
Channel output structure allows a rail to rail
output voltage swing which, combined with high
output current and minimized saturation losses
sets new power references in the car-radio field,
with unparalleled distortion performances.
The TDA7850 integrates a DC offset detector.
Table 1.
Device summary
Order code
TDA7850
TDA7850H
Package
Flexiwatt25 (Vertical)
Flexiwatt25 (Horizontal
Packing
Tube
Tube
November 2008 Rev 51/18
1
ContentsTDA7850
Contents
1Block diagram and application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1
1.2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Standard test and application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1
3.2
3.3
3.4
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical characteristic curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1
4.2
4.3
4.4
4.5
SVR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Input stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Standby and muting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
DC offset detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Heatsink definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5
6
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2/18
TDA7850List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3/18
List of figuresTDA7850
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Standard test and application circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Components and top copper layer of the Figure2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Bottom copper layer Figure2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Quiescent current vs. supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Output power vs. supply voltage (R
L
= 4Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Output power vs. supply voltage (R
L
= 2Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Distortion vs. output power (R
L
= 4Ω). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Distortion vs. output power (R
L
= 2Ω). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Distortion vs. frequency (R
L
= 4Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Distortion vs. frequency (R
L
= 2Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Crosstalk vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Supply voltage rejection vs. frequency. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Output attenuation vs. supply voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Power dissipation and efficiency vs. output power (R
L
= 4Ω, SINE) . . . . . . . . . . . . . . . . . 12
Power dissipation and efficiency vs. output power (R
L
= 2Ω, SINE) . . . . . . . . . . . . . . . . . 12
Power dissipation vs. output power (R
L
= 4Ω, audio program simulation). . . . . . . . . . . . . 13
Power dissipation vs. output power (R
L
= 2Ω, audio program simulation). . . . . . . . . . . . . 13
ITU R-ARM frequency response, weighting filter for transient pop. . . . . . . . . . . . . . . . . . . 13
Flexiwatt25 (vertical) mechanical data and package dimensions. . . . . . . . . . . . . . . . . . . . 15
Flexiwatt25 (horizontal) mechanical data and package dimensions. . . . . . . . . . . . . . . . . . 16
4/18
TDA7850Block diagram and application circuit
1 Block diagram and application circuit
1.1 Block diagram
Figure diagram
Vcc1
ST-BY
MUTE
IN1
0.1μF
HSDHSD/V
OFF_DET
OUT1+
OUT1-
PW-GND
OUT2+
IN2
0.1μF
OUT2-
PW-GND
OUT3+
IN3
0.1μF
OUT3-
PW-GND
OUT4+
IN4
0.1μF
AC-GND
0.47μF
SVR
47μF
D94AU158D
Vcc2
470μF100nF
OUT4-
PW-GND
TABS-GND
1.2 Standard test and application circuit
Figure rd test and application circuit
C8
0.1μF
C7
2200μF
Vcc1-2
R1
ST-BY
10K
MUTE
R2
47K
C1
IN1
0.1μF
IN2
C2 0.1μF
IN3
C3 0.1μF
IN4
C4 0.1μF
S-GND
14
13
16
C5
0.47μF
SVR
C6
47μF
1025
HSD/OD
R3
*)
Vcc3-4
620
9
8
OUT1
7
5
4
C9
1μF
22
C10
1μF
11
2
3
17
18
OUT2
12
OUT3
15
19
21
24
23
1
TAB
OUT4
*) R3 = 10kΩ to be placed when pin 25 is used as offset detector.
D95AU335C
5/18
Pin descriptionTDA7850
2 Pin description
Figure connection (top view)
TAB
P-GND2
OUT2-
ST-BY
OUT2+
V
CC
OUT1-
P-GND1
OUT1+
SVR
IN1
IN2
S-GND
IN4
IN3
AC-GND
OUT3+
P-GND3
OUT3-
V
CC
OUT4+
MUTE
OUT4-
P-GND4
HSD25
D94AU159A
1
Vertical
TAB
P-GND2
OUT2-
ST-BY
OUT2+
V
CC
OUT1-
P-GND1
OUT1+
SVR
IN1
IN2
S-GND
IN4
IN3
AC-GND
OUT3+
P-GND3
OUT3-
V
CC
OUT4+
MUTE
OUT4-
P-GND4
HSD
1
Horizontal
25
D06AU1655
6/18
TDA7850Electrical specifications
3 Electrical specifications
3.1 Absolute maximum ratings
Table 2.
Symbol
V
S
V
S (DC)
V
S (pk)
I
O
P
tot
T
j
T
stg
Absolute maximum ratings
Parameter
Operating supply voltage
DC supply voltage
Peak supply voltage (for t = 50 ms)
Output peak current
repetitive (duty cycle 10 % at f = 10 Hz)
non repetitive (t = 100 μs)
Power dissipation T
case
= 70 °C
Junction temperature
Storage temperature
Value
18
28
50
9
10
80
150
-55 to 150
Unit
V
V
V
A
A
W
°C
°C
3.2 Thermal data
Table 3.
Symbol
R
th j-case
Thermal data
Parameter
Thermal resistance junction to caseMax.
Value
1
Unit
°C/W
7/18
Electrical specificationsTDA7850
3.3 Electrical characteristics
Table ical characteristics
(Refer to the test and application diagram, V
S
= 14.4 V; R
L
= 4 Ω; R
g
= 600 Ω; f = 1 kHz;
T
amb
= 25 °C; unless otherwise specified).
Parameter
Quiescent current
Output offset voltage
During mute ON/OFF output
offset voltage
During Standby ON/OFF output
offset voltage
Voltage gain
Channel gain unbalance
V
S
= 13.2 V; THD = 10 %
V
S
= 13.2 V; THD = 1 %
V
S
= 14.4 V; THD = 10 %
V
S
= 14.4 V; THD = 1 %
V
S
= 14.4 V; THD = 10 %, 2 Ω
P
o max.
THD
Max. output power
(1)
Distortion
V
S
= 14.4 V; R
L
= 4 Ω
V
S
= 14.4 V; R
L
= 2 Ω
P
o
= 4W
P
o
= 15W; R
L
= 2Ω
"A" Weighted
Bw = 20 Hz to 20 kHz
f = 100 Hz; V
r
= 1Vrms
P
O
= 0.5 W
50
100
80
f = 1 kHz P
O
= 4 W
f = 10 kHz P
O
= 4 W
V
ST-BY
= 1.5 V
V
ST-BY
= 0 V
V
ST-BY
= 1.5 V to 3.5 V
(Amp: ON)
(Amp: OFF)
P
Oref
= 4 W
(Amp: Play)
(Amp: Mute)
80
3.5
1.5
90
2.75
1.5
60
23
16
28
20
50
25
19
30
23
55
50
85
0.006
0.015
35
50
75
300
100
70
60
120
-
-
20
10
±1
0.02
0.03
50
70
R
L
= ∞
Play mode / Mute mode
ITU R-ARM weighted
see Figure20
-10
-10
2526
Test conditionMin.
100
Typ.
180
Max.
280
±50
+10
+10
27
±1
Unit
mA
mV
mV
mV
dB
dB
Symbol
I
q1
V
OS
dV
OS
G
v
dG
v
P
o
Output power
W
W
W
%
μV
dB
KHz
KΩ
dB
μA
μA
V
V
dB
V
V
e
No
Output noise
SVR
f
ch
R
i
C
T
I
SB
I
pin5
V
SB out
V
SB in
A
M
V
M out
V
M in
Supply voltage rejection
High cut-off frequency
Input impedance
Cross talk
Standby current consumption
ST-BY pin current
Standby out threshold voltage
Standby in threshold voltage
Mute attenuation
Mute out threshold voltage
Mute in threshold voltage
8/18
TDA7850
Table 4.
Electrical specifications
Electrical characteristics (continued)
(Refer to the test and application diagram, V
S
= 14.4 V; R
L
= 4 Ω; R
g
= 600 Ω; f = 1 kHz;
T
amb
= 25 °C; unless otherwise specified).
ParameterTest condition
(Amp: Mute)
Att
≥
80 dB; P
Oref
= 4 W
(Amp: Play)
Att < 0.1 dB; P
O
= 0. 5W
V
MUTE
= 1.5 V
(Sourced Current)
V
MUTE
= 3.5 V
Min.
6.5
Typ.
7
7.5
7
-5
12
8
18
18
μA
μA
mbol
V
AM in
V
S
automute threshold
V
I
pin23
Muting pin current
HSD section
V
dropout
I
prot
Dropout voltage
Current limits
I
O
= 0.35 A; V
S
= 9 to 16 V
400
0.250.6
800
V
mA
Offset detector (Pin 25)
V
M_ON
V
M_OFF
V
OFF
V
25_T
V
25_F
Mute voltage for DC offset
detection enabled
V
ST-BY
= 5 V
8
6
±2
0
12
±3±4
1.5
V
V
V
V
V
Detected differential output offsetV
ST-BY
= 5 V; V
mute
= 8 V
Pin 25 voltage for detection =
TRUE
Pin 25 Voltage for detection =
FALSE
V
ST-BY
= 5 V; V
mute
= 8 V
V
OFF
> ±4 V
V
ST-BY
= 5 V; V
mute
= 8 V
V
OFF
> ±2 V
ted square wave output.
9/18
Electrical specifications
Figure ents and top copper layer of the Figure2.
TDA7850
Figure copper layer Figure2.
10/18
TDA7850Electrical specifications
3.4
Figure 6.
Electrical characteristic curves
Quiescent current vs. supply
voltage
Figure 7.
Output power vs. supply voltage
(R
L
= 4Ω)
200
190
180
170
160
150
140
130
120
110
100
I
d
(mA)
V
i
= 0
R
L
=
∞
P
o
(W)
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
THD= 1%
R
L
= 4Ω
f = 1 KHz
Po-max
THD= 10%
81012
V
s
(V)
141618
AC00064
8910111213
V
s
(V)
1415161718
AC00064
Figure 8.
Output power vs. supply voltage
(R
L
= 2Ω)
Figure 9.
Distortion vs. output power
(R
L
= 4Ω)
P
o
(W)
130
120
110
100
90
80
70
60
50
40
30
20
10
0
8910111213
V
s
(V)
1415161718
AC00066
THD (%)
10
R
L
= 2Ω
f = 1 KHz
Po-max
V
S
= 14.4 V
R
L
= 4Ω
1
THD=10%
f = 10 KHz
0.1
THD=1%
0.01
f = 1 KHz
0.001
0.11
P
o
(W)
10100
AC00067
Figure tion vs. output power
(R
L
= 2Ω)
Figure tion vs. frequency
(R
L
= 4Ω)
THD (%)
10
V
S
= 14.4 V
R
L
= 2Ω
1
f = 10 KHz
0.1
10
THD (%)
1
V
S
= 14.4 V
R
L
= 4Ω
P
o
= 4 W
0.1
f = 1 KHz
0.01
0.01
0.001
0.1
0.001
1
P
o
(W)
10100
AC00068
101001000
f (Hz)
1
AC00069
11/18
Electrical specificationsTDA7850
Figure tion vs. frequency
(R
L
= 2Ω)
Figure alk vs. frequency
10
THD (%)
-20
-30
-40
-50
CROSSTALK (dB)
1
V
S
= 14.4 V
R
L
= 2Ω
P
o
= 8 W
R
L
= 4Ω
P
o
= 4 W
R
g
= 600Ω
0.1
-60
-70
0.01
-80
-90
0.001
101001000
f (Hz)
1
AC00070
-100
101001000
f (Hz)
1
AC00071
Figure voltage rejection vs.
frequency
Figure attenuation vs. supply
voltage
-20
-30
-40
-50
-60
-70
-80
SVR (dB)
R
g
= 600Ω
Vripple = 1 Vrms
OUTPUT ATTN (dB)
0
R
L
= 4Ω
P
o
= 4 W ref
-20
-40
-60
-80
-90
-100
101001000
f (Hz)
1
AC00072
-100
567
Vs (V)
8910
AC00073
Figure dissipation and efficiency
vs. output power (R
L
= 4Ω, SINE)
Figure dissipation and efficiency
vs. output power (R
L
= 2Ω, SINE)
90
80
70
60
50
40
P
tot
(W)
η
V
S
= 14.4 V
R
L
= 4 x 4Ω
f = 1 KHz SINE
η
(%)
Ptot (W)
90
80
70
60
50
180
160
140
120
100
80
60
40
20
0
P
o
(W)
30354045
P
tot
V
S
= 14.4 V
R
L
= 4 x 2Ω
f = 1 KHz SINE
η
η
(%)
90
80
70
60
50
40
30
20
10
0
P
tot
30
20
10
0
P
o
(W)
16182
40
30
20
10
0
5055
AC00075
AC00074
12/18
TDA7850Electrical specifications
Figure dissipation vs. output power Figure dissipation vs. output power
(R
L
= 4Ω, audio program simulation)
(R
L
= 2Ω, audio program simulation)
30
P
tot
(W)
V
S
= 13.2 V
4 x 4Ω
R
L
=
GAUSSIAN NOISE
CLIP START
60
55
50
45
P
tot
(W)
V
S
= 13.2 V
R
L
= 4 x 2Ω
GAUSSIAN NOISE
CLIP START
25
20
40
35
30
15
25
20
10
15
10
5
0123
P
o
(W)
456
AC00076
5
024
P
o
(W)
6810
AC00077
Figure R-ARM frequency response,
weighting filter for transient pop
Output attenuation (dB)
10
0
-10
-20
-30
-40
-50
101001000
Hz
1
AC00343
13/18
Application hintsTDA7850
4 Application hints
Referred to the circuit of Figure2.
4.1 SVR
Besides its contribution to the ripple rejection, the SVR capacitor governs the turn ON/OFF
time sequence and, consequently, plays an essential role in the pop optimization during
ON/OFF transients. To conveniently serve both needs, Its minimum recommended value
is 10µF.
4.2 Input stage
The TDA7850's inputs are ground-compatible and can stand very high input signals (±
8Vpk) without any performance degradation.
If the standard value for the input capacitors (0.1µF) is adopted, the low frequency cut-off
will amount to 16 Hz.
4.3 Standby and muting
Standby and Muting facilities are both CMOS compatible. In absence of true CMOS ports or
microprocessors, a direct connection to Vs of these two pins is admissible but a 470kΩ
equivalent resistance should be present between the power supply and the muting and
ST-BY pins.
R-C cells have always to be used in order to smooth down the transitions for preventing any
audible transient noises.
About the standby, the time constant to be assigned in order to obtain a virtually pop-free
transition has to be slower than 2.5 V/ms.
4.4 DC offset detector
The TDA7850 integrates a DC offset detector to avoid that an anomalous DC offset on the
inputs of the amplifier may be multiplied by the gain and result in a dangerous large offset on
the outputs which may lead to speakers damage for overheating. The feature is enabled by
the MUTE pin (according to table 3) and works with the amplifier unmuted and with no signal
on the inputs.
The DC offset detection is signaled out on the HSD pin. To ensure the correct functionality of
the Offset Detector it is necessary to connect a pulldown 10 kW resistor between HSD and
ground.
4.5 Heatsink definition
Under normal usage (4 Ohm speakers) the heatsink's thermal requirements have to be
deduced from Figure18, which reports the simulated power dissipation when real
music/speech programmes are played out. Noise with gaussian-distributed amplitude was
employed for this simulation. Based on that, frequent clipping occurrence (worst-case) will
cause P
diss
= 26 W. Assuming T
amb
= 70 °C and T
CHIP
= 150 °C as boundary conditions, the
heatsink's thermal resistance should be approximately 2°C/W. This would avoid any thermal
shutdown occurrence even after long-term and full-volume operation.
14/18
TDA7850Package information
5 Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK
®
packages. ECOPACK
®
packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: .
Figure att25 (vertical) mechanical data and package dimensions
DIM.
A
B
C
D0.751.050.029
E0.370.420.014
F (1)0.57
G0.801.001.200.031
G123.7524.0024.250.935
H (2)28.9029.2329.301.139
H117.00
H212.80
H30.80
L (2)22.0722.4722.870.869
L118.5718.9719.370.731
L2 (2)15.5015.7015.900.610
L37.707.857.950.303
L45
L53.5
M3.704.004.300.145
M13.604.004.400.142
N2.20
O2
R1.70
R10.5
R20.3
R31.25
R40.50
V 5˚(Tp.)
V13˚ (Typ.)
V220˚ (Typ.)
V345˚ (Typ.)
(1): dam-bar protusion not included
(2): molding protusion included
MIN.
4.45
1.80
mm
TYP.
4.50
1.90
1.40
0.90
0.39
MAX.
4.65
2.00
MIN.
0.175
0.070
inch
TYP.
0.177
0.074
0.055
0.035
0.015
0.040
0.945
1.150
0.669
0.503
0.031
0.884
0.747
0.618
0.309
0.197
0.138
0.157
0.157
0.086
0.079
0.067
0.02
0.12
0.049
0.019
MAX.
0.183
0.079
0.041
0.016
0.022
0.047
0.955
1.153
OUTLINE AND
MECHANICAL DATA
0.904
0.762
0.626
0.313
0.169
0.173
Flexiwatt25 (vertical)
V
C
B
V
V3
H3
H
H1
H2
R3
R4
V1
R2
R
LL1
A
L
4
O
L
2
N
L
3
V1
V2
D
R1R1
E
G
G1
F
R2
L5
R1
Pin 1
MM1
7034862
15/18
Package informationTDA7850
Figure att25 (horizontal) mechanical data and package dimensions
DIM.
A
B
C
D
E0.370.420.014
F (1)0.57
G0.751.001.250.029
G123.7024.0024.300.933
H (2)28.9029.2329.301.139
H117.00
H212.80
H30.80
L (2)21.6422.0422.440.852
L110.1510.510.850.40
L2 (2)15.5015.7015.900.610
L37.707.857.950.303
L45
L55.155.455.850.203
L61.801.952.100.070
M2.753.003.500.108
M14.73
M25.61
N2.20
P3.203.503.800.126
R1.70
R10.50
R20.30
R31.25
R40.50
V 5˚(Typ.)
V13˚ (Typ.)
V220˚ (Typ.)
V345˚ (Typ.)
MIN.
4.45
1.80
mm
TYP.
4.50
1.90
1.40
2.00
0.39
MAX.
4.65
2.00
MIN.
0.175
0.070
inch
TYP.
0.177
0.074
0.055
0.079
0.015
0.040
0.945
1.150
0.669
0.503
0.031
0.868
0.413
0.618
0.309
0.197
0.214
0.077
0.118
0.186
0.220
0.086
0.138
0.067
0.02
0.12
0.049
0.02
MAX.
0.183
0.079
0.016
0.022
0.049
0.957
1.153
OUTLINE AND
MECHANICAL DATA
0.883
0.427
0.626
0.313
0.23
0.083
0.138
0.15
Flexiwatt25
(Horizontal)
(1): dam-bar protusion not included; (2): molding protusionincluded
7399733 A
16/18
TDA7850Revision history
6 Revision history
Table 5.
Date
22-Nov-2006
27-Feb-2007
09-Oct-2007
Document revision history
Revision
1
2
3
Initial release.
Added Chapter3.4: Electrical characteristic curves.
Updated the values for the dV
OS
and I
q1
parameters on the Table4.
Added Figure20 on page13.
Updated Figure2: Standard test and application circuit.
Updated Section4.4: DC offset detector and Section4.3: Standby
and muting.
Updated the values of V
OS
and THD parameters on the Table4.
Modified max. values of the THD distortion in Table4: Electrical
characteristics on page8.
Changes
12-Sep-20084
07-Nov-20085
17/18
TDA7850
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