2024年11月5日发(作者：果辰锟)
BRIDGELUX BLUE POWER DIE
PRODUCT DATA SHEET
The Bridgelux family of blue power die enables high performance and cost effective
solutions to serve solid state lighting market. This next generation chip technology
delivers improved efficiency and performance to enable increased light output for a
variety of lighting, signaling and display applications.
BXCD 60 mil x 60 mil DS-C12
Features
•
•
•
High lumen output and efficiency
Long operating life
100% Tested and sorted by
wavelength, power and forward
voltage
Lambertian emission pattern
Compatible with Solder paste,
solder preform or silver epoxy die
attach
Delivered on medium tack blue tape
(20cm±10mm ×20 cm±10mm)
Applications
•
•
•
•
•
•
•
•
General Illumination
Portable Lighting
Architectural Lighting
Directional Lighting
Display Backlighting
Digital Camera Flash
Automotive Lighting
White LEDs
•
•
•
LED Chip Diagram
(note: drawing is not to scale)
101 Portola Avenue, Livermore, CA 94551 • Tel: (925)583-8400 • Fax: (925)583-8401 •
BRIDGELUX BLUE POWER DIE
BXCD 60 mil x 60 mil
Part Numbering and Bin Definitions
Bridgelux LED chips are sorted into the brightness and dominant wavelength bins shown below at I
f
=
350 mA. Each blue tape contains die from only one brightness bin and one wavelength bin.
Each blue tape contains chips with 0.2 V forward voltage bins: 3.0 - 3.2 V, 3.2 - 3.4 V and 3.4 - 3.6 V.
The typical forward voltage is 3.2 V and the maximum forward voltage (V
f
max) = 3.6 V.
Dominant Power Bin E2
Wavelength (320-340 mW)
445 to 447.5nm BXCD6060445- E2-z
447.5 to 450nm BXCD6060447- E2-z
450 to 452.5nm BXCD6060450- E2-z
452.5 to 455nm BXCD6060452- E2-z
455 to 457.5nm BXCD6060455- E2-z
457.5 to 460nm BXCD6060457- E2-z
460 to 462.5nm BXCD6060460- E2-z
462.5 to 465nm BXCD6060462- E2-z
Dominant Power Bin G1
Wavelength (380-400 mW)
445 to 447.5nm BXCD6060445- G1-z
447.5 to 450nm BXCD6060447- G1-z
450 to 452.5nm BXCD6060450- G1-z
452.5 to 455nm BXCD6060452- G1-z
455 to 457.5nm BXCD6060455- G1-z
457.5 to 460nm BXCD6060457- G1-z
460 to 462.5nm BXCD6060460- G1-z
462.5 to 465nm BXCD6060462- G1-z
Bridgelux BXCD 60x60 Product Data Sheet DS-C12
Power Bin F1
(340 – 360 mW)
BXCD6060445- F1-z
BXCD6060447- F1-z
BXCD6060450- F1-z
BXCD6060452- F1-z
BXCD6060455- F1-z
BXCD6060457- F1-z
BXCD6060460- F1-z
BXCD6060462- F1-z
(7/14/2011)
Power Bin F2
(360 – 380 mW)
BXCD6060445- F2-z
BXCD6060447- F2-z
BXCD6060450- F2-z
BXCD6060452- F2-z
BXCD6060455- F2-z
BXCD6060457- F2-z
BXCD6060460- F2-z
BXCD6060462- F2-z
Page 2 of 8
BRIDGELUX BLUE POWER DIE
BXCD 60 mil x 60 mil
Product Nomenclature
B X C D 6 0 6 0 X X X – Y – Z
Where:
BXCD: Designates product family
6060: Designates die size (60 mil x 60 mil)
XXX: Designates dominant wavelength bin
Y: Designates radiometric power bin
Z: Designates forward voltage bin
Bridgelux BXCD 60x60 Product Data Sheet DS-C12 (7/14/2011) Page 3 of 8
BRIDGELUX BLUE POWER DIE
BXCD 60 mil x 60 mil
Mechanical Dimensions
Chip size
Wafer thickness
PAD THICKNESS
Pad diameter
Absolute Maximum Ratings
Parameter
DC Forward Current
Junction Temperature
Reverse Voltage
Reverse Current
Assembly Process Temperature
Storage Conditions (chip on tape)
1520
+30/-15
μ
m × 1520
+30/-15
μ
m
150 ± 10
μ
m
4.4 ± 0.3
μ
m
P: 100
μ
m / N: 105
μ
m
Symbol
I
f
T
j
V
r
I
r
6
Maximum Rating
1000 mA
150°C
-5 V
< 10 µA
325°C for < 5 seconds
1
Condition
T
j
= 140°C
T
a
= 25°C
V
r
= -5 V
0°C to +40°C ambient, RH < 65%
Notes:
1. Maximum drive current depends on junction temperature, die attach methods/materials, and lifetime
requirements of the application.
2. Bridgelux LED chips are Class 1 ESD sensitive.
3. The typical spectra half-width of the BXCD6060 blue power die is < 25 nm.
4. Please consult the Bridgelux technical support team for information on how to optimize the light output
of our chips in your package.
5. Brightness values are measured in an integrating sphere using gold plated TO39 headers without
encapsulation.
6. Tapes should be stored in a vertical orientation, not horizontally stacked. Stacking of tapes can place
excessive pressure on the bond pads of the LED, resulting in reduced wire bonding strength.
Environmental Compliance
Bridgelux is committed to providing environmentally friendly products to the solid state lighting
market. Bridgelux BXCD6060 blue power die are compliant to the European Union directives on the
restriction of hazardous substances in electronic equipment, namely the RoHS directive. Bridgelux
will not intentionally add the following restricted materials to BXCD6060 die products: lead, mercury,
cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers
(PBDE).
Bridgelux BXCD 60x60 Product Data Sheet DS-C12 (7/14/2011) Page 4 of 8
BRIDGELUX BLUE POWER DIE
BXCD 60 mil x 60 mil
Performance vs. Current
The following curves represent typical performance of the BXCD6060 blue power die. Actual
performance will vary slightly for different power and dominant wavelength bins.
R
e
l
a
t
i
v
e
L
u
m
i
n
o
u
s
I
n
t
e
n
s
i
t
y
N
o
r
m
a
l
i
z
e
d
a
t
3
5
0
m
A
2.5
2.0
1.5
1.0
0.5
0.0
0
5001000
Forward Current, If (mA)
Figure 1: Relative Luminous Intensity vs. Forward Current (device tested on a probe station)
1000
F
o
r
w
a
r
d
C
u
r
r
e
n
t
,
I
f
(
m
A
)
100
10
1
01
2
3
Forward Voltage, Vf (V)
45
Figure 2: Forward Current vs. Forward Voltage (T
j
= 25°C)
Bridgelux BXCD 60x60 Product Data Sheet DS-C12 (7/14/2011) Page 5 of 8
BRIDGELUX BLUE POWER DIE
BXCD 60 mil x 60 mil
Performance vs. Junction Temperature
The following curves represent typical performance of the BXCD6060 blue power die. Actual
performance will vary slightly for different power and dominant wavelength bins.
F
o
r
w
a
r
d
V
o
l
t
a
g
e
S
h
i
f
t
(
V
)
N
o
r
m
a
l
i
z
e
d
a
t
3
5
0
m
A
,
T
j
2
5
°
C
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
-0.35
-0.40
255075
100125150
Junction Temperature (ºC)
Figure 3: Forward Voltage vs. Junction Temperature
110%
R
e
l
a
t
i
v
e
L
i
g
h
t
I
n
t
e
n
s
i
t
y
N
o
r
m
a
l
i
z
e
d
a
t
3
5
0
m
A
,
T
j
2
5
°
C
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
2550
75100125150
Junction Temperature (ºC)
Figure 4: Relative Light Output vs. Junction Temperature
Bridgelux BXCD 60x60 Product Data Sheet DS-C12 (7/14/2011) Page 6 of 8
BRIDGELUX BLUE POWER DIE
BXCD 60 mil x 60 mil
5.5
5.0
W
a
v
e
l
e
n
g
t
h
S
h
i
f
t
(
n
m
)
N
o
r
m
a
l
i
z
e
d
a
t
3
5
0
m
A
,
T
j
2
5
°
C
4.5
4.0
3.5
2.5
2.0
1.5
1.0
0.5
0.0
2550
3.0
75100125150
Junction Temperature (ºC)
Figure 5: Wavelength Shift vs. Junction Temperature
Typical Radiation Pattern
Figure 6: Typical Radiation Pattern (350 mA Operation)
Current Derating Curves
Bridgelux BXCD 60x60 Product Data Sheet DS-C12 (7/14/2011) Page 7 of 8
BRIDGELUX BLUE POWER DIE
BXCD 60 MIL X 60 MIL
C) Figure 7: Current Derating Curve vs. Ambient Temperature (derating based on T
j
max 150°
F
o
r
w
a
r
d
C
u
r
r
e
n
t
,
I
f
(
m
A
)
800
700
600
500
400
300
200
100
0
0120
Ambient Temperature, Ta (oC)
Rja = 20 Deg C/WRja = 40 Deg C/WRja = 60 Deg C/W
ABOUT BRIDGELUX
Bridgelux is a leading developer and manufacturer of technologies and solutions transforming the $40
billion global lighting industry into a $100 billion market opportunity. Based in Livermore, California,
Bridgelux is a pioneer in solid-state lighting (SSL), expanding the market for light-emitting diode (LED)
technologies by driving down the cost of LED lighting systems. Bridgelux’s patented light source
technology replaces traditional technologies (such as incandescent, halogen, fluorescent and high
intensity discharge lighting) with integrated, solid-state lighting solutions that enable lamp and
luminaire manufacturers to provide high performance and energy-efficient white light for the rapidly
growing interior and exterior lighting markets, including street lights, commercial lighting and
consumer applications. With more than 500 patent applications filed or granted worldwide, Bridgelux
is the only vertically integrated LED manufacturer and developer of solid-state light sources that
designs its solutions specifically for the lighting industry.
For more information about the company, please visit
© 2011 Bridgelux, Inc. All rights reserved. Product specifications are subject to change without
notice.
Bridgelux BXCD 60x60 Product Data Sheet DS-C12 (7/14/2011) Page 8 of 8
2024年11月5日发(作者：果辰锟)
BRIDGELUX BLUE POWER DIE
PRODUCT DATA SHEET
The Bridgelux family of blue power die enables high performance and cost effective
solutions to serve solid state lighting market. This next generation chip technology
delivers improved efficiency and performance to enable increased light output for a
variety of lighting, signaling and display applications.
BXCD 60 mil x 60 mil DS-C12
Features
•
•
•
High lumen output and efficiency
Long operating life
100% Tested and sorted by
wavelength, power and forward
voltage
Lambertian emission pattern
Compatible with Solder paste,
solder preform or silver epoxy die
attach
Delivered on medium tack blue tape
(20cm±10mm ×20 cm±10mm)
Applications
•
•
•
•
•
•
•
•
General Illumination
Portable Lighting
Architectural Lighting
Directional Lighting
Display Backlighting
Digital Camera Flash
Automotive Lighting
White LEDs
•
•
•
LED Chip Diagram
(note: drawing is not to scale)
101 Portola Avenue, Livermore, CA 94551 • Tel: (925)583-8400 • Fax: (925)583-8401 •
BRIDGELUX BLUE POWER DIE
BXCD 60 mil x 60 mil
Part Numbering and Bin Definitions
Bridgelux LED chips are sorted into the brightness and dominant wavelength bins shown below at I
f
=
350 mA. Each blue tape contains die from only one brightness bin and one wavelength bin.
Each blue tape contains chips with 0.2 V forward voltage bins: 3.0 - 3.2 V, 3.2 - 3.4 V and 3.4 - 3.6 V.
The typical forward voltage is 3.2 V and the maximum forward voltage (V
f
max) = 3.6 V.
Dominant Power Bin E2
Wavelength (320-340 mW)
445 to 447.5nm BXCD6060445- E2-z
447.5 to 450nm BXCD6060447- E2-z
450 to 452.5nm BXCD6060450- E2-z
452.5 to 455nm BXCD6060452- E2-z
455 to 457.5nm BXCD6060455- E2-z
457.5 to 460nm BXCD6060457- E2-z
460 to 462.5nm BXCD6060460- E2-z
462.5 to 465nm BXCD6060462- E2-z
Dominant Power Bin G1
Wavelength (380-400 mW)
445 to 447.5nm BXCD6060445- G1-z
447.5 to 450nm BXCD6060447- G1-z
450 to 452.5nm BXCD6060450- G1-z
452.5 to 455nm BXCD6060452- G1-z
455 to 457.5nm BXCD6060455- G1-z
457.5 to 460nm BXCD6060457- G1-z
460 to 462.5nm BXCD6060460- G1-z
462.5 to 465nm BXCD6060462- G1-z
Bridgelux BXCD 60x60 Product Data Sheet DS-C12
Power Bin F1
(340 – 360 mW)
BXCD6060445- F1-z
BXCD6060447- F1-z
BXCD6060450- F1-z
BXCD6060452- F1-z
BXCD6060455- F1-z
BXCD6060457- F1-z
BXCD6060460- F1-z
BXCD6060462- F1-z
(7/14/2011)
Power Bin F2
(360 – 380 mW)
BXCD6060445- F2-z
BXCD6060447- F2-z
BXCD6060450- F2-z
BXCD6060452- F2-z
BXCD6060455- F2-z
BXCD6060457- F2-z
BXCD6060460- F2-z
BXCD6060462- F2-z
Page 2 of 8
BRIDGELUX BLUE POWER DIE
BXCD 60 mil x 60 mil
Product Nomenclature
B X C D 6 0 6 0 X X X – Y – Z
Where:
BXCD: Designates product family
6060: Designates die size (60 mil x 60 mil)
XXX: Designates dominant wavelength bin
Y: Designates radiometric power bin
Z: Designates forward voltage bin
Bridgelux BXCD 60x60 Product Data Sheet DS-C12 (7/14/2011) Page 3 of 8
BRIDGELUX BLUE POWER DIE
BXCD 60 mil x 60 mil
Mechanical Dimensions
Chip size
Wafer thickness
PAD THICKNESS
Pad diameter
Absolute Maximum Ratings
Parameter
DC Forward Current
Junction Temperature
Reverse Voltage
Reverse Current
Assembly Process Temperature
Storage Conditions (chip on tape)
1520
+30/-15
μ
m × 1520
+30/-15
μ
m
150 ± 10
μ
m
4.4 ± 0.3
μ
m
P: 100
μ
m / N: 105
μ
m
Symbol
I
f
T
j
V
r
I
r
6
Maximum Rating
1000 mA
150°C
-5 V
< 10 µA
325°C for < 5 seconds
1
Condition
T
j
= 140°C
T
a
= 25°C
V
r
= -5 V
0°C to +40°C ambient, RH < 65%
Notes:
1. Maximum drive current depends on junction temperature, die attach methods/materials, and lifetime
requirements of the application.
2. Bridgelux LED chips are Class 1 ESD sensitive.
3. The typical spectra half-width of the BXCD6060 blue power die is < 25 nm.
4. Please consult the Bridgelux technical support team for information on how to optimize the light output
of our chips in your package.
5. Brightness values are measured in an integrating sphere using gold plated TO39 headers without
encapsulation.
6. Tapes should be stored in a vertical orientation, not horizontally stacked. Stacking of tapes can place
excessive pressure on the bond pads of the LED, resulting in reduced wire bonding strength.
Environmental Compliance
Bridgelux is committed to providing environmentally friendly products to the solid state lighting
market. Bridgelux BXCD6060 blue power die are compliant to the European Union directives on the
restriction of hazardous substances in electronic equipment, namely the RoHS directive. Bridgelux
will not intentionally add the following restricted materials to BXCD6060 die products: lead, mercury,
cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers
(PBDE).
Bridgelux BXCD 60x60 Product Data Sheet DS-C12 (7/14/2011) Page 4 of 8
BRIDGELUX BLUE POWER DIE
BXCD 60 mil x 60 mil
Performance vs. Current
The following curves represent typical performance of the BXCD6060 blue power die. Actual
performance will vary slightly for different power and dominant wavelength bins.
R
e
l
a
t
i
v
e
L
u
m
i
n
o
u
s
I
n
t
e
n
s
i
t
y
N
o
r
m
a
l
i
z
e
d
a
t
3
5
0
m
A
2.5
2.0
1.5
1.0
0.5
0.0
0
5001000
Forward Current, If (mA)
Figure 1: Relative Luminous Intensity vs. Forward Current (device tested on a probe station)
1000
F
o
r
w
a
r
d
C
u
r
r
e
n
t
,
I
f
(
m
A
)
100
10
1
01
2
3
Forward Voltage, Vf (V)
45
Figure 2: Forward Current vs. Forward Voltage (T
j
= 25°C)
Bridgelux BXCD 60x60 Product Data Sheet DS-C12 (7/14/2011) Page 5 of 8
BRIDGELUX BLUE POWER DIE
BXCD 60 mil x 60 mil
Performance vs. Junction Temperature
The following curves represent typical performance of the BXCD6060 blue power die. Actual
performance will vary slightly for different power and dominant wavelength bins.
F
o
r
w
a
r
d
V
o
l
t
a
g
e
S
h
i
f
t
(
V
)
N
o
r
m
a
l
i
z
e
d
a
t
3
5
0
m
A
,
T
j
2
5
°
C
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
-0.35
-0.40
255075
100125150
Junction Temperature (ºC)
Figure 3: Forward Voltage vs. Junction Temperature
110%
R
e
l
a
t
i
v
e
L
i
g
h
t
I
n
t
e
n
s
i
t
y
N
o
r
m
a
l
i
z
e
d
a
t
3
5
0
m
A
,
T
j
2
5
°
C
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
2550
75100125150
Junction Temperature (ºC)
Figure 4: Relative Light Output vs. Junction Temperature
Bridgelux BXCD 60x60 Product Data Sheet DS-C12 (7/14/2011) Page 6 of 8
BRIDGELUX BLUE POWER DIE
BXCD 60 mil x 60 mil
5.5
5.0
W
a
v
e
l
e
n
g
t
h
S
h
i
f
t
(
n
m
)
N
o
r
m
a
l
i
z
e
d
a
t
3
5
0
m
A
,
T
j
2
5
°
C
4.5
4.0
3.5
2.5
2.0
1.5
1.0
0.5
0.0
2550
3.0
75100125150
Junction Temperature (ºC)
Figure 5: Wavelength Shift vs. Junction Temperature
Typical Radiation Pattern
Figure 6: Typical Radiation Pattern (350 mA Operation)
Current Derating Curves
Bridgelux BXCD 60x60 Product Data Sheet DS-C12 (7/14/2011) Page 7 of 8
BRIDGELUX BLUE POWER DIE
BXCD 60 MIL X 60 MIL
C) Figure 7: Current Derating Curve vs. Ambient Temperature (derating based on T
j
max 150°
F
o
r
w
a
r
d
C
u
r
r
e
n
t
,
I
f
(
m
A
)
800
700
600
500
400
300
200
100
0
0120
Ambient Temperature, Ta (oC)
Rja = 20 Deg C/WRja = 40 Deg C/WRja = 60 Deg C/W
ABOUT BRIDGELUX
Bridgelux is a leading developer and manufacturer of technologies and solutions transforming the $40
billion global lighting industry into a $100 billion market opportunity. Based in Livermore, California,
Bridgelux is a pioneer in solid-state lighting (SSL), expanding the market for light-emitting diode (LED)
technologies by driving down the cost of LED lighting systems. Bridgelux’s patented light source
technology replaces traditional technologies (such as incandescent, halogen, fluorescent and high
intensity discharge lighting) with integrated, solid-state lighting solutions that enable lamp and
luminaire manufacturers to provide high performance and energy-efficient white light for the rapidly
growing interior and exterior lighting markets, including street lights, commercial lighting and
consumer applications. With more than 500 patent applications filed or granted worldwide, Bridgelux
is the only vertically integrated LED manufacturer and developer of solid-state light sources that
designs its solutions specifically for the lighting industry.
For more information about the company, please visit
© 2011 Bridgelux, Inc. All rights reserved. Product specifications are subject to change without
notice.
Bridgelux BXCD 60x60 Product Data Sheet DS-C12 (7/14/2011) Page 8 of 8