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2024年11月5日发(作者：依兰)

Intel Server Board S3200SH/S3210SH

Memory List Test Report Summary

Revision 12.0

February 2009

Revision History

Date Rev Modifications

Dec/07

Jan/08

Mar/08

Apr/08

May/08

July/08

Oct/08

Nov/08

Dec/08

Feb/09

1.0

2.0

3.0

4.0

5.0

7.0

9.0

10.0

11.0

12.0

Initial Release

Additional memory parts added (in shaded area).

June/08 6.0

Sept/08 8.0

INTEL DISCLAIMS ALL LIABILITY FOR THESE DEVICES, INCLUDING LIABILITY FOR

INFRINGEMENT OF ANY PROPRIETARY RIGHTS RELATING TO THESE DEVICES OR THE

IMPLEMENTATION OF INFORMATION IN THIS DOCUMENT. INTEL DOES NOT WARRANT

OR REPRESENT THAT SUCH DEVICES OR IMPLEMENTATION WILL NOT INFRINGE SUCH

RIGHTS. INTEL IS NOT OBLIGATED TO PROVIDE ANY SUPPORT, INSTALLATION, OR

OTHER ASSISTANCE WITH REGARD TO THESE DEVICES.

THE INTEL PRODUCT REFERRED TO IN THIS DOCUMENT IS INTENDED FOR STANDARD

COMMERCIAL USE ONLY. CUSTOMERS ARE SOLELY RESPONSIBLE FOR ASSESSING

THE SUITABILITY OF THE PRODUCT AND/OR DEVICES FOR USE IN PARTICULAR

APPLICATIONS. THE REFERENCED INTEL PRODUCT IS NOT INTENDED FOR USE IN

CRITICAL CONTROL OR SAFETY SYSTEMS OR IN NUCLEAR FACILITY APPLICATIONS.

Information in this document is provided in connection with Intel products. No license, express or

implied, by estoppel or otherwise, to any intellectual property rights is granted by this document

or by the sale of Intel products. Except as provided in Intel’s Terms and Conditions of Sale for

such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied

warranty, relating to sale and/or use of Intel products including liability or warranties relating to

fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other

intellectual property right. Intel products are not intended for use in medical, life saving, or life

sustaining applications. Intel retains the right to make changes to its test specifications and

memory list at any time, without notice.

The hardware vendor remains solely responsible for the design, sale and functionality of its

product, including any liability arising from product infringement or product warranty. Only

approved software drivers and accessories that are recommended for the revision number of the

boards and system being operated should be used with Intel products. Please note that, as a

result of warranty repairs or replacements, alternate software and firmware versions may be

required for proper operation of the equipment.

The Intel

Server Board S3200SH/S3210SH may contain design defects or errors known as

errata which may cause the product to deviate from published specifications. Current

characterized errata are available on request.

* Other brands and names are the property of their respective owners.

Please Note: DIMM devices with gold contacts should NOT be placed into DIMM sockets with

tin-lead contacts or vice-versa. Mixing dissimilar metal contact types has been shown to result in

unreliable memory operation. Intel recommends similar manufacturer and similar speeds in each

bank on the memory module. Mixing of dissimilar memory manufacturer and similar speeds in

each bank on the memory module is NOT recommended.

Table of Contents

OVERVIEW OF 5

NBUFFERED

ECC,

DDR2-667

DIMM

ODULES

512

IZES

(64M

72)............................................8

NBUFFERED

ECC,

DDR2-800

DIMM

ODULES

512

IZES

(64M

72)............................................8

NBUFFERED

ECC,

DDR2-667

DIMM

ODULES

IZES

(128M

72)...............................................9

NBUFFERED

ECC,

DDR2-800

DIMM

ODULES

IZES

(128M

72)...............................................9

NBUFFERED

-ECC,

DDR2-667

DIMM

ODULES

IZES

(128M

72)....................................11

NBUFFERED

-ECC,

DDR2-800

DIMM

ODULES

IZES

(128M

72)....................................11

NBUFFERED

ECC,

DDR2-667

DIMM

ODULES

IZES

(256M

72).............................................12

NBUFFERED

ECC,

DDR2-800

DIMM

ODULES

IZES

(256M

72).............................................12

NBUFFERED

NON

ECC,

DDR2-800

DIMM

ODULES

IZES

(256M

72)....................................13

CMTL* (COMPUTER MEMORY TEST LABS)...................................................................................16

The following procedure is used to test memory modules for use in the Intel

Server Board

S3200SH/S3210SH. Memory is a vital subsystem in a platform. Intel Corporation requires strict

guidelines to be met before a memory vendor and part is put onto the qualified memory list. Each

Intel Server Board product has a separate qualified memory list.

Memory qualification for Intel’s Server Board products is performed by Intel’s Memory Validation

Laboratory (MVL), and by an independent external test laboratory, Computer Memory Test Lab

(CMTL)

. CMTL is a leading memory testing organization responsible for testing a broad range

of memory products. Memory devices tested by Intel’s MVL or CMTL must undergo rigorous

tests to ensure that the product will perform the intended server functions.

Intel

’s Server and Workstation Board qualified memory lists categorize memory modules as

Advanced Tested. The Advanced Testing process involves a paper qualification, a standard

voltage and room temperature functional test, and a voltage and temperature margin functional

test. A paper qualification is a review of critical timings, electrical characteristics, timing

requirements, environmental requirements, and packaging requirements in order to see if the

memory meets Intel’s memory specifications. The standard voltage and room temperature test

involves testing the memory module on the particular Intel board for which it is being qualified

with test software operating under Microsoft Windows Server 2003* Enterprise Edition for no less

than 24 hours. The voltage and temperature margin testing involves testing the memory module

on the particular Intel board for which it is being qualified with various test software and operating

systems for 48-72 hours under various voltage and temperature margin conditions. Memory

modules that have completed Advanced Testing are known to be compatible with the product on

which they were tested, and with the test software and operating system that was utilized during

the test procedure.

For information regarding the testing procedure required to reach each phase, please contact

your Intel Representative.

CMTL is an independent memory testing organization responsible for testing a broad range of

memory products. Receiving a “PASS” after being tested by CMTL, means that a product

functions correctly and consumers can use it to perform the intended server functions. In order to

pass these stringent standards, memory products must maintain the highest manufacturing

procedures and pass an exacting battery of tests. Testing is performed with equipment and a

procedure as defined by Intel’s various functional testing levels.

CMTL contact:

Office: (949) 716-8690 Computer Memory Test Lab (CMTL)

Fax (949) 716-8691 24 Hammond Suite F

Irvine, CA 92618

www

Overview of Memory Testing

Qualified Memory for the Intel

Server Board S3200SH/S3210SH

The memory module on the Intel

Server Board S3200SH/S3210SH has 4 DIMM sockets, which

can hold up to 8 GB of unbuffered ECC and non-ECC DDR2-667 or DDR2-800 memory using

four 72-bit DIMM modules. The following memory features are supported:

•

DDR2-667 and DDR2-800 unbuffered ECC and non-ECC compatible 1.8V modules (in

compliance with the DDR JEDEC DIMM Specification).

DIMMs with capacity of 512 MB, 1 GB, and 2 GB. Other DRAM sizes may function

correctly but will not be validated.

Minimum configuration is 512 MB using one 512 MB DIMM.

Maximum configuration is 8 GB.

Below is a chart that lists the current supported memory types:

DDR2-667 Unbuffered SDRAM Module Matrix

DIMM DIMM

Capacity Organization

512 MB

1 GB

2 GB

64M x 72

128M x 72

256M x 72

SDRAM

Density

256Mbit

512Mbit

1Gbit

SDRAM # SDRAM # Address bits

Organization Devices/rows/Banksrows/Banks/column

32M x 8

64M x 8

128M x 8

18/2/4

9/1/4

18/2/4

9/1/8

18/2/8

13/2/10

14/2/10

14/3/10

DDR2-800 Unbuffered SDRAM Module Matrix

DIMM DIMM

Capacity Organization

512 MB

1 GB

2 GB

64M x 72

128M x 72

256M x 72

SDRAM

Density

256Mbit

512Mbit

1Gbit

SDRAM # SDRAM # Address bits

Organization Devices/rows/Banksrows/Banks/column

32M x 8

64M x 8

128M x 8

18/2/4

9/1/4

18/2/4

9/1/8

18/2/8

13/2/10

14/2/10

14/3/10

Memory features are detailed in the Intel

Server Board S3200SH/S3210SH Technical Product

Specification available on-line at:

/support/motherboards/server/s3200SH/

The following table lists DIMM devices known to be compatible with the Intel

Server Board

S3200SH/S3210SH. Intel recommends that Advanced Tested DIMMs be used to establish

reliable system operation. DIMM devices not listed can be used; but, in the event of unreliable

system operation, the DIMM devices should be replaced with functionally Advanced Tested

DIMMs to determine whether the DIMM devices are causing the problem.

Caution: Third party memory vendors may use the same module part number with different

DRAM vendors and die revisions. To insure proper system operation, verify that each DRAM

vendor and die revision has been separately tested and qualified. Please notify CMTL if there is a

discrepancy.

Note: This list is not intended be all-inclusive. It is provided as a convenience to Intel’s general

customer base, but Intel does not make any representations or warranties whatsoever regarding

the quality, reliability, functionality, or compatibility of these memory modules.

This list is subject to change without notice.

Intel® Server Board S3200SH/S3210SH

Unbuffered, ECC, DDR2-667 DIMM Modules

512 MB Sizes (64Mx72)

Manufacturer DRAM PCB Part CAS DRAM Date

Vendor Number Latency Organization

Micron MT9HTF6472AY-667D4 7FD22 D9GMH Micron 5 (64Mx8)*9 11/07

(64Mx8)*9 11/07

(64Mx8)*9

11/07

Part Number DRAM Part Number

Samsung M391T6553EZ3-CE6 K4T51083QE-ZCE6 Samsung

Qimonda HYS72T64000EU-3S-B2 HYB18T512800B2F3S Qimonda

Hynix HYMP564U72CP8-Y5 AB-C HYP5PS12821C FP-Y5Hynix

Crucial CT6472AA667.9FD MT47H64M8B6-3:D Micron 5 (64Mx8)*9 3/08

Unbuffered, ECC, DDR2-800 DIMM Modules

512 MB Sizes (64Mx72)

Manufacturer Part Number DRAM Part Number

Micron MT9HTF6472AY-80ED4

DRAM PCB Part CAS DRAM Date

Vendor Number Latency Organization

Micron 5 (64Mx8)*9 11/07

(64Mx8)*9 11/07

Qimonda 5 (64Mx8)*9 11/07

5 (64Mx8)*9 12/07

5 64M x 16 01/12/09

Samsung M391T6553EZ3-CE7 K4T51083QE-ZCE7 Samsung

Qimonda HYS72T64000EU-25F-B2 HYB18T512800B2F25F

Hynix HYMP564U72CP8-S6 HY5PS12821C FP-S6 Hynix

HY5PS12821CFP-S5 40083A

Dataram DTM63359B Hynix

rev C rev A

HYB18T1G160C2F-25F 40104A

Dataram DTM63390A Qimonda

rev C2 rev A

(+) This vendor is part of the CMTL Certification program. This means this part has/will been tested across all compatible

Intel Server Boards. For further information contact CMTL @ /

Caution: Some modules on this list may contain “stacked” DRAM parts. These parts may have

thermal & physical limitations in some chassis configurations. It is advised to verify that your

chassis configuration will support “stacked” parts before purchase.

Intel® Server Board S3200SH/S3210SH

Unbuffered, ECC, DDR2-667 DIMM Modules

1 GB Sizes (128Mx72)

Manufacturer Part Number DRAM Part Number

Micron MT9HTF12872AY-667E1 7FEII D9HNL

Micron MT18HTF12872AY-667D4 7FD22 D9GMH

DRAM PCB Part CAS DRAM Date

Vendor Number Latency Organization

Micron 5 (128Mx8)*9 11/07

Micron

5 (64Mx8)*18 11/07

(64Mx8)*18 11/07

Samsung M391T2953EZ3-CE6 K4T51083QE-ZCE6 Samsung

Qimonda HYS72T128020EU-3S-B2 HYB18T512800B2F3S Qimonda

Hynix

Crucial

HYMP512U72CP8-Y5 AB

CT12872AA667.9FE

CT12872AA667.18FD

INT72Q8M128M8M-

A03GYU

HY5PS12821C FP-Y5 Hynix

MT47H128M8HQ-3:E Micron 5 (128Mx8)*9 3/08

5 (64Mx8)*18 3/08

5 (64Mx8)*18 1/08

5 (128Mx8)*9 1/08

5 (128Mx8)*9 3/08

MT47H64M8B6-3:D Micron

HYB18T512800BF3S rev D2U72G

STEC Qimonda

B na

ATP K4T1G084QD-ZCE6 rev D2U72F

AJ28K72F8BJE6S Samsung

Electronics D na

Samsung M391T2863QZ3-CE6 Kr4T1G084QQ-HCF7 Samsung

EDE1108ACBG-6E-E rev 8132d rev

Swissbit MEU12872D4BC1EP-30R Elpida

d C

Kingston KVR667D2E5/1GI E5108AJBG-6E-E Elpida

Hynix HYMP112U72CP8-Y5 HY5PS1G831CFP-Y5 Hynix

EDE1108ACBG-6E-E rev M0544LA1

TRS TRS30416X Elpida

C rev 1

HY5PS12821CFP-Y5 rev

TRS TRS30420X Hynix 0815

HYB18T512800B2F3S 240-7-1G

TRS TRS30418X Qimonda

rev B2 (0743)

K4T51083QG-HCE6 rev M391T295

TRS TRS30268X Samsung

G 3CZ1-P10

STEC

Centon

Electronics

INT72Q8M128M8M-

A03GYU

TOP-052

HYB18T512800B2F-3S

rev B2

EDE5108AJBG-6E-E rev

Qimonda

Elpida

D2U72G

rev G

5 (128Mx8)*9 4/08

5 (64Mx8)*18 4/08

5 (128Mx8)*9 6/08

128M x 8

64M x 8

06/08

06/208

10/08

Unbuffered, ECC, DDR2-800 DIMM Modules

1 GB Sizes (128Mx72)

Manufacturer Part Number DRAM Part Number

Micron MT18HTF12872AY-80ED4

DRAM PCB Part CAS DRAM Date

Vendor Number Latency Organization

Micron 5 (64Mx8)*18 11/07

Micron

5 (128Mx8)*9 11/07

5 (64Mx8)*18 11/07

(64Mx8)*18 11/07

Micron MT9HTF12872AY-80EE1 7JEII D9HNQ

Qimonda HYS72T128020EU-25F-B2 HYB18T512800B2F25F

Hynix HYMP512U72CP8-S6 AB HY5PS12821C FP-S6

Samsung M391T2953EZ3-CE7 K4T51083QE-ZCE7 Samsung

Qimonda HYS72T128020HU-25F-B HYB18T512800BF25F Qimonda

Hynix

Qimonda

Hynix HYMP112U72CP8-S6 HY5PS1G831CFP-S6 Hynix

ATP K4T51083QE-ZCE7 rev SJ240G08

AJ28K72G8BHE7S Samsung

Electronics E K1 na

Crucial CT12872AA80E.9FE MT47H128M8HQ-25E:EMicron

6 (128Mx8)*9 2/08

5 (64Mx8)*18 2/08

5 (128Mx8)*9 3/08

Unbuffered, ECC, DDR2-800 DIMM Modules

1 GB Sizes (128Mx72)

Manufacturer PCB Part CAS DRAM Date

Number Latency Organization

2025321-

NT5TU64M8BE-25C rev

Kingston KVR800D2E5/1GI Nanya 0F1.A00 5 (64Mx8)*18 1/11/08

48.16193.

Apacer 78.01GAE.42D E1108ACBG-8E-E rev CElpida 5 (128Mx8)*9 1/16/08

09D rev D

48.18193.

Apacer 78.01G9Q.423 E5108AJBG-8E-E rev J Elpida 5 (64Mx8)*18 1/25/08

093 rev 3

Samsung M391T2863QZ3-CF7 K4T1G084QQ-HCE6 Samsung 6 (128Mx8)*9 3/18/08

5 (64Mx8)*18 4/4/08

64M x 8

128M x 8

10/08

12/08

Part Number DRAM Part Number DRAM

Vendor

Kingston KVR800D2E5/1GI E5108AJBG-8E-E Elpida

Centon D2U72G

TOP-053 CE64x8x8-25 rev E Centon

Electronics rev G

2025320-

Kingston KVR800D2E5/1GI E1108ACBG-8E-E rev CElpida 0F1.A00

rev A

HYB18T1G800C2F-25F 40083A

Dataram DTM63393A Qimonda

rev C2 rev A

(+) This vendor is part of the CMTL Certification program. This means this part has/will been tested across all compatible

Intel Server Boards. For further information contact CMTL @ /

Caution: Some modules on this list may contain “stacked” DRAM parts. These parts may have

thermal & physical limitations in some chassis configurations. It is advised to verify that your

chassis configuration will support “stacked” parts before purchase.

Intel® Server Board S3200SH/S3210SH

Unbuffered, Non-ECC, DDR2-667 DIMM Modules

1 GB Sizes (128Mx72)

Manufacturer Part Number DRAM Part NumberDRAM VendorPCB Part

Number

CAS DRAM Date

Latency Organization

5 (64Mx8)*18 2/11/08

E5108AJBG-6E-E rev

Buffalo D2U667C-1GEJJ

Elpida 2DUE28F-AA na

Unbuffered, Non-ECC, DDR2-800 DIMM Modules

1 GB Sizes (128Mx72)

Manufacturer Part Number DRAM Part NumberDRAM Vendor

K4T51083QE-ZCE7

rev E

E1108ACBG-8E-E

rev C

PCB Part

Number

CAS DRAM Date

Latency Organization

(64Mx8)*18 1/14/08

128M x 8 01/26/09

ATP Electronics AJ28K64E8BHE7S

Buffalo

D2U800CX-

S1GECJ

Samsung SJ240E08K1 na

Elpida 2D286NF3-AB

(+) This vendor is part of the CMTL Certification program. This means this part has/will been tested across all compatible

Intel Server Boards. For further information contact CMTL @ /

Caution: Some modules on this list may contain “stacked” DRAM parts. These parts may have

thermal & physical limitations in some chassis configurations. It is advised to verify that your

chassis configuration will support “stacked” parts before purchase.

Intel® Server Board S3200SH/S3210SH

Unbuffered, ECC, DDR2-667 DIMM Modules

2 GB Sizes (256Mx72)

Manufacturer DRAM PCB Part

Vendor Number

Micron MT18HTF25672AY-667E1 7EEII D9HNL Micron

Part Number DRAM Part NumberCAS DRAM

Latency Organization

5 (128Mx8)*18

2 (128Mx8)*18

5 (128Mx8)*18

128M x 8

Date

11/07

1/24/08

2/6/08

3/6/08

1/9/08

1/18/08

1/30/08

3/14/08

3/18/08

4/3/08

4/15/08

6/13/08

6/18/08

06/20/08

06/24/08

06/30/08

10/22/08

Samsung M391T5663AZ3-CE6 K4T1G084QA-ZCE6

Qimonda HYS72T256020HU-3S-A HYB18T1G800AF-3S

HYB18T1G800BF-

Qimonda HYS72T256020EU-3S-B

3S-B

ATP MT47H128M8HQ-3

AJ56K72G8BJE6M

Electronics rev E

Crucial CT25672AA667.18FE MT47H128M8HQ-3:E

ATP K4T1G084QD-ZCE6

AJ56K72G8BJE6S

Electronics rev D

INT72Q8W256M8M-MT47H128M8HQ-3

STEC

A03GYU rev E

HY5PS1G831CFP-

Viking VR5EU567218FBWL1

Y5 rev C

Samsung

Qimonda

Micron

SJ240G08

K1 na

Micron

SJ240G08

Samsung

K1 na

D2U72G

Micron

D2U72G

Hynix

M0540LA1

TRS TRS30321X E1108AB-6E-E rev BElpida

rev 1

Samsung M391T5663QZ3-CE6 Kr4T1G084QQ-HCF7Samsung

EDE1108ACBG-6E-E 8132d rev

Swissbit MEU25672D4BC2EP-30R Elpida

d rev C

Kingston KVR667D2E5/2GI E1108ACSE-6E-E Elpida

EDE1108ACBG-6E-E M0540LA1

TRS TRS30417X Elpida

rev C rev 1

HY5PS1G831CFP-

Hynix HYMP125U72CP8-Y5 Hynix

HY5PS1G831CFP-

TRS TRS30421X Hynix 0814

Y5 rev C

HYB18T1G800C2F-240-7-1G

TRS TRS30419X Qimonda

3S rev C2 (0743)

M391T295

K4T1G084QQ-HCE6

TRS TRS30269X Samsung 3CZ1-P10

rev Q

Centon EDE1108ACBG-6E-E D2U72G

TOP-049 Elpida

rev C rev G Electronics

Unbuffered, ECC, DDR2-800 DIMM Modules

2 GB Sizes (256Mx72)

Manufacturer DRAM PCB Part

Vendor Number

Micron MT18HTF25672AY-80EE1 7HEII D9HNQ Micron

Part Number DRAM Part NumberCAS DRAM

Latency Organization

5 (128Mx8)*18

Date

11/07

Samsung M391T5663DZ3-CE7 K4T51083QE-ZCE6

ATP MT47H128M8HQ-

AJ56K72G8BJE7M

Electronics 25E rev E

Smart Modular

Technologies

SG2567UDR212851ME

MT47H128M8HQ-

25E rev E

Samsung

SJ240G08

Micron

K1 na

PG58G240

Micron NUBUB1R

G rev A

5 (128Mx8)*1812/21/07

5 (128Mx8)*181/4/08

2/2/08

HY5PS1G831CFP-

Hynix HYMP125U72CP8-S6

Hynix 6 (128Mx8)*18

Unbuffered, ECC, DDR2-800 DIMM Modules

2 GB Sizes (256Mx72)

Manufacturer Part Number DRAM Part Number

HY5PS1G831CFP-

Dataram DTM63368A

S5 rev C

E1108ACBG-8E-E

Apacer 78.A1GAE.423

rev C

Samsung M391T5663QZ3-CF7 K4T1G084QQ-HCE6

HY5PS1G831CFP-

Kingston KVR800D2E5/2GI

PCB Part CAS DRAM Date

Number Latency Organization

40082A rev

Hynix 5 (128Mx8)*182/4/08

48.18193.0

Elpida 5 (128Mx8)*181/21/08

93 rev 3

Samsung 6 (128Mx8)*183/18/08

Hynix 5 (128Mx8)*18

(128Mx8)*18

4/8/08

5/5/08

09/23/08

DRAM

Vendor

Kingston KVR800D2E5/2GI E1108ACBG-8E-E lpida

Viking

VR5EU567218FBZL1

MT47H128M8HQ-

25 rev E

Micron

D2U72G

128M x 8

Viking

Centon

Electronics

VR5EU567218FBZL2

TOP-051

HY5PS1G831CFP-

S6 rev C

CE128x8x8-25 rev C

Hynix

Centon

Micron

D2U72G

rev G

Maple-18

(3206)

128M x 8

09/23/08

10/27/08

11/20/08

MT47H128M8HQ-25

Unigen UG25T7200M8DU-8CQ

rev G

Intel® Server Board S3200SH/S3210SH

Unbuffered, non- ECC, DDR2-800 DIMM Modules

2 GB Sizes (256Mx72)

Manufacturer

Buffalo

(+) This vendor is part of the CMTL Certification program. This means this part has/will been tested across all compatible

Intel Server Boards. For further information contact CMTL @ /

Part Number

D2U800CX-2GECJ

D2U800CX-2GHCJ

DRAM Part Number

E1108ACBG-8E-E

rev C

HY5PS1G831CFP-

S5 rev C

DRAM

Vendor

Elpida

Hynix

PCB Part

Number

2D286NF3-

CAS DRAM

Latency Organization

128M x 8

Date

01/20/09

01/22/09

Caution: Some modules on this list may contain “stacked” DRAM parts. These parts may have

thermal & physical limitations in some chassis configurations. It is advised to verify that your

chassis configuration will support “stacked” parts before purchase.

Sales Information

Vendor Name

ATP Electronics

ATP Electronics --

Taiwan Inc.

Avant Technology

Web URL

Vendor Direct Sales Info

Aved Memory Products

Buffalo Technology

Centon Electronics

Corsair

Crucial

Dane-Elec

Dataram

GoldenRAM

Hitachi

Hyundai/Hynix

Semiconductor

Infineon

ITAUCOM

JITCO CO LTD

Kingston

Legacy Electronics Inc.

Legend

Micron

MSC Vertriebs GmbH

Tel (1) 408-732-5000, ext 5858

Fax 408-732-5893

sales@

011-886-2-2659-6368 / Tel

Fax 886-2-2659-4982

Brad Scoggins

Phone: (512)491-7411

Fax: (512)491-7412

brads@

/ (800) 967-0959

memory@

Tel: 949-855-9111

Fax: 949-855-6035

Tel: 510-657-8747 /

Fax: 510-657-8748

/intel Toll-free: 888-363-4167 (US & Canada only)

Tel: 208-363-5790

Fax: 208-363-5560

/ Michal Hassan @ (949)450-2941 or email @

Michal@

/ Paul Henke, 800-328-2726 x2239 in USA

phenke@

Peter Jauss, +49-69-680-9070 in EMEA

pjauss@

Jason M. Barrette @ 800-222-861 x7546

jasonb@

or Michael E. Meyer @800-222-8861 x7512

michaelm@

/pointer/

/business/distribut

Seong Jeon

Tel: 82-32-817-9740

US.- Call (877) 435-8726

Asia – Call 886-3-564-1539

Europe – Call +44-1932-755205

U.S. Contact: Keri Albers 888 466 3853 ext. 307

European Contact: 49 89 370 664 11

William Perrigo

49-7249-910-417

Fax: 49-7249-910-229

wpe@

Christopher Lopes

949.435.0025 tel

949.435.0031 fax

sales@

Netlist, Inc

Vendor Name

Peripheral Enhancements

PNY

Samsung

Silicon Tech

Simple Tech

SMART Modular

Technologies

TechnoLinc Corporation

TRS* Tele-Radio-Space

GmbH

Unigen

Ventura Technology Inc

Viking InterWorks

Virtium Technology Inc

Wintec Industries

Web URL

/internet_explorer/LP

/locate

/buy/list_

/contact/salesco

Vendor Direct Sales Info

For US customers go to:

Ron Darwish @ (949) 260-8230 or email @

Rdarwish@

/channel/hpc/ Gene F. Patino

Tel: 949 439-6167

David Curtis

510-445-7400

davidc@

http:/ Vender Direct Sales Info: Andreas Gruendl

Tel: +49.89.945532-34

Fax: +49.89.945532-41

Sam Lewis

760 724-8700 ext. 103

Adrian Proctor

Tel: 949-643-7255

Tod Skelton @ (949) 460-0020 ext. 146 or email @

Tel 510-360-6300

Fax 510-770-9338

CMTL* (Computer Memory Test Labs)

CMTL is a privately owned and operated memory testing organization responsible for testing a broad

range of memory products. Memory devices tested by CMTL must undergo a rigorous battery of tests to

ensure that the product will perform the intended server functions. Memory capability is a major factor

your customers consider. CMTL has the ability to test and certify memory on Intel-based server platforms.

The list of memory modules, which have undergone testing through the CMTL facility, should be

referenced when considering modules for integration into this Intel server product. Stringent standards with

regard to manufacturing procedures and quality must be met to pass the exacting tests required for

qualification through the independent testing facility. Testing is performed by CMTL with Intel server

products and test procedures defined by Intel’s Memory Validation Lab. Intel routinely audits the CMTL

facility to ensure all procedures, process handling, and testing methodologies are met.

IMPORTANT NOTE

DIMM devices with gold contacts should NOT be placed into DIMM sockets with tin-lead contacts or

vice-versa. Mixing dissimilar metal contact types has been shown to result in unreliable memory operation.

Intel

recommends similar manufacturer and similar speeds in each bank on the memory module. Mixing of

dissimilar memory manufacturer devices or dissimilar memory device speeds is not recommended. This

document contains information which is the proprietary property of Intel Corporation. Nothing in this

document constitutes a guaranty, warranty, or license, express or implied. Intel has tested the following

DIMMs for minimum electrical and functional compatibility with boxed processors. This listing is not

intended to be all inclusive; it only represents the DIMMs Intel or CMTL has tested. Users of this list are

reminded to check with the DIMM manufacturer or Distributor to ensure that a particular DIMM model is

adequate for the intended purpose on the boxed processor baseboard. Intel provides no indemnities for and

expressly disclaims all liabilities for any and all such guaranties, representations, and warranties (oral or

written) whether express or implied, related to DIMMs in an Intel

Server Board product, including

without limitation to: fitness for a particular purpose; merchantability; noninfringement of intellectual

property or other rights of any third party or of Intel. The reader is advised that third parties may have

intellectual property rights which may be relevant to this document and the technologies discussed herein,

and is advised to seek the advice of competent legal counsel, without obligation of Intel. Intel retains the

right to make changes to this document at any time, without notice. Intel makes no warranty or

representation with respect to the use of this document or reliance by the reader upon its contents, and

assumes no responsibility for any errors which may appear in the document nor does it make a

commitment to update the information contained herein.

Product and corporate names listed in this document may be trademarks of their respective companies.