2024年3月23日发(作者：舜饮香)

专利内容由知识产权出版社提供

专利名称：COPPER-CERAMIC SUBSTRATE, COPPER

PRECURSOR FOR PRODUCING A COPPER-

CERAMIC SUBSTRATE AND PROCESS FOR

PRODUCING A COPPER-CERAMIC

SUBSTRATE

发明人：KARL ZEIGER,BENJAMIN CAPPI,HELGE

LEHMANN,ROBERT KOCH

申请号：US16060344

申请日：20161206

公开号：US2A1

公开日：20190103

专利附图：

摘要：The present invention relates to a copper ceramic substrate incorporating a

ceramic carrier, and a copper layer joined to a surface of the ceramic carrier, wherein the

copper layer incorporates at least one first layer, which faces the ceramic carrier and has

an average first grain size, and a second layer, which is arranged on the face of the copper

layer facing away from the ceramic carrier and has an average second grain size, the

second grain size being smaller than the first grain size.

申请人：AURUBIS STOLBERG GMBH & CO. KG

地址：STOLBERG DE

国籍：DE

更多信息请下载全文后查看

2024年3月23日发(作者：舜饮香)

专利内容由知识产权出版社提供

专利名称：COPPER-CERAMIC SUBSTRATE, COPPER

PRECURSOR FOR PRODUCING A COPPER-

CERAMIC SUBSTRATE AND PROCESS FOR

PRODUCING A COPPER-CERAMIC

SUBSTRATE

发明人：KARL ZEIGER,BENJAMIN CAPPI,HELGE

LEHMANN,ROBERT KOCH

申请号：US16060344

申请日：20161206

公开号：US2A1

公开日：20190103

专利附图：

摘要：The present invention relates to a copper ceramic substrate incorporating a

ceramic carrier, and a copper layer joined to a surface of the ceramic carrier, wherein the

copper layer incorporates at least one first layer, which faces the ceramic carrier and has

an average first grain size, and a second layer, which is arranged on the face of the copper

layer facing away from the ceramic carrier and has an average second grain size, the

second grain size being smaller than the first grain size.

申请人：AURUBIS STOLBERG GMBH & CO. KG

地址：STOLBERG DE

国籍：DE

更多信息请下载全文后查看