2024年3月30日发(作者：招仪文)
M-730V/830V
SERVICE MANUAL
Ver 1.3 2003. 07
US Model
Canadian Model
AEP Model
E Model
M-730V/830V
Chinese Model
M-730V
Tourist Model
M-830V
Photo : M-830V
Model Name Using Similar Mechanism
Tape Transport Mechanism Type
NEW
MZ-730V-99
SPECIFICATIONS
MICROCASSETTE
TM
-CORDER
9-927-100-13
2003G16-1
© 2003.07
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
TABLE OF CONTENTS
1.
3
2. DISASSEMBLY
2-1.
2-2.
2-3.
2-4.
2-5.
2-6.
2-7.
2-8.
Lid Assy, 4
Lid, 4
Cabinet (Rear) 5
Speaker Assy, 5
6
.6
7
Head, Creamic (HRPE901, 902).........................................7
3. .
8
4.
8
5. DIAGRAMS
11
d 13
15
6. EXPLODED VIEWS
.17
ism Deck Section (1)............................................19
ism Deck Section (2)............................................20
7. ELECTRICAL .
21
Notes on Chip Component Replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270˚C during
repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
– 2 –
2024年3月30日发(作者：招仪文)
M-730V/830V
SERVICE MANUAL
Ver 1.3 2003. 07
US Model
Canadian Model
AEP Model
E Model
M-730V/830V
Chinese Model
M-730V
Tourist Model
M-830V
Photo : M-830V
Model Name Using Similar Mechanism
Tape Transport Mechanism Type
NEW
MZ-730V-99
SPECIFICATIONS
MICROCASSETTE
TM
-CORDER
9-927-100-13
2003G16-1
© 2003.07
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
TABLE OF CONTENTS
1.
3
2. DISASSEMBLY
2-1.
2-2.
2-3.
2-4.
2-5.
2-6.
2-7.
2-8.
Lid Assy, 4
Lid, 4
Cabinet (Rear) 5
Speaker Assy, 5
6
.6
7
Head, Creamic (HRPE901, 902).........................................7
3. .
8
4.
8
5. DIAGRAMS
11
d 13
15
6. EXPLODED VIEWS
.17
ism Deck Section (1)............................................19
ism Deck Section (2)............................................20
7. ELECTRICAL .
21
Notes on Chip Component Replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270˚C during
repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
– 2 –