2024年5月8日发(作者：贾宏阔)
CHAPTER
4-RELIABILITY TESTS AND
RELIABILITY PREDICTION
4
CHAPTER 4 - RELIABILITY TESTS AND RELIABILITY PREDICTION
4.1
4.2
Approach 120
What are 121
4.2.1
4.2.2
4.2.3
4.3
Reliability Test Significance and Purpose .......................................................121
Reliability Test Methods ...................................................................................121
Failure Criteria ...................................................................................................126
Accelerated Life Tests .....................................................................................................127
4.3.1
4.3.2
4.3.3
4.3.4
4.3.5
Purpose of Accelerated Life Tests ...................................................................127
Acceleration by Temperature ..........................................................................127
Acceleration by Temperature and Humidity ..................................................128
Acceleration by Voltage ...................................................................................128
Acceleration by Temperature Difference ........................................................129
4.4Reliability Evaluation 130
4.4.1
4.4.2
Test Element Group (TEG) ...............................................................................130
TEG for Reliability Evaluation ..........................................................................130
4.4.2.1
4.4.2.2
4.4.2.3
4.4.2.4
4.4.3
Process TEG ....................................................................................130
Circuit TEG ......................................................................................131
Bipolar Discrete TEG ......................................................................131
Package Evaluation TEG ................................................................132
Reliability Evaluation Methods Using TEG .....................................................134
4.4.3.1Wafer Level Reliability (WLR) ........................................................134
4.136
4.5.1Semiconductor Device Failure Rate ................................................................136
4.5.1.1
4.5.1.2
4.5.1.3
4.5.1.4
4.5.2
4.5.3
4.5.4
Semiconductor Device Failure Regions .......................................136
Initial Failures .................................................................................137
Random Failures ............................................................................139
Wear-out Failures ...........................................................................140
Acceleration Theory ..........................................................................................141
Stress Acceleration Tests .................................................................................143
Failure Rate Prediction Case Studies ..............................................................144
4.6
4.7
151
Reliability 152
118
2024年5月8日发(作者：贾宏阔)
CHAPTER
4-RELIABILITY TESTS AND
RELIABILITY PREDICTION
4
CHAPTER 4 - RELIABILITY TESTS AND RELIABILITY PREDICTION
4.1
4.2
Approach 120
What are 121
4.2.1
4.2.2
4.2.3
4.3
Reliability Test Significance and Purpose .......................................................121
Reliability Test Methods ...................................................................................121
Failure Criteria ...................................................................................................126
Accelerated Life Tests .....................................................................................................127
4.3.1
4.3.2
4.3.3
4.3.4
4.3.5
Purpose of Accelerated Life Tests ...................................................................127
Acceleration by Temperature ..........................................................................127
Acceleration by Temperature and Humidity ..................................................128
Acceleration by Voltage ...................................................................................128
Acceleration by Temperature Difference ........................................................129
4.4Reliability Evaluation 130
4.4.1
4.4.2
Test Element Group (TEG) ...............................................................................130
TEG for Reliability Evaluation ..........................................................................130
4.4.2.1
4.4.2.2
4.4.2.3
4.4.2.4
4.4.3
Process TEG ....................................................................................130
Circuit TEG ......................................................................................131
Bipolar Discrete TEG ......................................................................131
Package Evaluation TEG ................................................................132
Reliability Evaluation Methods Using TEG .....................................................134
4.4.3.1Wafer Level Reliability (WLR) ........................................................134
4.136
4.5.1Semiconductor Device Failure Rate ................................................................136
4.5.1.1
4.5.1.2
4.5.1.3
4.5.1.4
4.5.2
4.5.3
4.5.4
Semiconductor Device Failure Regions .......................................136
Initial Failures .................................................................................137
Random Failures ............................................................................139
Wear-out Failures ...........................................................................140
Acceleration Theory ..........................................................................................141
Stress Acceleration Tests .................................................................................143
Failure Rate Prediction Case Studies ..............................................................144
4.6
4.7
151
Reliability 152
118