2024年5月23日发(作者：柳念之)
查询TEA5767HN供应商
INTEGRATED CIRCUITS
DATA SHEET
TEA5767HN
Low-power FM stereo radio for
handheld applications
Preliminary specification2002Sep13
Philips Semiconductors
Low-power FM stereo radio for
handheld applications
CONTENTS
1FEATURES
2GENERAL DESCRIPTION
3ORDERING INFORMATION
4QUICK REFERENCE DATA
5BLOCK DIAGRAM
6PINNING
7FUNCTIONAL DESCRIPTION
7.1Low-noise RF amplifier
7.2FM mixer
7.3VCO
7.4Crystal oscillator
7.5PLL tuning system
7.6RF AGC
7.7IF filter
7.8FM demodulator
7.9Level voltage generator and analog-to-digital
converter
7.10IF counter
7.11Soft mute
7.12MPX decoder
7.13Signal dependent mono to stereo blend
7.14Signal dependent AF response
7.15Software programmable ports
7.16I
2
C-bus and 3-wire bus
8I
2
C-BUS, 3-WIRE BUS AND
BUS-CONTROLLED FUNCTIONS
8.1I
2
C-bus specification
8.1.1Data transfer
8.1.2Power-on reset
8.2I
2
C-bus protocol
8.33-wire bus specification
8.3.1Data transfer
8.3.2Power-on reset
8.4Writing data
8.5Reading data
8.6Bus timing
2002Sep13
Preliminary specification
TEA5767HN
9LIMITING VALUES
10THERMAL CHARACTERISTICS
11DCCHARACTERISTICS
12AC CHARACTERISTICS
13INTERNAL PIN CONFIGURATION
14APPLICATION INFORMATION
15PACKAGE OUTLINE
16SOLDERING
16.1Introduction to soldering surface mount
packages
16.2Reflow soldering
16.3Wave soldering
16.4Manual soldering
16.5Suitability of surface mount IC packages for
wave and reflow soldering methods
17DATA SHEET STATUS
18DEFINITIONS
19DISCLAIMERS
20PURCHASE OF PHILIPS I
2
C COMPONENTS
2
2024年5月23日发(作者：柳念之)
查询TEA5767HN供应商
INTEGRATED CIRCUITS
DATA SHEET
TEA5767HN
Low-power FM stereo radio for
handheld applications
Preliminary specification2002Sep13
Philips Semiconductors
Low-power FM stereo radio for
handheld applications
CONTENTS
1FEATURES
2GENERAL DESCRIPTION
3ORDERING INFORMATION
4QUICK REFERENCE DATA
5BLOCK DIAGRAM
6PINNING
7FUNCTIONAL DESCRIPTION
7.1Low-noise RF amplifier
7.2FM mixer
7.3VCO
7.4Crystal oscillator
7.5PLL tuning system
7.6RF AGC
7.7IF filter
7.8FM demodulator
7.9Level voltage generator and analog-to-digital
converter
7.10IF counter
7.11Soft mute
7.12MPX decoder
7.13Signal dependent mono to stereo blend
7.14Signal dependent AF response
7.15Software programmable ports
7.16I
2
C-bus and 3-wire bus
8I
2
C-BUS, 3-WIRE BUS AND
BUS-CONTROLLED FUNCTIONS
8.1I
2
C-bus specification
8.1.1Data transfer
8.1.2Power-on reset
8.2I
2
C-bus protocol
8.33-wire bus specification
8.3.1Data transfer
8.3.2Power-on reset
8.4Writing data
8.5Reading data
8.6Bus timing
2002Sep13
Preliminary specification
TEA5767HN
9LIMITING VALUES
10THERMAL CHARACTERISTICS
11DCCHARACTERISTICS
12AC CHARACTERISTICS
13INTERNAL PIN CONFIGURATION
14APPLICATION INFORMATION
15PACKAGE OUTLINE
16SOLDERING
16.1Introduction to soldering surface mount
packages
16.2Reflow soldering
16.3Wave soldering
16.4Manual soldering
16.5Suitability of surface mount IC packages for
wave and reflow soldering methods
17DATA SHEET STATUS
18DEFINITIONS
19DISCLAIMERS
20PURCHASE OF PHILIPS I
2
C COMPONENTS
2