2024年5月26日发(作者:奉家欣)
元器件交易网
3MBI150UC-120
IGBT Module U-Series
Features
· High speed switching
· Voltage drive
· Low inductance module structure
· With shunt resistors
1200V / 150A 3 in one-package
Applications
· Inverter for Motor drive
· AC and DC Servo drive amplifier
· Uninterruptible power supply
· Industrial machines, such as Welding machines
Maximum ratings and characteristics
Absolute maximum ratings (at Tc=25°C unless otherwise specified)
Item
Collector-Emitter voltage
Gate-Emitter voltaga
Collector current
Symbol
V
CES
V
GES
I
C
I
C
p
-I
C
-I
C
pulse
P
C
T
j
T
stg
V
iso
ConditionsRating
1200
±20
200
150
400
300
150
300
735
+150
-40 to +125
2500
3.5
Unit
V
V
A
Continuous
Tc=25°C
Tc=80°C
1ms
Tc=25°C
Tc=80°C
Collector Power Dissipation
Junction temperature
Storage temperature
Isolation voltage
between terminal and copper base *1
Screw Torque Mounting *
2
1 device
W
°C
VAC
N·m
AC:1min.
*
1 :
All terminals should be connected together when isolation test will be done.
*
2 :
Recommendable value : 2.5 to 3.5 N·m(M5)
Electrical characteristics (at Tj=25°C unless otherwise specified)
Item
Symbols
Zero gate voltage collector current
Gate-Emitter leakage current
Gate-Emitter threshold voltage
Collector-Emitter saturation voltage
Input capacitance
Turn-on time
I
CES
I
GES
V
GE(th)
V
CE(sat)
(chip)
C
ies
t
on
t
r
t
r(i)
t
off
t
f
V
F
(chip)
t
rr
R lead
R shunt
Conditions
V
GE
=0V, V
CE
=1200V
V
CE
=0V, V
GE
=±20V
V
CE
=20V, I
C
=150mA
V
GE
=15V, I
C
=150A
Tj=25°C
Tj=125°C
V
CE
=10V, V
GE
=0V, f=1MHz
V
CC
=600V
I
C
=150A
V
GE
=±15V
R
G
=2.2 Ω
Tj=25°C
V
GE
=0V
Tj=125°C
I
F
=150A
I
F
=150A
Without shunt resistance
Resistance of R1 to R6 *4
Characteristics Unit
. Max.
mA
––1.0
nA
––200
V
4.56.58.5
V
–1.752.10
–
–
–
–
–
–
–
–
–
–
–
–
2.00
17
0.36
0.21
0.03
0.37
0.07
1.60
1.70
–
5.1
2.4
–
–
1.20
0.60
–
1.00
0.30
1.90
–
0.35
–
–
nF
µs
Turn-off time
Forward on voltage
Reverse recovery time
Lead resistance, terminal-chip*3
Shunt resistance
V
µs
mΩ
*3: Biggest internal terminal resistance among arm.
*4 R1 to R2 is shown in equivalent circuit (p5)
Thermal resistance characteristics
Items Symbols
Thermal resistance
Contact Thermal resistance
Rth(j-c)
Rth(j-c)
Rth(c-f)*
5
Conditions
IGBT
FWD
With thermal compound
Characteristics Unit
. Max.
––0.17
°C/W
––0.28
°C/W
–0.05 –
°C/W
*
5
:
This is the value which is defined mounting on the additional cooling fin with thermal compound.
元器件交易网
3MBI150UC-120
Characteristics (Representative)
Collector current vs. Collector-Emitter voltage (typ.)
Tj= 25°C / chip
400
VGE=20V15V12V
300
]
A
[
c
I
:
t
n
e
r
r
u
200
c
r
10V
o
t
c
e
l
l
o
C
100
8V
0
012345
Collector-Emitter voltage : VCE [V]
Collector current vs. Collector-Emitter voltage (typ.)
VGE=15V / chip
400
300
Tj=25°C
]
A
[
c
I
:
Tj=125°C
t
n
e
r
r
u
200
c
r
o
t
c
e
l
l
o
C
100
0
01234
Collector-Emitter voltage : VCE [V]
Capacitance vs. Collector-Emitter voltage (typ.)
VGE=0V, f= 1MHz, Tj= 25°C
100.0
]
F
Cies
n
[
s
e
r
10.0
C
,
s
e
o
C
,
s
e
Cres
i
C
:
e
1.0
c
n
a
t
Coes
i
c
a
p
a
C
0.1
0102030
Collector-Emitter voltage : VCE [V]
IGBT Module
Collector current vs. Collector-Emitter voltage (typ.)
Tj= 125°C / chip
400
VGE=20V15V12V
300
]
A
[
c
I
:
t
n
e
r
r
u
200
c
r
o
10V
t
c
e
l
l
o
C
100
8V
0
012345
Collector-Emitter voltage : VCE [V]
Collector-Emitter voltage vs. Gate-Emitter voltage (typ.)
Tj=25°C / chip
10
8
6
4
2
Ic=300A
Ic=150A
Ic= 75A
0
510152025
Gate - Emitter voltage : VGE [ V ]
Dynamic Gate charge (typ.)
Vcc=600V, Ic=150A, Tj= 25°C
]
]
v
v
d
i
d
i
V
/
V
/
0
5
0
2
[
[
E
C
E
V
G
:
V
e
g
VGE
a
:
e
o
l
t
g
v
a
r
e
o
l
t
t
v
r
m
i
t
e
t
E
-
r
m
i
t
o
E
c
t
-
e
e
o
l
l
a
t
C
G
VCE
0
0
Gate charge : Qg [ nC ]
C
o
l
l
e
c
t
o
r
-
E
m
i
t
t
e
r
v
o
l
t
a
g
e
:
V
C
E
[
V
]
2024年5月26日发(作者:奉家欣)
元器件交易网
3MBI150UC-120
IGBT Module U-Series
Features
· High speed switching
· Voltage drive
· Low inductance module structure
· With shunt resistors
1200V / 150A 3 in one-package
Applications
· Inverter for Motor drive
· AC and DC Servo drive amplifier
· Uninterruptible power supply
· Industrial machines, such as Welding machines
Maximum ratings and characteristics
Absolute maximum ratings (at Tc=25°C unless otherwise specified)
Item
Collector-Emitter voltage
Gate-Emitter voltaga
Collector current
Symbol
V
CES
V
GES
I
C
I
C
p
-I
C
-I
C
pulse
P
C
T
j
T
stg
V
iso
ConditionsRating
1200
±20
200
150
400
300
150
300
735
+150
-40 to +125
2500
3.5
Unit
V
V
A
Continuous
Tc=25°C
Tc=80°C
1ms
Tc=25°C
Tc=80°C
Collector Power Dissipation
Junction temperature
Storage temperature
Isolation voltage
between terminal and copper base *1
Screw Torque Mounting *
2
1 device
W
°C
VAC
N·m
AC:1min.
*
1 :
All terminals should be connected together when isolation test will be done.
*
2 :
Recommendable value : 2.5 to 3.5 N·m(M5)
Electrical characteristics (at Tj=25°C unless otherwise specified)
Item
Symbols
Zero gate voltage collector current
Gate-Emitter leakage current
Gate-Emitter threshold voltage
Collector-Emitter saturation voltage
Input capacitance
Turn-on time
I
CES
I
GES
V
GE(th)
V
CE(sat)
(chip)
C
ies
t
on
t
r
t
r(i)
t
off
t
f
V
F
(chip)
t
rr
R lead
R shunt
Conditions
V
GE
=0V, V
CE
=1200V
V
CE
=0V, V
GE
=±20V
V
CE
=20V, I
C
=150mA
V
GE
=15V, I
C
=150A
Tj=25°C
Tj=125°C
V
CE
=10V, V
GE
=0V, f=1MHz
V
CC
=600V
I
C
=150A
V
GE
=±15V
R
G
=2.2 Ω
Tj=25°C
V
GE
=0V
Tj=125°C
I
F
=150A
I
F
=150A
Without shunt resistance
Resistance of R1 to R6 *4
Characteristics Unit
. Max.
mA
––1.0
nA
––200
V
4.56.58.5
V
–1.752.10
–
–
–
–
–
–
–
–
–
–
–
–
2.00
17
0.36
0.21
0.03
0.37
0.07
1.60
1.70
–
5.1
2.4
–
–
1.20
0.60
–
1.00
0.30
1.90
–
0.35
–
–
nF
µs
Turn-off time
Forward on voltage
Reverse recovery time
Lead resistance, terminal-chip*3
Shunt resistance
V
µs
mΩ
*3: Biggest internal terminal resistance among arm.
*4 R1 to R2 is shown in equivalent circuit (p5)
Thermal resistance characteristics
Items Symbols
Thermal resistance
Contact Thermal resistance
Rth(j-c)
Rth(j-c)
Rth(c-f)*
5
Conditions
IGBT
FWD
With thermal compound
Characteristics Unit
. Max.
––0.17
°C/W
––0.28
°C/W
–0.05 –
°C/W
*
5
:
This is the value which is defined mounting on the additional cooling fin with thermal compound.
元器件交易网
3MBI150UC-120
Characteristics (Representative)
Collector current vs. Collector-Emitter voltage (typ.)
Tj= 25°C / chip
400
VGE=20V15V12V
300
]
A
[
c
I
:
t
n
e
r
r
u
200
c
r
10V
o
t
c
e
l
l
o
C
100
8V
0
012345
Collector-Emitter voltage : VCE [V]
Collector current vs. Collector-Emitter voltage (typ.)
VGE=15V / chip
400
300
Tj=25°C
]
A
[
c
I
:
Tj=125°C
t
n
e
r
r
u
200
c
r
o
t
c
e
l
l
o
C
100
0
01234
Collector-Emitter voltage : VCE [V]
Capacitance vs. Collector-Emitter voltage (typ.)
VGE=0V, f= 1MHz, Tj= 25°C
100.0
]
F
Cies
n
[
s
e
r
10.0
C
,
s
e
o
C
,
s
e
Cres
i
C
:
e
1.0
c
n
a
t
Coes
i
c
a
p
a
C
0.1
0102030
Collector-Emitter voltage : VCE [V]
IGBT Module
Collector current vs. Collector-Emitter voltage (typ.)
Tj= 125°C / chip
400
VGE=20V15V12V
300
]
A
[
c
I
:
t
n
e
r
r
u
200
c
r
o
10V
t
c
e
l
l
o
C
100
8V
0
012345
Collector-Emitter voltage : VCE [V]
Collector-Emitter voltage vs. Gate-Emitter voltage (typ.)
Tj=25°C / chip
10
8
6
4
2
Ic=300A
Ic=150A
Ic= 75A
0
510152025
Gate - Emitter voltage : VGE [ V ]
Dynamic Gate charge (typ.)
Vcc=600V, Ic=150A, Tj= 25°C
]
]
v
v
d
i
d
i
V
/
V
/
0
5
0
2
[
[
E
C
E
V
G
:
V
e
g
VGE
a
:
e
o
l
t
g
v
a
r
e
o
l
t
t
v
r
m
i
t
e
t
E
-
r
m
i
t
o
E
c
t
-
e
e
o
l
l
a
t
C
G
VCE
0
0
Gate charge : Qg [ nC ]
C
o
l
l
e
c
t
o
r
-
E
m
i
t
t
e
r
v
o
l
t
a
g
e
:
V
C
E
[
V
]