2024年5月26日发(作者：竹浩涆)
赛灵思半导体（深圳）
DS180 (v2.6) February 27, 2018
7Series FPGAs Data Sheet: Overview
Product Specification
General Description
7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-
sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding
high-performance applications. The 7 series FPGAs include:
•Spartan®-7 Family: Optimized for low cost, lowest power, and high
I/O performance. Available in low-cost, very small form-factor
packaging for smallest PCB footprint.
Artix®-7 Family: Optimized for low power applications requiring serial
transceivers and high DSP and logic throughput. Provides the lowest
total bill of materials cost for high-throughput, cost-sensitive
applications.
•Kintex®-7 Family: Optimized for best price-performance with a 2X
improvement compared to previous generation, enabling a new class
of FPGAs.
Virtex®-7 Family: Optimized for highest system performance and
capacity with a 2X improvement in system performance. Highest
capability devices enabled by stacked silicon interconnect (SSI)
technology.
•
•
Built on a state-of-the-art, high-performance, low-power (HPL), 28nm, high-k metal gate (HKMG) process technology, 7series FPGAs enable an
unparalleled increase in system performance with 2.9Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3TMAC/s DSP, while consuming 50% less
power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
Summary of 7Series FPGA Features
•
•
•
•
•
•
Advanced high-performance FPGA logic based on real 6-input look-
up table (LUT) technology configurable as distributed memory.
36Kb dual-port block RAM with built-in FIFO logic for on-chip data
buffering.
High-performance SelectIO™ technology with support for DDR3
interfaces up to 1,866 Mb/s.
High-speed serial connectivity with built-in multi-gigabit transceivers
from 600Mb/s to max. rates of 6.6Gb/s up to 28.05Gb/s, offering a
special low-power mode, optimized for chip-to-chip interfaces.
A user configurable analog interface (XADC), incorporating dual
12-bit 1MSPS analog-to-digital converters with on-chip thermal and
supply sensors.
DSP slices with 25x18 multiplier, 48-bit accumulator, and pre-adder
for high-performance filtering, including optimized symmetric
coefficient filtering.
•
•
•
•
•
Powerful clock management tiles (CMT), combining phase-locked
loop (PLL) and mixed-mode clock manager (MMCM) blocks for high
precision and low jitter.
Quickly deploy embedded processing with MicroBlaze™ processor.
Integrated block for PCIExpress® (PCIe), for up to x8 Gen3
Endpoint and Root Port designs.
Wide variety of configuration options, including support for
commodity memories, 256-bit AES encryption with HMAC/SHA-256
authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-
chip packaging offering easy migration between family members in
the same package. All packages available in Pb-free and selected
packages in Pb option.
Designed for high performance and lowest power with 28nm,
HKMG, HPL process, 1.0V core voltage process technology and
0.9V core voltage option for even lower power.
•
Table 1:7Series Families Comparison
Max. Capability
Logic Cells
Block RAM
(1)
DSP Slices
DSP Performance
(2)
MicroBlaze CPU
(3)
Transceivers
Transceiver Speed
Serial Bandwidth
PCIe Interface
Memory Interface
I/O Pins
I/O Voltage
Package Options
Notes:
1.
2.
3.
Additional memory available in the form of distributed RAM.
Peak DSP performance numbers are based on symmetrical filter implementation.
Peak MicroBlaze CPU performance numbers based on microcontroller preset.
Spartan-7
102K
4.2Mb
160
176 GMAC/s
260 DMIPs
–
–
–
–
800Mb/s
400
1.2V–3.3V
Low-Cost, Wire-Bond
Artix-7
215K
13Mb
740
929GMAC/s
303 DMIPs
16
6.6Gb/s
211Gb/s
x4 Gen2
1,066Mb/s
500
1.2V–3.3V
Low-Cost, Wire-Bond,
Bare-Die Flip-Chip
Kintex-7
478K
34Mb
1,920
2,845GMAC/s
438 DMIPs
32
12.5Gb/s
800Gb/s
x8 Gen2
1,866Mb/s
500
1.2V–3.3V
Bare-Die Flip-Chip and High-
Performance Flip-Chip
Virtex-7
1,955K
68Mb
3,600
5,335GMAC/s
441 DMIPs
96
28.05Gb/s
2,784Gb/s
x8 Gen3
1,866Mb/s
1,200
1.2V–3.3V
Highest Performance
Flip-Chip
DS180 (v2.6) February 27, 2018
Product Specification
质量等级领域:宇航级IC、特军级IC、超军级IC、普军级IC、禁运IC、工
业级IC，军级二三极管，功率管等;
应用领域:航空航天、船舶、汽车电子、军用计算机、铁路、医疗电子、通
信网络、电力工业以及大型工业设备
祝您:工作顺利，生活愉快!
以赛灵思半导体（深圳）有限公司提供的参数为例，以下为XC7K325T-3FFG676E的详细参数，仅供参考
2024年5月26日发(作者：竹浩涆)
赛灵思半导体（深圳）
DS180 (v2.6) February 27, 2018
7Series FPGAs Data Sheet: Overview
Product Specification
General Description
7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-
sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding
high-performance applications. The 7 series FPGAs include:
•Spartan®-7 Family: Optimized for low cost, lowest power, and high
I/O performance. Available in low-cost, very small form-factor
packaging for smallest PCB footprint.
Artix®-7 Family: Optimized for low power applications requiring serial
transceivers and high DSP and logic throughput. Provides the lowest
total bill of materials cost for high-throughput, cost-sensitive
applications.
•Kintex®-7 Family: Optimized for best price-performance with a 2X
improvement compared to previous generation, enabling a new class
of FPGAs.
Virtex®-7 Family: Optimized for highest system performance and
capacity with a 2X improvement in system performance. Highest
capability devices enabled by stacked silicon interconnect (SSI)
technology.
•
•
Built on a state-of-the-art, high-performance, low-power (HPL), 28nm, high-k metal gate (HKMG) process technology, 7series FPGAs enable an
unparalleled increase in system performance with 2.9Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3TMAC/s DSP, while consuming 50% less
power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
Summary of 7Series FPGA Features
•
•
•
•
•
•
Advanced high-performance FPGA logic based on real 6-input look-
up table (LUT) technology configurable as distributed memory.
36Kb dual-port block RAM with built-in FIFO logic for on-chip data
buffering.
High-performance SelectIO™ technology with support for DDR3
interfaces up to 1,866 Mb/s.
High-speed serial connectivity with built-in multi-gigabit transceivers
from 600Mb/s to max. rates of 6.6Gb/s up to 28.05Gb/s, offering a
special low-power mode, optimized for chip-to-chip interfaces.
A user configurable analog interface (XADC), incorporating dual
12-bit 1MSPS analog-to-digital converters with on-chip thermal and
supply sensors.
DSP slices with 25x18 multiplier, 48-bit accumulator, and pre-adder
for high-performance filtering, including optimized symmetric
coefficient filtering.
•
•
•
•
•
Powerful clock management tiles (CMT), combining phase-locked
loop (PLL) and mixed-mode clock manager (MMCM) blocks for high
precision and low jitter.
Quickly deploy embedded processing with MicroBlaze™ processor.
Integrated block for PCIExpress® (PCIe), for up to x8 Gen3
Endpoint and Root Port designs.
Wide variety of configuration options, including support for
commodity memories, 256-bit AES encryption with HMAC/SHA-256
authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-
chip packaging offering easy migration between family members in
the same package. All packages available in Pb-free and selected
packages in Pb option.
Designed for high performance and lowest power with 28nm,
HKMG, HPL process, 1.0V core voltage process technology and
0.9V core voltage option for even lower power.
•
Table 1:7Series Families Comparison
Max. Capability
Logic Cells
Block RAM
(1)
DSP Slices
DSP Performance
(2)
MicroBlaze CPU
(3)
Transceivers
Transceiver Speed
Serial Bandwidth
PCIe Interface
Memory Interface
I/O Pins
I/O Voltage
Package Options
Notes:
1.
2.
3.
Additional memory available in the form of distributed RAM.
Peak DSP performance numbers are based on symmetrical filter implementation.
Peak MicroBlaze CPU performance numbers based on microcontroller preset.
Spartan-7
102K
4.2Mb
160
176 GMAC/s
260 DMIPs
–
–
–
–
800Mb/s
400
1.2V–3.3V
Low-Cost, Wire-Bond
Artix-7
215K
13Mb
740
929GMAC/s
303 DMIPs
16
6.6Gb/s
211Gb/s
x4 Gen2
1,066Mb/s
500
1.2V–3.3V
Low-Cost, Wire-Bond,
Bare-Die Flip-Chip
Kintex-7
478K
34Mb
1,920
2,845GMAC/s
438 DMIPs
32
12.5Gb/s
800Gb/s
x8 Gen2
1,866Mb/s
500
1.2V–3.3V
Bare-Die Flip-Chip and High-
Performance Flip-Chip
Virtex-7
1,955K
68Mb
3,600
5,335GMAC/s
441 DMIPs
96
28.05Gb/s
2,784Gb/s
x8 Gen3
1,866Mb/s
1,200
1.2V–3.3V
Highest Performance
Flip-Chip
DS180 (v2.6) February 27, 2018
Product Specification
质量等级领域:宇航级IC、特军级IC、超军级IC、普军级IC、禁运IC、工
业级IC，军级二三极管，功率管等;
应用领域:航空航天、船舶、汽车电子、军用计算机、铁路、医疗电子、通
信网络、电力工业以及大型工业设备
祝您:工作顺利，生活愉快!
以赛灵思半导体（深圳）有限公司提供的参数为例，以下为XC7K325T-3FFG676E的详细参数，仅供参考