2024年5月31日发(作者：城南珍)
Memory Module Specifi cations
KHX2400C11D3K4/8GX
8GB (2GB 256M x 64-Bit x 4 pcs.)
DDR3-2400 CL11 240-Pin DIMM Kit
SPECIFICATIONS
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Power (Operating)
UL Rating
Operating Temperature
Storage Temperature
9 cycles
49.5ns (min.)
160ns (min.)
36ns (min.)
0.795 W* (per module)
94 V - 0
0
o
C to 85
o
C
-55
o
C to +100
o
C
*Power will vary depending on the SDRAM used.
DESCRIPTION
Kingston's KHX2400C11D3K4/8GX is a kit of four 256M x 64-
bit (2GB) DDR3-2400 CL11 SDRAM (Synchronous DRAM)
1Rx8 memory modules, based on eight 256M x 8-bit DDR3
FBGA components per module. Each module kit supports
Intel
®
XMP (Extreme Memory Profiles). Total kit capacity is
8GB. Each module kit has been tested to run at DDR3-2400 at
a low latency timing of 11-13-11 at 1.65V. The SPDs are
programmed to JEDEC standard latency DDR3-1333 timing of
9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers.
The JEDEC standard electrical and mechanical specifications
are as follows:
FEATURES
•
•
•
•
•
•
•
•
•
•
JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
VDDQ = 1.5V (1.425V ~ 1.575V)
667MHz fCK for 1333Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 9, 8, 7, 6
Posted CAS
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
Asynchronous Reset
PCB : Height 1.18” (30mm) w/ heat spreader,
single sided component
Continued >>
XMP TIMING PARAMETERS
•
•
•
JEDEC:*********************
XMPProfile#1:***********************
XMPProfile#2:***********************
•
•
•
•
•
•
Document No. 4806244-001.A00 11/14/11 Page 1
continuedHyperX
MODULE DIMENSIONS
30.00
Units: millimeters
133.35
18.80
15.80
11.00
8.00
0.00
0
.
0
0
MODULE WITH HEAT SPREADER
FOR MORE INFORMATION, GO TO
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
5
4
.
7
0
Document No. 4806244-001.A00 Page 2
2024年5月31日发(作者：城南珍)
Memory Module Specifi cations
KHX2400C11D3K4/8GX
8GB (2GB 256M x 64-Bit x 4 pcs.)
DDR3-2400 CL11 240-Pin DIMM Kit
SPECIFICATIONS
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Power (Operating)
UL Rating
Operating Temperature
Storage Temperature
9 cycles
49.5ns (min.)
160ns (min.)
36ns (min.)
0.795 W* (per module)
94 V - 0
0
o
C to 85
o
C
-55
o
C to +100
o
C
*Power will vary depending on the SDRAM used.
DESCRIPTION
Kingston's KHX2400C11D3K4/8GX is a kit of four 256M x 64-
bit (2GB) DDR3-2400 CL11 SDRAM (Synchronous DRAM)
1Rx8 memory modules, based on eight 256M x 8-bit DDR3
FBGA components per module. Each module kit supports
Intel
®
XMP (Extreme Memory Profiles). Total kit capacity is
8GB. Each module kit has been tested to run at DDR3-2400 at
a low latency timing of 11-13-11 at 1.65V. The SPDs are
programmed to JEDEC standard latency DDR3-1333 timing of
9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers.
The JEDEC standard electrical and mechanical specifications
are as follows:
FEATURES
•
•
•
•
•
•
•
•
•
•
JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
VDDQ = 1.5V (1.425V ~ 1.575V)
667MHz fCK for 1333Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 9, 8, 7, 6
Posted CAS
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
Asynchronous Reset
PCB : Height 1.18” (30mm) w/ heat spreader,
single sided component
Continued >>
XMP TIMING PARAMETERS
•
•
•
JEDEC:*********************
XMPProfile#1:***********************
XMPProfile#2:***********************
•
•
•
•
•
•
Document No. 4806244-001.A00 11/14/11 Page 1
continuedHyperX
MODULE DIMENSIONS
30.00
Units: millimeters
133.35
18.80
15.80
11.00
8.00
0.00
0
.
0
0
MODULE WITH HEAT SPREADER
FOR MORE INFORMATION, GO TO
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
5
4
.
7
0
Document No. 4806244-001.A00 Page 2