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FPGA可编程逻辑器件芯片XCVU11P-2FSGD2104I中文规格书

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2024年6月1日发(作者:钞秀越)

Chapter 1:Packaging Overview

Table 1-1:Package Specifications (Cont’d)

Description

Package Specifications

Package TypePitch (mm)Size (mm)

Packages

(1)

FFVA1760

FFVB1760

FFVE1760

FLVB1760

FLGF1924

FLVD1924

FLVF1924

FSVH1924

RLF1924

FFVA2104

FFVB2104

FFVC2104

FLVA2104

FLVB2104

FLVC2104

FLGA2104

FLGB2104

FLGC2104

FLRA2104

FLRB2104

FLRC2104

FSGD2104

FSVH2104

FHGA2104

(2)

FHGB2104

(2)

FHGC2104

(2)

FIGD2104

(2)

FLGB2377

FLGA2577

FSGA2577

FLGA2892

FSVH2892

Flip-chip, fine-pitch

Flip-chip, fine-pitch

42.5x42.5

SSI, flip-chip, fine-pitch

45x45

SSI, flip-chip, fine-pitch, lidless with stiffener ring

Ruggedized, SSI, flip-chip, fine-pitch

47.5x47.5

SSI, flip-chip, fine-pitch

SSI, flip-chip, fine-pitch, RoHS 6/6 with exemption 15

BGA1.0

47.5x47.5

Ruggedized, SSI, flip-chip, fine-pitch

SSI, flip-chip, fine-pitch, lidless with stiffener ring,

RoHS 6/6 with exemption 15

SSI, flip-chip, fine-pitch, lidless with stiffener ring

SSI, flip-chip, fine-pitch, overhang, RoHS 6/6 with

exemption 15

SSI, flip-chip, fine-pitch, overhang, lidless with

stiffener ring, RoHS 6/6 with exemption 15

SSI, flip-chip, fine-pitch, RoHS 6/6 with exemption 15

SSI, flip-chip, fine-pitch, RoHS 6/6 with exemption 15

SSI, flip-chip, fine-pitch, lidless with stiffener ring,

RoHS 6/6 with exemption 15

SSI, flip-chip, fine-pitch, RoHS 6/6 with exemption 15

SSI, flip-chip, fine-pitch, lidless with stiffener ring

BGA1.0

47.5x47.5

47.5x47.5

47.5x47.5

52.5x52.5

52.5x52.5

50x50

52.5x52.5

52.5x52.5

55x55

55x55

UltraScale Device Packaging and Pinouts

UG575 (v1.14) March 18, 2020

Chapter 1:Packaging Overview

Table 1-1:Package Specifications (Cont’d)

Description

SSI, flip-chip, fine-pitch, lidless with stiffener ring

SSI, flip-chip, fine-pitch, lidless with stiffener ring

Packages

(1)

FSVA3824

FSVB3824

Notes:

Package Specifications

Package TypePitch (mm)

BGA

BGA

1.0

1.0

Size (mm)

65x65

65x65

, FLV, and FLG packages are footprint compatible when the package code letter designator and pin count are identical.

See UltraScale Architecture and Product Overview (DS890) [Ref1] for specific letter codes and ordering code information.

52.5x52.5 packages have the same PCB ball footprint as the 47.5x47.5 packages and are footprint compatible.

Device

Kintex UltraScale Devices

XCKU035

XCKU040

XCKU035

XCKU040

XCKU035

XCKU040

XCKU025

XCKU035

XCKU040

XCKU060

XCKU095

XCKU060

XCKU085

XCKU115

XCKU095

XCKU115

XCKU095

FFVA1517

FLVA1517

FFVC1517

FLVD1517

FFVB1760

FFVA1156

FBVA676

SFVA784

FBVA900

PackageGTH Channels

16

16

8

8

16

16

12

16

20

28

20

32

48

48

20

64

32

GTY Channels

0

0

0

0

0

0

0

0

0

0

8

0

0

0

20

0

16

UltraScale Device Packaging and Pinouts

UG575 (v1.14) March 18, 2020

Chapter 1:Packaging Overview

Table 1-2:

XCKU085

XCKU115

XCKU115

XCKU085

XCKU115

XCKU115

XCKU095

XCKU115

XQKU040

XQKU040

XQKU060

XQKU095

XQKU115

XQKU115

RLD1517

RLF1924

RFA1156

Serial Transceiver Channels (GTH/GTY) by Device/Package (Cont’d)

Package

FLVB1760

FLVD1924

FLVF1924

FLVA2104

FFVB2104

FLVB2104

RBA676

DeviceGTH Channels

44

52

52

56

64

52

32

64

16

20

28

20

64

64

GTY Channels

0

0

0

0

0

0

32

0

0

0

0

0

0

0

Virtex UltraScale Devices

XCVU065

XCVU080

XCVU095

XCVU080

XCVU095

XCVU125

XCVU080

XCVU095

XCVU125

XCVU080

XCVU095

XCVU125

XCVU080

XCVU095

XCVU125

XCVU160

XCVU190

XCVU095

XCVU125

FFVD1517

FLVD1517

FFVB1760

FLVB1760

FFVA2104

FLVA2104

FFVB2104

FLVB2104

FLGB2104

FFVC2104

FLVC2104

FFVC1517

20

20

20

32

32

40

32

32

36

28

28

28

32

32

40

40

40

32

40

20

20

20

32

32

32

16

16

16

24

24

24

32

32

36

36

36

32

40

UltraScale Device Packaging and Pinouts

UG575 (v1.14) March 18, 2020

Chapter 1:Packaging Overview

UltraScale Device Packaging and Pinouts

UG575 (v1.14) March 18, 2020

Chapter 1:Packaging Overview

Table 1-2:

XQVU3P

XQVU7P

XQVU7P

XQVU11P

Serial Transceiver Channels (GTH/GTY) by Device/Package (Cont’d)

Package

FFRC1517

FLRA2104

FLRB2104

FLRC2104

DeviceGTH Channels

0

0

0

0

GTY Channels

40

52

76

96

Table 1-3:Serial Transceiver Channels (GTH/GTY/GTM) by Device/Package

PackageGTH ChannelsGTY ChannelsGTM Channels

0

0

0

0

16

16

32

32

30

30

48

48

Device

Virtex UltraScale+ Devices

XCVU27P

XCVU29P

XCVU27P

XCVU29P

FIGD2104

FSGA2577

UltraScale Device Packaging and Pinouts

UG575 (v1.14) March 18, 2020

2024年6月1日发(作者:钞秀越)

Chapter 1:Packaging Overview

Table 1-1:Package Specifications (Cont’d)

Description

Package Specifications

Package TypePitch (mm)Size (mm)

Packages

(1)

FFVA1760

FFVB1760

FFVE1760

FLVB1760

FLGF1924

FLVD1924

FLVF1924

FSVH1924

RLF1924

FFVA2104

FFVB2104

FFVC2104

FLVA2104

FLVB2104

FLVC2104

FLGA2104

FLGB2104

FLGC2104

FLRA2104

FLRB2104

FLRC2104

FSGD2104

FSVH2104

FHGA2104

(2)

FHGB2104

(2)

FHGC2104

(2)

FIGD2104

(2)

FLGB2377

FLGA2577

FSGA2577

FLGA2892

FSVH2892

Flip-chip, fine-pitch

Flip-chip, fine-pitch

42.5x42.5

SSI, flip-chip, fine-pitch

45x45

SSI, flip-chip, fine-pitch, lidless with stiffener ring

Ruggedized, SSI, flip-chip, fine-pitch

47.5x47.5

SSI, flip-chip, fine-pitch

SSI, flip-chip, fine-pitch, RoHS 6/6 with exemption 15

BGA1.0

47.5x47.5

Ruggedized, SSI, flip-chip, fine-pitch

SSI, flip-chip, fine-pitch, lidless with stiffener ring,

RoHS 6/6 with exemption 15

SSI, flip-chip, fine-pitch, lidless with stiffener ring

SSI, flip-chip, fine-pitch, overhang, RoHS 6/6 with

exemption 15

SSI, flip-chip, fine-pitch, overhang, lidless with

stiffener ring, RoHS 6/6 with exemption 15

SSI, flip-chip, fine-pitch, RoHS 6/6 with exemption 15

SSI, flip-chip, fine-pitch, RoHS 6/6 with exemption 15

SSI, flip-chip, fine-pitch, lidless with stiffener ring,

RoHS 6/6 with exemption 15

SSI, flip-chip, fine-pitch, RoHS 6/6 with exemption 15

SSI, flip-chip, fine-pitch, lidless with stiffener ring

BGA1.0

47.5x47.5

47.5x47.5

47.5x47.5

52.5x52.5

52.5x52.5

50x50

52.5x52.5

52.5x52.5

55x55

55x55

UltraScale Device Packaging and Pinouts

UG575 (v1.14) March 18, 2020

Chapter 1:Packaging Overview

Table 1-1:Package Specifications (Cont’d)

Description

SSI, flip-chip, fine-pitch, lidless with stiffener ring

SSI, flip-chip, fine-pitch, lidless with stiffener ring

Packages

(1)

FSVA3824

FSVB3824

Notes:

Package Specifications

Package TypePitch (mm)

BGA

BGA

1.0

1.0

Size (mm)

65x65

65x65

, FLV, and FLG packages are footprint compatible when the package code letter designator and pin count are identical.

See UltraScale Architecture and Product Overview (DS890) [Ref1] for specific letter codes and ordering code information.

52.5x52.5 packages have the same PCB ball footprint as the 47.5x47.5 packages and are footprint compatible.

Device

Kintex UltraScale Devices

XCKU035

XCKU040

XCKU035

XCKU040

XCKU035

XCKU040

XCKU025

XCKU035

XCKU040

XCKU060

XCKU095

XCKU060

XCKU085

XCKU115

XCKU095

XCKU115

XCKU095

FFVA1517

FLVA1517

FFVC1517

FLVD1517

FFVB1760

FFVA1156

FBVA676

SFVA784

FBVA900

PackageGTH Channels

16

16

8

8

16

16

12

16

20

28

20

32

48

48

20

64

32

GTY Channels

0

0

0

0

0

0

0

0

0

0

8

0

0

0

20

0

16

UltraScale Device Packaging and Pinouts

UG575 (v1.14) March 18, 2020

Chapter 1:Packaging Overview

Table 1-2:

XCKU085

XCKU115

XCKU115

XCKU085

XCKU115

XCKU115

XCKU095

XCKU115

XQKU040

XQKU040

XQKU060

XQKU095

XQKU115

XQKU115

RLD1517

RLF1924

RFA1156

Serial Transceiver Channels (GTH/GTY) by Device/Package (Cont’d)

Package

FLVB1760

FLVD1924

FLVF1924

FLVA2104

FFVB2104

FLVB2104

RBA676

DeviceGTH Channels

44

52

52

56

64

52

32

64

16

20

28

20

64

64

GTY Channels

0

0

0

0

0

0

32

0

0

0

0

0

0

0

Virtex UltraScale Devices

XCVU065

XCVU080

XCVU095

XCVU080

XCVU095

XCVU125

XCVU080

XCVU095

XCVU125

XCVU080

XCVU095

XCVU125

XCVU080

XCVU095

XCVU125

XCVU160

XCVU190

XCVU095

XCVU125

FFVD1517

FLVD1517

FFVB1760

FLVB1760

FFVA2104

FLVA2104

FFVB2104

FLVB2104

FLGB2104

FFVC2104

FLVC2104

FFVC1517

20

20

20

32

32

40

32

32

36

28

28

28

32

32

40

40

40

32

40

20

20

20

32

32

32

16

16

16

24

24

24

32

32

36

36

36

32

40

UltraScale Device Packaging and Pinouts

UG575 (v1.14) March 18, 2020

Chapter 1:Packaging Overview

UltraScale Device Packaging and Pinouts

UG575 (v1.14) March 18, 2020

Chapter 1:Packaging Overview

Table 1-2:

XQVU3P

XQVU7P

XQVU7P

XQVU11P

Serial Transceiver Channels (GTH/GTY) by Device/Package (Cont’d)

Package

FFRC1517

FLRA2104

FLRB2104

FLRC2104

DeviceGTH Channels

0

0

0

0

GTY Channels

40

52

76

96

Table 1-3:Serial Transceiver Channels (GTH/GTY/GTM) by Device/Package

PackageGTH ChannelsGTY ChannelsGTM Channels

0

0

0

0

16

16

32

32

30

30

48

48

Device

Virtex UltraScale+ Devices

XCVU27P

XCVU29P

XCVU27P

XCVU29P

FIGD2104

FSGA2577

UltraScale Device Packaging and Pinouts

UG575 (v1.14) March 18, 2020

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