2024年6月3日发(作者：漆雕夏柳)

Agilent 5DXSeries 5000

System Specifications

Key Specifications

System Application

The Agilent 5DX Series 5000 is designed for in-line or off-

line automated process testing of solder connections on

PCB assemblies, with pass-thru or pass-back loading. The

system can be used for all standard joint-types and fully

supports inspection of single and double-sided boards hav-

ing dimensions up to 457 x 609 mm (18 x 24 in.).

less than 4% for all component types except capacitors and

through-hole. Note: the minimum repeatability standard

deviation is 0.0025 mm (0.0001 in.).

Test Approach

Digital cross-sectional X-ray images of solder joints are

automatically generated and analyzed. The analysis results

includes a complete quantitative description of each joint,

as well as a list of all defective solder connections found.

Special confirmation and adjustment routines provide sol-

der thickness of key solder joint parameters.

Performance Specifications

Test Speed (joint/sec)

The exact speed depends on the density of the component

layout on the circuit board. Generally speaking, the more

dense the circuit board, the higher the test speed. The typi-

cal range in test speeds is from 80 to 140 joints/second

(including inspection, alignment, surface map, and board

handling time).

Solder Thickness Measurement Repeatability

Solder thickness from 0.05 to 0.25 mm (0.002 to 0.010 in.)

can be measured with a repeatability standard deviation of

Image Acquisition Time (including movement)

Up to 5 images per second.

Load/Unload Time

General Specifications:

Model 5300A

Description

Field of View

Joint Pitch

Top Clearance

Bottom Clearance

Very Fine Pitch

From 5. to

(0.2 to 0.85 in.)

0.3 mm

†

& up

(0.012 in.

†

& up)

9.4 to *

(0.37to1.0 in.*)

30 mm*

(1.2 in.*)

12 seconds per panel for pass-through mode, 15 seconds for

pass-back mode, 6 seconds per panel using dual loading.

Model 5400A

Ultra Fine Pitch

From 5. to

(0.2 to 0.85 in.)

0.2mm

†

& up

(0.008 in.

†

& up)

9.4 to *

(0.37to1.0 in.*)

30 mm*

(1.2 in.*)

Agilent 5DX Series 5000 Model Specifications

Alignment Time

3 to 8 seconds (depending on board size).

Surface Map Time (Points/Second)

Up to 5 points/sec (typical map density is 1 point /

645–2580 sq. mm (1–4 sq. in.).

Board Specifications / Tolerances

Board Handling Size (width x length)

Max.:

Min.:

Aspect Ratio:

457 x 609 mm* (18.0 x 24.0 in.*)

102 x 127 mm† (4.0 x 5.0 in.†)

Board length > = 0.5 x board width*

*Measured from the bottom of the circuit board including a maximum warpage of

1.5mm (0.060 in.). If components at the maximum top clearance are used, slices

cannot extend more than 0.5mm (0.020 in.) below the bottom surface of the

board.

†Assuming pad width is 50% of pitch.

Data is subject to change without notice.

*Boards are handled on the width edges.

†Smaller boards are possible with the use of board carriers.

Maximum Test Area

Board thickness

Max.:

Min.:

A

A

A

System Confirmation & Adjustment

The system automatically adjusts for the following:

•X-ray beam and rotary detector synchronization

•X and Y homing position

•Z homing position

•Gray-scale to solder thickness

•Plane of focus

Review Defects

Review Defects provides the operators a review of a test-

ed board.

445 x 597 mm (17.5 x 23.5 in.)

3.2 mm (0.125 in.)

0.5 mm (0.020 in.)

Maximum and minimum board thickness limits can be exceeded with the use of

board carriers.

Board Width Tolerance

± 0.7 mm (0.0275 in.)

Board Edge Clearance

3 mm (0.118 in.) on parallel edges of the board

(top and bottom side clearance requirement)

Test Development Software

Microsoft Windows®-based software (TestLink) is provid-

ed to input and translate the board layout data into

machine-readable format. CAMCAD Professional soft-

ware is available to translate CAD data to Agilent’s for-

t Supported Application Programming

(ASAP) provides standardized best-practice procedures

for test development. Package Library providescentral

management of all test parameters across all board types.

Test development Workstation allows the majority of test

development to be completed off of Agilent 5DX system.

Board Warpage (after reflow and wave soldering)

Normal board usage requires a warpage of less than 1%*

of any linear dimension (0.01 in./in. or 0.01 mm/mm),

assuming that the overall board dimensions still fit within

the board clearance and width specifications. Maximum

board warpage cannot exceed 2 mm† (0.08 in.†).

Board warpage of 0.5% or less is required to

maximize throughput for some device types.

*Boards with larger warpage percentages can be inspected, but

will require additional surface map points and analysis views.

Board must still fit general boardclearance specifications.

†1.5 mm (0.06 in.) for the Model 5300A/5400A.

Test Development Time (typical)

•Less than 30 minutes to translate and verify CAD data

(using CAMCAD Professional).

•4 hours to 3 days to set up board (including setting

thresholds, laser points, and camera).

Note: board programming time depends greatly on the

board complexity and programmer experience.

Maximum Acceptable Board Weight

(including board carrier)

4.5 Kg (10 lb.)

1 Kg (2.2 lb.) per panel with dual load option

Minimum Acceptable Board Weight

0.03 Kg (.066 lb.)

Board Alignment

The system aligns on solder joints on the boards under

test.

Maximum Acceptable Board Temperatures

(at time of load)

40°C (104°F)

Software Features

Menu Driven Interface

Operator-mode

Used in normal Automatic Test mode. Operator can input

subpanel identification using bar-code or keyboard Or

the 5DXcan run automatically, without operator inter-

vention. Serial number can be used to automatically

select the proper panel program. Bar-codes can be auto-

matically scanned with an in-line bar-code reader (not

included).

Supervisor-mode

Allows complete control of the system which includes

algorithm setup and debug, CAD data generation, and sys-

tem diagnostics.

Data is subject to change without notice.

2

2024年6月3日发(作者：漆雕夏柳)

Agilent 5DXSeries 5000

System Specifications

Key Specifications

System Application

The Agilent 5DX Series 5000 is designed for in-line or off-

line automated process testing of solder connections on

PCB assemblies, with pass-thru or pass-back loading. The

system can be used for all standard joint-types and fully

supports inspection of single and double-sided boards hav-

ing dimensions up to 457 x 609 mm (18 x 24 in.).

less than 4% for all component types except capacitors and

through-hole. Note: the minimum repeatability standard

deviation is 0.0025 mm (0.0001 in.).

Test Approach

Digital cross-sectional X-ray images of solder joints are

automatically generated and analyzed. The analysis results

includes a complete quantitative description of each joint,

as well as a list of all defective solder connections found.

Special confirmation and adjustment routines provide sol-

der thickness of key solder joint parameters.

Performance Specifications

Test Speed (joint/sec)

The exact speed depends on the density of the component

layout on the circuit board. Generally speaking, the more

dense the circuit board, the higher the test speed. The typi-

cal range in test speeds is from 80 to 140 joints/second

(including inspection, alignment, surface map, and board

handling time).

Solder Thickness Measurement Repeatability

Solder thickness from 0.05 to 0.25 mm (0.002 to 0.010 in.)

can be measured with a repeatability standard deviation of

Image Acquisition Time (including movement)

Up to 5 images per second.

Load/Unload Time

General Specifications:

Model 5300A

Description

Field of View

Joint Pitch

Top Clearance

Bottom Clearance

Very Fine Pitch

From 5. to

(0.2 to 0.85 in.)

0.3 mm

†

& up

(0.012 in.

†

& up)

9.4 to *

(0.37to1.0 in.*)

30 mm*

(1.2 in.*)

12 seconds per panel for pass-through mode, 15 seconds for

pass-back mode, 6 seconds per panel using dual loading.

Model 5400A

Ultra Fine Pitch

From 5. to

(0.2 to 0.85 in.)

0.2mm

†

& up

(0.008 in.

†

& up)

9.4 to *

(0.37to1.0 in.*)

30 mm*

(1.2 in.*)

Agilent 5DX Series 5000 Model Specifications

Alignment Time

3 to 8 seconds (depending on board size).

Surface Map Time (Points/Second)

Up to 5 points/sec (typical map density is 1 point /

645–2580 sq. mm (1–4 sq. in.).

Board Specifications / Tolerances

Board Handling Size (width x length)

Max.:

Min.:

Aspect Ratio:

457 x 609 mm* (18.0 x 24.0 in.*)

102 x 127 mm† (4.0 x 5.0 in.†)

Board length > = 0.5 x board width*

*Measured from the bottom of the circuit board including a maximum warpage of

1.5mm (0.060 in.). If components at the maximum top clearance are used, slices

cannot extend more than 0.5mm (0.020 in.) below the bottom surface of the

board.

†Assuming pad width is 50% of pitch.

Data is subject to change without notice.

*Boards are handled on the width edges.

†Smaller boards are possible with the use of board carriers.

Maximum Test Area

Board thickness

Max.:

Min.:

A

A

A

System Confirmation & Adjustment

The system automatically adjusts for the following:

•X-ray beam and rotary detector synchronization

•X and Y homing position

•Z homing position

•Gray-scale to solder thickness

•Plane of focus

Review Defects

Review Defects provides the operators a review of a test-

ed board.

445 x 597 mm (17.5 x 23.5 in.)

3.2 mm (0.125 in.)

0.5 mm (0.020 in.)

Maximum and minimum board thickness limits can be exceeded with the use of

board carriers.

Board Width Tolerance

± 0.7 mm (0.0275 in.)

Board Edge Clearance

3 mm (0.118 in.) on parallel edges of the board

(top and bottom side clearance requirement)

Test Development Software

Microsoft Windows®-based software (TestLink) is provid-

ed to input and translate the board layout data into

machine-readable format. CAMCAD Professional soft-

ware is available to translate CAD data to Agilent’s for-

t Supported Application Programming

(ASAP) provides standardized best-practice procedures

for test development. Package Library providescentral

management of all test parameters across all board types.

Test development Workstation allows the majority of test

development to be completed off of Agilent 5DX system.

Board Warpage (after reflow and wave soldering)

Normal board usage requires a warpage of less than 1%*

of any linear dimension (0.01 in./in. or 0.01 mm/mm),

assuming that the overall board dimensions still fit within

the board clearance and width specifications. Maximum

board warpage cannot exceed 2 mm† (0.08 in.†).

Board warpage of 0.5% or less is required to

maximize throughput for some device types.

*Boards with larger warpage percentages can be inspected, but

will require additional surface map points and analysis views.

Board must still fit general boardclearance specifications.

†1.5 mm (0.06 in.) for the Model 5300A/5400A.

Test Development Time (typical)

•Less than 30 minutes to translate and verify CAD data

(using CAMCAD Professional).

•4 hours to 3 days to set up board (including setting

thresholds, laser points, and camera).

Note: board programming time depends greatly on the

board complexity and programmer experience.

Maximum Acceptable Board Weight

(including board carrier)

4.5 Kg (10 lb.)

1 Kg (2.2 lb.) per panel with dual load option

Minimum Acceptable Board Weight

0.03 Kg (.066 lb.)

Board Alignment

The system aligns on solder joints on the boards under

test.

Maximum Acceptable Board Temperatures

(at time of load)

40°C (104°F)

Software Features

Menu Driven Interface

Operator-mode

Used in normal Automatic Test mode. Operator can input

subpanel identification using bar-code or keyboard Or

the 5DXcan run automatically, without operator inter-

vention. Serial number can be used to automatically

select the proper panel program. Bar-codes can be auto-

matically scanned with an in-line bar-code reader (not

included).

Supervisor-mode

Allows complete control of the system which includes

algorithm setup and debug, CAD data generation, and sys-

tem diagnostics.

Data is subject to change without notice.

2