2024年7月12日发(作者:绪思天)
维普资讯
苹果i P o d N a n o拆解分析
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第三代iPod Nano将Nan,
它是苹果公司首款基于闪存的
Nano的核心设计采用三星公’
应用处理器。
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其2英寸液晶显示屏采用
英寸204像素下具有320×24
电电池在冲满电的情况下可以
视频播放达
5小时。该第三代i
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不同装配区的器件在总成本中
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不同类型的器件在总成本中所占的百分 匕
不同功能的器件在总成本中所占的百分比
分立半导体
1.O2%
电池
无源元件
机电器件
2.77%
3.36%
4.41%
电池
2.77%
电池/电源
管理
5.12%
用户接口
机械/机电
器件
1O.53%
7.67%
机械器件
6.12%
本栏目信息来源:Electronic Products DECEMBER 2007。
58 今日电子.2008年1,El
维普资讯
更多信息,请参考:,1ftp://electronicproducts.com/whatsinside
Location Component Family Qty Manufacturer Pa rt Number Component Description
ClickWheelSensorAssembly ntegrated Circuit 1 Synaptics ClickWheel Controller
Main PCB Electro-MechanicaI OPC Manufacturing Ltd. 6-Layer-FR4/RCF HDI.1+4+1
Main PCB,Bottom Discrete Semiconductor 1 On Semiconductor NTUF4156N MOSFET‘N-Channel,3or,4.6A,w/Integral Schottky Diode
,
2A
Main PCB,Bottom Electro-Mechanical 1 Foxconn Jack-Audio,3.Smm,w/Integrated Flex PCB
Main PC B.Bottom Electro-Mechanical 1 Mitsumi SSP-122MHT Slide Switch・SPDT,Horizontal
Main PCB,Bottom Integrated Circuit 1 MicronTechnology MT29F32GO8]_AA Flash-NAND,32Gb(Assumed MLC)
Main PCB,Bottom Passive 1 NECTokin E,Sv Series Tantalum-Encapsulated.6.3V,4.7uF
Main PCB,Bottom Passive 4 NEC1_0kin E/SV Series Tantalum—Encapsulated,4V,10uF
Main PCB,Top Discrete Semiconductor 1 Diodes lnc. PD3S140.7 SchottkyRectiifer-40V,1A
Main PCB,oTp Discrete Semiconductor 1 Diodes lnc. BZT52C6V8LP Zener-6.Bv
Main PCB,oTp Discrete Semiconductor 1 Rohm Diode
Main PCB,oTp Discrete Semiconductor 3 On Semiconductor NTZ¥31 S1 PT1G MOSFET-Dual,p-Channel,・20V,・9S0mA
Main PCB,oTp Discrete Semiconductor 1 Dlodes Inc. BC847BLP.7 Bipolar・NPN,45V,lOOmA
Main PCB,OTp Discrete Semiconductor 1 On Semiconductor NUP41 2VPSTSG ESD/EMI Protect-Low Capacitance,Quad Array,1 2V,SmA
Main PCB,OTp Discrete Semiconductor 2 ST Microelectronics ESDALC6Vl-1 BM2 ESD/EMI Protect・Low Capacitance,Single Line
Main PCB,oTp Discrete Semiconductor 1 Diodes lnc. BC847BLP.7 Bipolar・NPN,4SV,lOOmA
Main PCB,Top Electro-Mechanical 1 Foxconn MainI/O&Power-RightAngle,w/MountingTab
Main PCB,oTp Integrated Circuit 1 National Semiconductor LM3491 9TL Regulator-DC-DC Converter,Switching
Main PCB,Top Integrated Circuit 1 National Semiconductor LM349O2A Analog IC
Main PCB,OTp Integrated Circuit 1 Dialog Semiconductor D1671B Power Management
Main PCB,oTp Integrated Circuit 1 NXP 74LvC1G07GM Buffer-Non・Inverting,Open Drain Output
Main PCB,oTp Integrated Circuit 1 SamsungSemiconductor K4X561 63Pl SDRAM・Mobile DDR,2S6Mb.1.8V
Main PCB,OTp Integrated Circuit 1 SST SST25VFO8OB.xx-xx Flash・NOR,8Mb,Serial SPl
Main PCB,oTp Intgerated Circuit 1 SamsungSemiconductor Video/Applications Processor-ARM Core
Main PCB,oTp Integrated Circuit 1 lntersil lSLS9121 iVdeo Driver-3 Channel,w/LPF(Based on lSLS91 23)
Main PCB,OTp Integrated Circuit 1 WolfsonMicroelectronics WM】870 Audio Codec
Main PC&Top Passive 1 EpsonToyocom FC-135 Crystal‘32.768kHz
不同种类的器件在总成本中所占的百分 匕
今日电子.2008 ̄E1PJ 5g
2024年7月12日发(作者:绪思天)
维普资讯
苹果i P o d N a n o拆解分析
穗 R 、
…一●●-
+.
l
]
第三代iPod Nano将Nan,
它是苹果公司首款基于闪存的
Nano的核心设计采用三星公’
应用处理器。
●
U 【
一
-——
_【 l’ ,=
l _
I
_
臻 露
‘
:E
EN
鬻
l
其2英寸液晶显示屏采用
英寸204像素下具有320×24
电电池在冲满电的情况下可以
视频播放达
5小时。该第三代i
■
§,
J
】
墨
I
富
I_
一
H
{ I l
●
l
■
L
囊
§
-
t i.
— 或8GB闪存。
l_ j .
1 :
±==
Il -
l
j
不同装配区的器件在总成本中
l l T
曩
i.
I
I—_
.
j:' 皇==
-
.
_
^
;●
I l
= I
l
、。 j 0
|=
_
爆 |
a I F
Ma
'々々 、
?p 蔫譬i: 荡
_ 霪霆 巍 睡
~
l
■1 I H
‘ ▲ 奢。 蓑
0
黧 熙躁 鐾 一
曩墓璧
一 I l■
一
不同类型的器件在总成本中所占的百分 匕
不同功能的器件在总成本中所占的百分比
分立半导体
1.O2%
电池
无源元件
机电器件
2.77%
3.36%
4.41%
电池
2.77%
电池/电源
管理
5.12%
用户接口
机械/机电
器件
1O.53%
7.67%
机械器件
6.12%
本栏目信息来源:Electronic Products DECEMBER 2007。
58 今日电子.2008年1,El
维普资讯
更多信息,请参考:,1ftp://electronicproducts.com/whatsinside
Location Component Family Qty Manufacturer Pa rt Number Component Description
ClickWheelSensorAssembly ntegrated Circuit 1 Synaptics ClickWheel Controller
Main PCB Electro-MechanicaI OPC Manufacturing Ltd. 6-Layer-FR4/RCF HDI.1+4+1
Main PCB,Bottom Discrete Semiconductor 1 On Semiconductor NTUF4156N MOSFET‘N-Channel,3or,4.6A,w/Integral Schottky Diode
,
2A
Main PCB,Bottom Electro-Mechanical 1 Foxconn Jack-Audio,3.Smm,w/Integrated Flex PCB
Main PC B.Bottom Electro-Mechanical 1 Mitsumi SSP-122MHT Slide Switch・SPDT,Horizontal
Main PCB,Bottom Integrated Circuit 1 MicronTechnology MT29F32GO8]_AA Flash-NAND,32Gb(Assumed MLC)
Main PCB,Bottom Passive 1 NECTokin E,Sv Series Tantalum-Encapsulated.6.3V,4.7uF
Main PCB,Bottom Passive 4 NEC1_0kin E/SV Series Tantalum—Encapsulated,4V,10uF
Main PCB,Top Discrete Semiconductor 1 Diodes lnc. PD3S140.7 SchottkyRectiifer-40V,1A
Main PCB,oTp Discrete Semiconductor 1 Diodes lnc. BZT52C6V8LP Zener-6.Bv
Main PCB,oTp Discrete Semiconductor 1 Rohm Diode
Main PCB,oTp Discrete Semiconductor 3 On Semiconductor NTZ¥31 S1 PT1G MOSFET-Dual,p-Channel,・20V,・9S0mA
Main PCB,oTp Discrete Semiconductor 1 Dlodes Inc. BC847BLP.7 Bipolar・NPN,45V,lOOmA
Main PCB,OTp Discrete Semiconductor 1 On Semiconductor NUP41 2VPSTSG ESD/EMI Protect-Low Capacitance,Quad Array,1 2V,SmA
Main PCB,OTp Discrete Semiconductor 2 ST Microelectronics ESDALC6Vl-1 BM2 ESD/EMI Protect・Low Capacitance,Single Line
Main PCB,oTp Discrete Semiconductor 1 Diodes lnc. BC847BLP.7 Bipolar・NPN,4SV,lOOmA
Main PCB,Top Electro-Mechanical 1 Foxconn MainI/O&Power-RightAngle,w/MountingTab
Main PCB,oTp Integrated Circuit 1 National Semiconductor LM3491 9TL Regulator-DC-DC Converter,Switching
Main PCB,Top Integrated Circuit 1 National Semiconductor LM349O2A Analog IC
Main PCB,OTp Integrated Circuit 1 Dialog Semiconductor D1671B Power Management
Main PCB,oTp Integrated Circuit 1 NXP 74LvC1G07GM Buffer-Non・Inverting,Open Drain Output
Main PCB,oTp Integrated Circuit 1 SamsungSemiconductor K4X561 63Pl SDRAM・Mobile DDR,2S6Mb.1.8V
Main PCB,OTp Integrated Circuit 1 SST SST25VFO8OB.xx-xx Flash・NOR,8Mb,Serial SPl
Main PCB,oTp Intgerated Circuit 1 SamsungSemiconductor Video/Applications Processor-ARM Core
Main PCB,oTp Integrated Circuit 1 lntersil lSLS9121 iVdeo Driver-3 Channel,w/LPF(Based on lSLS91 23)
Main PCB,OTp Integrated Circuit 1 WolfsonMicroelectronics WM】870 Audio Codec
Main PC&Top Passive 1 EpsonToyocom FC-135 Crystal‘32.768kHz
不同种类的器件在总成本中所占的百分 匕
今日电子.2008 ̄E1PJ 5g