2024年10月8日发(作者：佛艳卉)
Product End-of-Life Disassembly Instructions
Product Category: Storage Enclosures
Marketing Name / Model
[List multiple models if applicable.]
HP 3Par V400 Storage System (QR584A, QR632A, QR633A)
HP 3Par V800 Storage System (QR585A, QR637A)
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Quantity
of items
Item Description Notes
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
V400: 70
to138
V800: 70 to
260
V400: 6 to
12
V800: 6 to
24
0
0
0
0
V400: 32 to
64
V800: 32 to
128
V400: 4 to
8
V800: 4 to
16
Batteries All types including standard alkaline and lithium coin
or button style batteries
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater Includes background illuminated displays with gas
than 100 sq cm discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
EL-MF877-00 Page 1
Template Revision B
EL-MF877-01
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
0
0
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
0
0
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Phillips Screwdriver
Screwdriver
Diagonal Cutter
Nut Driver
Description #5
#1 & 2
Slot tip
small
7mm, 8mm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. V400/V800 Storage System
2. Remove the power supplies from Back side
3. Remove the BBU from the front side
4. Remove the Fan Assemblies from the Front side
5. Remove the Controller Node(s) from Back side
6. Remove the LED status PCBA from the Front side
7. Remove the Center Plane from chassis
8. Remove HBA PCBA from carrier
9.
10.
11.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Disassembly Instructions:
Insure the system is shut down, and power cables disconnected.
EL-MF877-00 Page 2
Template Revision B
EL-MF877-01
Disassembling V400/V800 Node Power Supplies (PS):
Remove the three screws on each side of the power supply and remove the top cover
Remove four screws from the front side and one screw on the side. Disconnect connector to remove the fan.
Remove six screws securing the main PCBA.
Remove the capacitors
EL-MF877-00 Page 3
Template Revision B
EL-MF877-01
Disassembling V400/V800 BBU (Battery Backup Unit)
Remove two screws, one on each side, securing the
handle.
Remove screws securing the top cover.
Remove Ribbon cable at each connector ends,
disconnect Red (+) battery cable, and the fan
connector.
EL-MF877-00 Page 4
Template Revision B
EL-MF877-01
Disconnect power cables to the PCBA. Remove the four fan screws and remove the fan assy.
Remove PCBA bracket screw from bottom.
Remove the PCBA w/ Bracket Assy, and remove the PCBA
screws.
Remove the capacitors.
EL-MF877-00 Page 5
Template Revision B
EL-MF877-01
Remove the following screws to remove the Battery Captive Cage.
Disconnect battery cables and remove Batteries.
Remove the four PCBA screws and remove the
board.
EL-MF877-00 Page 6
Template Revision B
EL-MF877-01
EL-MF877-00 Page 7
Template Revision B
EL-MF877-01
Disassembling V400/V800 Fan Module
Remove the four screws from the fan module cover.
Remove the LEDs and holders. Remove Fan Assembly and disconnect all three fans at the
PCBA.
Remove three screws securing the PCBA.
EL-MF877-00 Page 8
Template Revision B
EL-MF877-01
Disassembling V400/V800 Controller Node
Remove all HBA cards from the Node by pulling
out the bottom handle.
Remove all Node Drives, the right Node drive is an
optional drive.
Un-screw the Rear Node Cover screw. Remove side screws holding front Node Cover.
Remove the EMI gasket from the front, and
remove six screws holding front Node Cover.
Remove the HBA PCBA interface boards by pulling up
on the rear of the cards and pulling forward.
EL-MF877-00 Page 9
Template Revision B
EL-MF877-01
Remove the HBA sheet metal cage screw.
There’s a screw on one side underneath the EMI
gasket. Need to remove the EMI gasket to
remove the cage screw.
Remove the EMI gasket on the other side.
Slide the Card cage forward and remove from
chassis.
Remove the Drive interface PCBA screws to remove
the interface board.
Remove all of the DIMMs Remove the PCBAs with Heat Sinks by pulling out
release latches.
EL-MF877-00 Page 10
Template Revision B
EL-MF877-01
Remove the heat sink securing screws and remove the heat sinks.
Remove the PCBA fastening screws to remove
the PCBA.
Remove the Coin Battery.
EL-MF877-00 Page 11
Template Revision B
EL-MF877-01
Disassembling V400 CenterPlane
Remove the LED Status board Panel by un-screwing
the two thumb screws.
Pull out the Panel and remove the four screws
securing the LED status board.
Remove the 12 screws securing the Fan Module and BBU Cage.
Pull out the Fan Module and BBU Cage. Remove the 12 upper center plane PCBA screws
and remove the PCBA
EL-MF877-00 Page 12
Template Revision B
EL-MF877-01
Remove the 11 lower center plane PCBA screws and
remove the PCBA
For V800, the Chassis is a horizontal mirror or the
V400 chassis.
Disassembling HBA Card from Sled
Remove the SFP rubber caps. Lift and pull down at the same time on the
SFP handle. Pull out the SFPs.
Remove the EMI gasket as shown. Remove the two PCBA screws.
EL-MF877-00 Page 13
Template Revision B
EL-MF877-01
Remove the last PCBA screw at the back. HBA PCBA
EL-MF877-00 Page 14
Template Revision B
EL-MF877-01
2024年10月8日发(作者：佛艳卉)
Product End-of-Life Disassembly Instructions
Product Category: Storage Enclosures
Marketing Name / Model
[List multiple models if applicable.]
HP 3Par V400 Storage System (QR584A, QR632A, QR633A)
HP 3Par V800 Storage System (QR585A, QR637A)
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Quantity
of items
Item Description Notes
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
V400: 70
to138
V800: 70 to
260
V400: 6 to
12
V800: 6 to
24
0
0
0
0
V400: 32 to
64
V800: 32 to
128
V400: 4 to
8
V800: 4 to
16
Batteries All types including standard alkaline and lithium coin
or button style batteries
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater Includes background illuminated displays with gas
than 100 sq cm discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
EL-MF877-00 Page 1
Template Revision B
EL-MF877-01
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
0
0
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
0
0
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Phillips Screwdriver
Screwdriver
Diagonal Cutter
Nut Driver
Description #5
#1 & 2
Slot tip
small
7mm, 8mm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. V400/V800 Storage System
2. Remove the power supplies from Back side
3. Remove the BBU from the front side
4. Remove the Fan Assemblies from the Front side
5. Remove the Controller Node(s) from Back side
6. Remove the LED status PCBA from the Front side
7. Remove the Center Plane from chassis
8. Remove HBA PCBA from carrier
9.
10.
11.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Disassembly Instructions:
Insure the system is shut down, and power cables disconnected.
EL-MF877-00 Page 2
Template Revision B
EL-MF877-01
Disassembling V400/V800 Node Power Supplies (PS):
Remove the three screws on each side of the power supply and remove the top cover
Remove four screws from the front side and one screw on the side. Disconnect connector to remove the fan.
Remove six screws securing the main PCBA.
Remove the capacitors
EL-MF877-00 Page 3
Template Revision B
EL-MF877-01
Disassembling V400/V800 BBU (Battery Backup Unit)
Remove two screws, one on each side, securing the
handle.
Remove screws securing the top cover.
Remove Ribbon cable at each connector ends,
disconnect Red (+) battery cable, and the fan
connector.
EL-MF877-00 Page 4
Template Revision B
EL-MF877-01
Disconnect power cables to the PCBA. Remove the four fan screws and remove the fan assy.
Remove PCBA bracket screw from bottom.
Remove the PCBA w/ Bracket Assy, and remove the PCBA
screws.
Remove the capacitors.
EL-MF877-00 Page 5
Template Revision B
EL-MF877-01
Remove the following screws to remove the Battery Captive Cage.
Disconnect battery cables and remove Batteries.
Remove the four PCBA screws and remove the
board.
EL-MF877-00 Page 6
Template Revision B
EL-MF877-01
EL-MF877-00 Page 7
Template Revision B
EL-MF877-01
Disassembling V400/V800 Fan Module
Remove the four screws from the fan module cover.
Remove the LEDs and holders. Remove Fan Assembly and disconnect all three fans at the
PCBA.
Remove three screws securing the PCBA.
EL-MF877-00 Page 8
Template Revision B
EL-MF877-01
Disassembling V400/V800 Controller Node
Remove all HBA cards from the Node by pulling
out the bottom handle.
Remove all Node Drives, the right Node drive is an
optional drive.
Un-screw the Rear Node Cover screw. Remove side screws holding front Node Cover.
Remove the EMI gasket from the front, and
remove six screws holding front Node Cover.
Remove the HBA PCBA interface boards by pulling up
on the rear of the cards and pulling forward.
EL-MF877-00 Page 9
Template Revision B
EL-MF877-01
Remove the HBA sheet metal cage screw.
There’s a screw on one side underneath the EMI
gasket. Need to remove the EMI gasket to
remove the cage screw.
Remove the EMI gasket on the other side.
Slide the Card cage forward and remove from
chassis.
Remove the Drive interface PCBA screws to remove
the interface board.
Remove all of the DIMMs Remove the PCBAs with Heat Sinks by pulling out
release latches.
EL-MF877-00 Page 10
Template Revision B
EL-MF877-01
Remove the heat sink securing screws and remove the heat sinks.
Remove the PCBA fastening screws to remove
the PCBA.
Remove the Coin Battery.
EL-MF877-00 Page 11
Template Revision B
EL-MF877-01
Disassembling V400 CenterPlane
Remove the LED Status board Panel by un-screwing
the two thumb screws.
Pull out the Panel and remove the four screws
securing the LED status board.
Remove the 12 screws securing the Fan Module and BBU Cage.
Pull out the Fan Module and BBU Cage. Remove the 12 upper center plane PCBA screws
and remove the PCBA
EL-MF877-00 Page 12
Template Revision B
EL-MF877-01
Remove the 11 lower center plane PCBA screws and
remove the PCBA
For V800, the Chassis is a horizontal mirror or the
V400 chassis.
Disassembling HBA Card from Sled
Remove the SFP rubber caps. Lift and pull down at the same time on the
SFP handle. Pull out the SFPs.
Remove the EMI gasket as shown. Remove the two PCBA screws.
EL-MF877-00 Page 13
Template Revision B
EL-MF877-01
Remove the last PCBA screw at the back. HBA PCBA
EL-MF877-00 Page 14
Template Revision B
EL-MF877-01