Silicon Laboratories EM3 X 模块技术规范说明书-USB迷|专注于互联网分享

2024年10月30日发(作者：虎子帆)

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MBER

EM3

ODULE

ECHNICAL

PECIFICATION

Silicon Labs’ EM3x development kits contain various modules designed around the EM3x family of ICs. All of these

modules are designed and sold by Silicon Labs’ module partners Telegesis (UK) Limited and California Eastern

Laboratories (CEL). The module designs allow them to be integrated into any product without the need for RF

experience and expertise. Utilizing stacks such as Silicon Labs’ certified ZigBee network stack EmberZNet, these

modules enable a developer to add powerful wireless networking capability to products and quickly bring them to

market.

This document provides the technical specification of the EM3x modules on its Silicon Labs-specific carrier board.

For more information on the other Telegesis modules, contact Telegesis, Ltd directly at

. For

more information on other CEL modules, contact CEL directly at .

New in This Revision

Added CEL CE compliance information.

Contents

EM3x Module Definitions ................................................................................................................................. 2

EM3x Module Features ................................................................................................................................... 3

Performance Characteristics ........................................................................................................................... 3

EM3x Configurations ....................................................................................................................................... 5

Mechanical Details .......................................................................................................................................... 7

5.1

EM3x Module Interface Connector ........................................................................................................... 8

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1 EM3x Module Definitions

To accommodate the requirements of the different markets, Telegesis and CEL have developed a series of pin-

compatible modules based on the Ember EM341, EM346, EM357, and EM3588 chipsets. Table 1 defines the

Telegesis, CEL, and Silicon Labs part numbers for each module as well as describes the differences (Power

Amplifier (PA), Low Noise Amplifier (LNA), and RF connection) between each module.

Table 1. Silicon Labs and Module Partner Part Numbers

Silicon Labs

P/N

110-0740-000

110-0741-000

110-0742-000

110-0743-000

110-0720-000

110-0721-000

110-0722-000

110-0723-000

110-0730-000

110-0731-000

110-0732-000

110-0733-000

110-0734-000

110-0735-000

110-0736-000

110-0737-000

Silicon Labs Orderable

Part Number (OPN)

EM341-MOD-ANT-C

EM341-MOD-RF-C

EM346-MOD-ANT-C

EM346-MOD-RF-C

EM357-MOD-ANT-T

EM357-MOD-RF-T

EM357-MOD-LR-RF-T

EM357-MOD-LR-ANT-T

EM357-MOD-ANT-C

EM357-MOD-RF-C

EM357-MOD-LR-RF-C

EM357-MOD-LR-ANT-C

EM3588-M-AN-C

EM3588-MOD-RF-C

EM3588-MLR-RF-C

EM3588-MLR-AN-C

EM3x

EM341

EM346

EM357

EM3588

Module

Partner

CEL

Telegesis

CEL

Module Partner P/N

(Module only)

ZICM341SP0-1

ZICM341SP0-1C

ZICM346SP0-1

ZICM346SP0-1C

ETRX357

ETRX357HR

ETRX357HR-LRS

ETRX357-LRS

ZICM357SP0-1

ZICM357SP0-1C

ZICM357SP2-1C

ZICM357SP2-1

ZICM3588SP0-1

ZICM3588SP0-1C

ZICM3588SP2-1C

ZICM3588SP2-1

RF Connection

Antenna

Connector

Antenna

Connector

SMT Antenna

Mini-RF Connector

SMT Antenna

Mini-RF Connector

SMT Antenna

Mini-RF Connector

SMT Antenna

PA /

LNA?

(Long

Range)

Yes

All of these modules are available from Telegesis and CEL. Silicon Labs provides the CEL EM357 and EM3588

module types with the EM35x Development Kit (part number EM35X-DEV) and the EM341 and EM346 modules

with the EM34x Development Kit (part number EM34X-DEV).

For modules whose RF connection is a mini-RF connector, an RF adapter cable (Tyco/Amp part number 2032440-

1) can be used to interface the module to external test equipment. One of these RF adapter cables is included with

the development kits.

To connect to the EM35x breakout board (Silicon Labs P/N: 130-0680-000), each module shown in Table 1 is

soldered to a small carrier board. The carrier board connector is discussed in section 5.1, EM3x Module Interface

Connector.

2 Rev. 1.4

2 EM3x Module Features

Module features:

•

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Small form factor, SMT module (25 mm x 19 mm)

Side castellation for easy soldering and inspection

Industry standard JTAG Programming and real-time network level debugging via the Packet Trace Port.

Wide supply voltage range (2.1 to 3.6 V)

Low sleep current (< 1 µA for EM35x and EM34x, < 2 µA for EM3588)

Access to all EM3x GPIO from the System-on-Chip (SoC)

Access to either a RF Connector or a SMT antenna allows flexibility in antenna selection process

FCC compliance

Telegesis:

FCC ID: S4GEM35XA

CEL:

FCC ID: W7Z-ZICM357SPO

FCC ID: W7Z-ZICM357SP2

CE compliance

Telegesis:

Radio: EN300 328 v1.7.1

EMC: EN301 489-17 v2.1.1

Safety: EN60950-1

CEL

•

Radio: EN 300 328 V1.8.1 (2006 ‐ 2012)

EMC: EN 301 489‐1 V1.8.1, V1.9.1

EN 301 489‐17 V2.2.1

Long Range versions with a link budget of up to 124 dB

Access to the Packet Trace Port connector (allows for direct connection to the Ember Debug Adapter

(ISA3) for programming and debugging)

Two debug LEDs

Access to all EM3x GPIO through a robust 0.05” pitch connector

Module with carrier board features:

3 Performance Characteristics

This section describes the characteristics of the module with carrier board. For more information on the EM35x and

EM34x SoC performance, refer to the EM35x, EM358x, EM341 and EM346 data sheets.

Unless specified, the data within each of the tables was gathered at room temperature (25 °C) and 3.0 V source

potential. Table 2 summarizes the recommended operating conditions for the modules.

Table 2. Recommended Operating Conditions for the EM3x Module

Parameter

VDD supply

RF Input Frequency

RF Input Power (at RF Port)

Operating Temperature Range

Min

2.1

2405

—

-40

Typ

—

Max

3.6

2480

Unit

MHz

dBm

°C

Rev. 1.4 3

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Table 3 summarizes the DC characteristics at 25 °C and VDD of 3 V of the EM3x Module.

Table 3. DC Characteristics of the EM3x Module

Parameter

VDD supply

Sleep Current (RC oscillator)

Active Current (TX)

TX, Normal Mode, +3 dBm

TX, Boost Mode, +8 dBm

TX, Normal Mode, 0 dBm

Active Current (RX)

RX, Normal Mode

RX, Boost Mode

Wake Time from Deep Sleep

Shutdown Time

—

100

—

28.5

—

Min

2.1

—

Typ

—

0.4

Max

3.6

—

Unit

µA

Table 4 summarizes the digital I/Os at VCC = 3 V and 25 °C of the EM3x Module.

Table 4. Digital I/O Characteristics of the EM3x Module

Parameter

Input Logic Threshold

Schmitt threshold (high to low)

Schmitt threshold (low to high)

Input Current

Logic Low

Logic High

Output Voltage

Logic Low

Logic High

Output Current

Source, Standard Pad

Sink, Standard Pad

Source, High Current Pad

Sink, High Current Pad

Total Output Current

—

0.82 x VDD

—

-0.5

0.5

—

0.18 x VDD

VDD

µA

0.42 x VDD

0.62 x VDD

—

0.5 x VDD

0.8 x VDD

Min Typ Max Unit

4 Rev. 1.4

Table 5. RF Characteristics of the EM3x Module

Parameter

Frequency Range

Channel Spacing

RX Sensitivity (1% PER, 20-byte packet)

Normal Mode

Boost Mode

Adjacent Channel Rejection

High Side

Low Side

High Side

Low Side

All other channels

TX Power (Maximum)

Boost Mode

Normal Mode

Error Vector Magnitude (Offset EVM) (per IEEE 802.15.4-2003)

PSD (3.5 MHz from carrier)

Relative

Absolute

-20

-30

—

-100

-101

-94

-95

Min

2405

—

Typ

—

Max

2480

—

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Table 5 summarizes the RF parameters of the EM3x Module.

Unit

MHz

dBm

4 EM3x Configurations

The IC on the EM3x Module can be set to different RF frequency channels as well as different power levels. When

using the nodetest application on the module, the frequency channels and output power levels can be configured

through a command line interface (CLI).

In order to configure the output power, the setTXPower command can be used. Table 6 demonstrates the

setTXPower command and the expected power output. Note that these are the typical expected power output

levels based on the performance of the EM3x IC and actual results are dependent on the module provider design

implementation.

Note: Table 6 refers to the non-PA versions of the modules. For the version with a PA, the output power should be

set to -5 dBm in order to achieve +20 dBm output power.

Table 6: List of TX output powers when using SetTxPower

SetTxPower

[signed hexadecimal]

SetTxPower 9

SetTxPower 8

SetTxPower 7

SetTxPower 6

SetTxPower 5

Output Power

(dBm)

Rev. 1.4 5

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SetTxPower

[signed hexadecimal]

SetTxPower 4

SetTxPower 3

SetTxPower 2

SetTxPower 1

SetTxPower 0

SetTxPower -1

SetTxPower -2

SetTxPower -3

SetTxPower -4

SetTxPower -5

SetTxPower -6

SetTxPower -7

SetTxPower -8

SetTxPower -9

SetTxPower –a

SetTxPower –b

SetTxPower –c

SetTxPower –d

SetTxPower –e

SetTxPower –f

SetTxPower -10

SetTxPower -11

SetTxPower -12

SetTxPower -13

SetTxPower -14

SetTxPower -15

SetTxPower -16

SetTxPower -17

Output Power

(dBm)

-1

-2

-3

-4

-5

-6

-7

-8

-9

-11

-12

-14

-17

-20

6 Rev. 1.4

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To change the channel, the setChannel command can be used (assuming nodetest application is on the device).

Table 7 lists the valid parameters to be used with setChannel command.

Table 7: List of setChannel values for EM3x

setChannel

(decimal)

Center

Frequency (GHz)

2.405

2.410

2.415

2.420

2.425

2.430

2.435

2.440

radioChannel

(decimal)

Center

Frequency (GHz)

2.445

2.450

2.455

2.460

2.465

2.470

2.475

2.480

5 Mechanical Details

Figure 1 illustrates the ZICM35x Module carrier board from CEL, while Figure 2 illustrates the ETRX35x Module

from Telegesis on a carrier board.

Figure 1. CEL ZICM35x Module Carrier Board

Rev. 1.4 7

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3320

LED2

ETRX35x Module

22 mm

Packet

Trace Port

LED1

37.5 mm

Figure 2. Telegesis ETRX35x Module with Carrier Board

5.1 EM3x Module Interface Connector

Two single-row, 0.05” pitch, connectors make up the EM3x module interface to the EM35x breakout board. In

addition, two single-row, guide connectors on the EM35x breakout board assist with connecting the EM3x module

to the breakout board. The board-to-board connector scheme allows access to all EM3x GPIO as well as nRESET

and the JCLK signals. The connector is illustrated in Figure 3, while the connector dimensions are listed in Figure 4.

Figure 3. Board-to-board connector for the EM3x module (top view)

Rev. 1.4

1234

56789

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Figure 4. Board-to-Board Connector Dimensions for the EM3x Module (top view)

Table 8 describes the pinout and signal names on the connector.

For more information on the alternate functions of the GPIO connector, refer to the EM35x Data Sheet.

Table 8. Pinout and Signal Names of the Interface Connector

Pin #

Signal name

GND

PC5

PC6

PC7

PA7

PB3

nRESET

PB4

PA0

PA1

PA2

PA3

GND

PA4

PA5

PA6

PB1

PB2

GND

JCLK

PC2

PC3

Direction

Power

I/O

Power

I/O

Power

Input

I/O

Description

Ground Connection

EM3x GPIO

Active low chip reset (internal pull-up on EM3x)

EM3x GPIO

Ground Connection

EM3x GPIO

EM3x GPIO (NC on EM346 module)

EM3x GPIO

Ground connection

JTAG interface, serial clock

EM3x GPIO

Rev. 1.4 9

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Pin #

Signal name

PC4

PB0

PC1

PC0

PB7

PB6

PB5

GND

VDD

GND

Direction

I/O

Power

Description

EM3x GPIO

EM3x GPIO (NC on EM346 module)

Ground connection

2.1 to 3.6 V Module Power Domain

Ground connection

with respect to the EM3x Module

10 Rev. 1.4

ONTACT

NFORMATION

Silicon Laboratories Inc.

400 West Cesar Chavez

Austin, TX 78701

Tel: 1+(512) 416-8500

Fax: 1+(512) 416-9669

Toll Free: 1+(877) 444-3032

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For additional information please visit the Silicon Labs Technical Support page:

/support/Pages/

Patent Notice

Silicon Labs invests in research and development to help our customers differentiate in the market with innovative low-power, small size,

analog-intensive mixed-signal solutions. Silicon Labs' extensive patent portfolio is a testament to our unique approach and world-class

engineering team.

The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice.

Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the

use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or

parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty,

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Rev. 1.4 11