2024年3月30日发(作者：湛迎蓉)
MBRS410LT3
Preferred Device
Surface Mount
Schottky Power Rectifier
This device employs the Schottky Barrier principle in a large area
metal−to−silicon power diode. State−of−the−art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity protection diodes, in surface mount
applications where compact size and weight are critical to the system.
Typical applications are AC−DC and DC−DC converters, reverse
battery protection, and “ORing” of multiple supply voltages and any
other application where performance and size are critical.
Features
SCHOTTKY BARRIER
RECTIFIERS
4.0 AMPERES, 10 VOLTS
•
•
•
•
•
•
•
•
•
Ultra Low V
F
1st in the Market Place with a 10 V
R
Schottky Rectifier
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Very Low Forward Voltage Drop
Excellent Ability to Withstand Reverse Avalanche Energy Transients
Guard−Ring for Stress Protection
Pb−Free Package is Available
SMC
CASE 403
PLASTIC
MARKING DIAGRAM
Mechanical Characteristics
•
Case: Epoxy, Molded
•
Weight: 217 mg (Approximately)
•
Finish: All External Surfaces Corrosion Resistant and Terminal
•
•
•
AYWW
B4L1G
G
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Polarity: Notch in Plastic Body Indicates Cathode Lead
ESD Ratings:Machine Model = C
Human Body Model = 3B
B4L1= Specific Device Code
A= Assembly Location
Y= Year
WW= Work Week
G= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MBRS410LT3
MBRS410LT3G
Package
SMC
SMC
(Pb−Free)
Shipping
†
2500/Tape & Reel
2500/Tape & Reel
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(@ T
L
= 110°C)
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
Operating Junction Temperature
Symbol
V
RRM
V
RWM
V
R
I
O
I
FSM
Value
10
Unit
V
4.0
150
A
A
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
T
J
−65 to +125°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
© Semiconductor Components Industries, LLC, 2005
1
August, 2005 − Rev. 2
Publication Order Number:
MBRS410LT3/D
/
MBRS410LT3
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance,
Junction−to−Lead
Thermal Resistance,
Junction−to−Ambient
Symbol
R
q
JL
R
q
JA
Min Pad (Note 2)
12
109
1 Inch Pad
7.0
59
Unit
°C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 1)
(I
F
= 2.0 A)
(I
F
= 4.0 A)
(I
F
= 8.0 A)
Maximum Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, V
R
= 5.0 V)
(Rated dc Voltage, V
R
= 10 V)
Test: Pulse Width ≤ 300 ms, Duty Cycle ≤2%.
d with Minimum Recommended Pad Size, PC Board FR4.
100
I
F
,
F
O
R
W
A
R
D
C
U
R
R
E
N
T
(
A
)
I
F
,
F
O
R
W
A
R
D
C
U
R
R
E
N
T
(
A
)
100
I
R
V
F
T
J
= 25°C
0.31
0.33
0.35
T
J
= 25°C
2.0
5.0
T
J
= 100°C
0.200
0.225
0.250
T
J
= 100°C
100
200
mA
V
V
F
@ 125°C
10
100°C
10
V
F
@ 125°C
1
75°C
0.1
25°C
−40°C
1
100°C
75°C
25°C
00.10.20.30.40.5
0.1
00.10.20.30.40.5
V
F
, INSTANTANEOUS VOLTAGE (V)V
F
, INSTANTANEOUS VOLTAGE (V)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
1.00E+00
I
R
,
R
E
V
E
R
S
E
C
U
R
R
E
N
T
(
A
)
I
R
@ 125°C
100°C
75°C
C
,
C
A
P
A
C
I
T
A
N
C
E
(
p
F
)
10000
f = 1 Mhz
1.00E−01
1.00E−02
25°C
1.00E−03
25°C
02468
1.00E−04
10
1000
0246810
V
R
, REVERSE VOLTAGE (V)
V
R
, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse CurrentFigure 4. Typical Capacitance
2
/
MBRS410LT3
9
8
I
F
,
A
V
E
R
A
G
E
F
O
R
W
A
R
D
C
U
R
R
E
N
T
(
A
)
7
6
5
4
3
2
1
0
120125130
SQUARE WAVE
dc
P
F
O
,
A
V
E
R
A
G
E
P
O
W
E
R
D
I
S
S
I
P
A
T
I
O
N
(
W
)
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
SQUARE WAVE
dc
T
L
, LEAD TEMPERATURE (°C)I
O
, AVERAGE FORWARD CURRENT (A)
Figure 5. Current Derating (Junction−to−Lead)
R
(
t
)
,
T
R
A
N
S
I
E
N
T
T
H
E
R
M
A
L
R
E
S
I
S
T
A
N
C
E
(
°
C
/
W
)
Figure 6. Forward Power Dissipation
100
D = 0.5
0.2
0.1
10
0.05
0.02
0.01
1
SINGLE PULSE
0.1
0.000010.00010.0010.010.1
t, TIME (S)
1101001000
Figure 7. Thermal Response, Junction−to−Ambient (min pad)
R
(
t
)
,
T
R
A
N
S
I
E
N
T
T
H
E
R
M
A
L
R
E
S
I
S
T
A
N
C
E
(
°
C
/
W
)
100
D = 0.5
0.2
10
0.1
0.05
0.02
1
0.01
SINGLE PULSE
0.1
0.000010.00010.0010.010.1
t, TIME (S)
1101001000
Figure 8. Thermal Response, Junction−to−Ambient (1 inch pad)
3
/
MBRS410LT3
PACKAGE DIMENSIONS
SMC
PLASTIC PACKAGE
CASE 403−03
ISSUE E
H
E
E
NOTES:
IONING AND TOLERANCING PER ANSI Y14.5M, 1982.
LLING DIMENSION: INCH.
3.D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
4.403−01 THRU −02 OBSOLETE, NEW STANDARD 403−03.
DIM
A
A1
b
c
D
E
H
E
L
L1
MIN
1.90
0.05
2.92
0.15
5.59
6.60
7.75
0.76
MILLIMETERS
NOMMAX
2.132.41
0.100.15
3.003.07
0.230.30
5.846.10
6.867.11
7.948.13
1.021.27
0.51 REF
MIN
0.075
0.002
0.115
0.006
0.220
0.260
0.305
0.030
INCHES
NOM
0.084
0.004
0.118
0.009
0.230
0.270
0.313
0.040
0.020 REF
MAX
0.095
0.006
0.121
0.012
0.240
0.280
0.320
0.050
bD
A
LL1
c
A1
SOLDERING FOOTPRINT*
4.343
0.171
3.810
0.150
2.794
0.110
SCALE 4:1
mm
Ǔǒ
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:N. American Technical Support: 800−282−9855 Toll Free
Literature Distribution Center for ON SemiconductorUSA/Canada
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Phone: 81−3−5773−3850
Email: orderlit@
ON Semiconductor Website:
Order Literature: /litorder
For additional information, please contact your
local Sales Representative.
4
MBRS410LT3/D
/
分销商库存信息:
ONSEMI
MBRS410LT3G
2024年3月30日发(作者：湛迎蓉)
MBRS410LT3
Preferred Device
Surface Mount
Schottky Power Rectifier
This device employs the Schottky Barrier principle in a large area
metal−to−silicon power diode. State−of−the−art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity protection diodes, in surface mount
applications where compact size and weight are critical to the system.
Typical applications are AC−DC and DC−DC converters, reverse
battery protection, and “ORing” of multiple supply voltages and any
other application where performance and size are critical.
Features
SCHOTTKY BARRIER
RECTIFIERS
4.0 AMPERES, 10 VOLTS
•
•
•
•
•
•
•
•
•
Ultra Low V
F
1st in the Market Place with a 10 V
R
Schottky Rectifier
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Very Low Forward Voltage Drop
Excellent Ability to Withstand Reverse Avalanche Energy Transients
Guard−Ring for Stress Protection
Pb−Free Package is Available
SMC
CASE 403
PLASTIC
MARKING DIAGRAM
Mechanical Characteristics
•
Case: Epoxy, Molded
•
Weight: 217 mg (Approximately)
•
Finish: All External Surfaces Corrosion Resistant and Terminal
•
•
•
AYWW
B4L1G
G
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Polarity: Notch in Plastic Body Indicates Cathode Lead
ESD Ratings:Machine Model = C
Human Body Model = 3B
B4L1= Specific Device Code
A= Assembly Location
Y= Year
WW= Work Week
G= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MBRS410LT3
MBRS410LT3G
Package
SMC
SMC
(Pb−Free)
Shipping
†
2500/Tape & Reel
2500/Tape & Reel
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(@ T
L
= 110°C)
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
Operating Junction Temperature
Symbol
V
RRM
V
RWM
V
R
I
O
I
FSM
Value
10
Unit
V
4.0
150
A
A
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
T
J
−65 to +125°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
© Semiconductor Components Industries, LLC, 2005
1
August, 2005 − Rev. 2
Publication Order Number:
MBRS410LT3/D
/
MBRS410LT3
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance,
Junction−to−Lead
Thermal Resistance,
Junction−to−Ambient
Symbol
R
q
JL
R
q
JA
Min Pad (Note 2)
12
109
1 Inch Pad
7.0
59
Unit
°C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 1)
(I
F
= 2.0 A)
(I
F
= 4.0 A)
(I
F
= 8.0 A)
Maximum Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, V
R
= 5.0 V)
(Rated dc Voltage, V
R
= 10 V)
Test: Pulse Width ≤ 300 ms, Duty Cycle ≤2%.
d with Minimum Recommended Pad Size, PC Board FR4.
100
I
F
,
F
O
R
W
A
R
D
C
U
R
R
E
N
T
(
A
)
I
F
,
F
O
R
W
A
R
D
C
U
R
R
E
N
T
(
A
)
100
I
R
V
F
T
J
= 25°C
0.31
0.33
0.35
T
J
= 25°C
2.0
5.0
T
J
= 100°C
0.200
0.225
0.250
T
J
= 100°C
100
200
mA
V
V
F
@ 125°C
10
100°C
10
V
F
@ 125°C
1
75°C
0.1
25°C
−40°C
1
100°C
75°C
25°C
00.10.20.30.40.5
0.1
00.10.20.30.40.5
V
F
, INSTANTANEOUS VOLTAGE (V)V
F
, INSTANTANEOUS VOLTAGE (V)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
1.00E+00
I
R
,
R
E
V
E
R
S
E
C
U
R
R
E
N
T
(
A
)
I
R
@ 125°C
100°C
75°C
C
,
C
A
P
A
C
I
T
A
N
C
E
(
p
F
)
10000
f = 1 Mhz
1.00E−01
1.00E−02
25°C
1.00E−03
25°C
02468
1.00E−04
10
1000
0246810
V
R
, REVERSE VOLTAGE (V)
V
R
, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse CurrentFigure 4. Typical Capacitance
2
/
MBRS410LT3
9
8
I
F
,
A
V
E
R
A
G
E
F
O
R
W
A
R
D
C
U
R
R
E
N
T
(
A
)
7
6
5
4
3
2
1
0
120125130
SQUARE WAVE
dc
P
F
O
,
A
V
E
R
A
G
E
P
O
W
E
R
D
I
S
S
I
P
A
T
I
O
N
(
W
)
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
SQUARE WAVE
dc
T
L
, LEAD TEMPERATURE (°C)I
O
, AVERAGE FORWARD CURRENT (A)
Figure 5. Current Derating (Junction−to−Lead)
R
(
t
)
,
T
R
A
N
S
I
E
N
T
T
H
E
R
M
A
L
R
E
S
I
S
T
A
N
C
E
(
°
C
/
W
)
Figure 6. Forward Power Dissipation
100
D = 0.5
0.2
0.1
10
0.05
0.02
0.01
1
SINGLE PULSE
0.1
0.000010.00010.0010.010.1
t, TIME (S)
1101001000
Figure 7. Thermal Response, Junction−to−Ambient (min pad)
R
(
t
)
,
T
R
A
N
S
I
E
N
T
T
H
E
R
M
A
L
R
E
S
I
S
T
A
N
C
E
(
°
C
/
W
)
100
D = 0.5
0.2
10
0.1
0.05
0.02
1
0.01
SINGLE PULSE
0.1
0.000010.00010.0010.010.1
t, TIME (S)
1101001000
Figure 8. Thermal Response, Junction−to−Ambient (1 inch pad)
3
/
MBRS410LT3
PACKAGE DIMENSIONS
SMC
PLASTIC PACKAGE
CASE 403−03
ISSUE E
H
E
E
NOTES:
IONING AND TOLERANCING PER ANSI Y14.5M, 1982.
LLING DIMENSION: INCH.
3.D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
4.403−01 THRU −02 OBSOLETE, NEW STANDARD 403−03.
DIM
A
A1
b
c
D
E
H
E
L
L1
MIN
1.90
0.05
2.92
0.15
5.59
6.60
7.75
0.76
MILLIMETERS
NOMMAX
2.132.41
0.100.15
3.003.07
0.230.30
5.846.10
6.867.11
7.948.13
1.021.27
0.51 REF
MIN
0.075
0.002
0.115
0.006
0.220
0.260
0.305
0.030
INCHES
NOM
0.084
0.004
0.118
0.009
0.230
0.270
0.313
0.040
0.020 REF
MAX
0.095
0.006
0.121
0.012
0.240
0.280
0.320
0.050
bD
A
LL1
c
A1
SOLDERING FOOTPRINT*
4.343
0.171
3.810
0.150
2.794
0.110
SCALE 4:1
mm
Ǔǒ
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:N. American Technical Support: 800−282−9855 Toll Free
Literature Distribution Center for ON SemiconductorUSA/Canada
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Phone: 81−3−5773−3850
Email: orderlit@
ON Semiconductor Website:
Order Literature: /litorder
For additional information, please contact your
local Sales Representative.
4
MBRS410LT3/D
/
分销商库存信息:
ONSEMI
MBRS410LT3G