2024年5月23日发(作者：佼默)
KHX1600C9D3LK2/8GX
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR3L-1600 CL9 240-Pin DIMM Kit
SPECIFICATIONS
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
11 cycles
48.5ns (min.)
260ns (min.)
35ns (min.)
2.160 W* (per module)
94 V - 0
0
o
C to 85
o
C
-55
o
C to +100
o
C
*Power will vary depending on the SDRAM used.
DESCRIPTION
Kingston's KHX1600C9D3LK2/8GX is a kit of two 512M x 64-bit
(4GB) DDR3L-1600 CL9 SDRAM (Synchronous DRAM) 1Rx8,
low voltage, memory modules, based on eight 512M x 8-bit
DDR3 FBGA components per module. Each module kit sup-
ports Intel
®
XMP (Extreme Memory Profiles). Total kit capacity
is 8GB. Each module kit has been tested to run at DDR3L-1600
at a low latency timing of 9-9-9 at 1.35V. The SPDs are pro-
grammed to JEDEC standard latency DDR3-1600 timing of
11-11-11 at 1.5V. Each 240-pin DIMM uses gold contact
fingers. The JEDEC standard electrical and mechanical specifi-
cations are as follows:
FEATURES
•
•
•
•
•
•
•
•
•
JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
VDDQ = 1.5V (1.425V ~ 1.575V)
800MHz fCK for 1600Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 11, 10, 9, 8, 7, 6
Posted CAS
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
Asynchronous Reset
PCB : Height 1.180” (30.00mm), single sided component
XMP TIMING PARAMETERS
•
•
JEDEC:************************
XMPProfile#1:********************
•
•
•
•
•
•
Continued >>
/hyperx
Document No. 4806195-001.C00 02/05/14 Page 1
MODULE DIMENSIONS
30.00
Units: millimeters
133.35
18.80
15.80
11.00
8.00
0.00
0
.
0
0
5
4
.
7
0
MODULE WITH HEAT SPREADER
FOR MORE INFORMATION, GO TO /HYPERX
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
/hyperx
Document No. 4806195-001.C00 Page 2
2024年5月23日发(作者：佼默)
KHX1600C9D3LK2/8GX
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR3L-1600 CL9 240-Pin DIMM Kit
SPECIFICATIONS
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
11 cycles
48.5ns (min.)
260ns (min.)
35ns (min.)
2.160 W* (per module)
94 V - 0
0
o
C to 85
o
C
-55
o
C to +100
o
C
*Power will vary depending on the SDRAM used.
DESCRIPTION
Kingston's KHX1600C9D3LK2/8GX is a kit of two 512M x 64-bit
(4GB) DDR3L-1600 CL9 SDRAM (Synchronous DRAM) 1Rx8,
low voltage, memory modules, based on eight 512M x 8-bit
DDR3 FBGA components per module. Each module kit sup-
ports Intel
®
XMP (Extreme Memory Profiles). Total kit capacity
is 8GB. Each module kit has been tested to run at DDR3L-1600
at a low latency timing of 9-9-9 at 1.35V. The SPDs are pro-
grammed to JEDEC standard latency DDR3-1600 timing of
11-11-11 at 1.5V. Each 240-pin DIMM uses gold contact
fingers. The JEDEC standard electrical and mechanical specifi-
cations are as follows:
FEATURES
•
•
•
•
•
•
•
•
•
JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
VDDQ = 1.5V (1.425V ~ 1.575V)
800MHz fCK for 1600Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 11, 10, 9, 8, 7, 6
Posted CAS
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
Asynchronous Reset
PCB : Height 1.180” (30.00mm), single sided component
XMP TIMING PARAMETERS
•
•
JEDEC:************************
XMPProfile#1:********************
•
•
•
•
•
•
Continued >>
/hyperx
Document No. 4806195-001.C00 02/05/14 Page 1
MODULE DIMENSIONS
30.00
Units: millimeters
133.35
18.80
15.80
11.00
8.00
0.00
0
.
0
0
5
4
.
7
0
MODULE WITH HEAT SPREADER
FOR MORE INFORMATION, GO TO /HYPERX
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
/hyperx
Document No. 4806195-001.C00 Page 2