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CD4048BE,CD4048BM96,CD4048BM96E4,CD4048BM96G4,CD4048BPW,CD4048BPW

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2024年9月19日发(作者:鲜于迈)

Data sheet acquired from Harris Semiconductor

SCHS045C − Revised October 2003

In addition to the eight input lines, an EXPAND

input is provided that permits the user to

increase the number of inputs into a CD4048B

(see Fig. 2). For example, two CD4048Bs can be

cascaded to provide a 16-input multifunction

gate. When the EXPAND input is not used, it

should be connected to V

SS

.

The CD4048B-series types are supplied in

16-lead hermetic dual-in-line ceramic packages

(F3A suffix), 16-lead dual-in-line plastic

packages (E suffix), 16-lead small-outline

packages (M, M96, MT, and NSR suffixes), and

16-lead thin shrink small-outline packages (PW

and PWR suffixes).

芯天下--/

Copyright© 2003, Texas Instruments Incorporated

芯天下--/

芯天下--/

芯天下--/

芯天下--/

PACKAGEOPTIONADDENDUM

11-Nov-2009

PACKAGINGINFORMATION

OrderableDevice

CD4048BE

CD4048BEE4

CD4048BF3A

CD4048BM

CD4048BM96

CD4048BM96E4

CD4048BM96G4

CD4048BME4

CD4048BMG4

CD4048BMT

CD4048BMTE4

CD4048BMTG4

CD4048BPW

CD4048BPWE4

CD4048BPWG4

(1)

Status

(1)

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

Package

Type

PDIP

PDIP

CDIP

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

TSSOP

TSSOP

TSSOP

Package

Drawing

N

N

J

D

D

D

D

D

D

D

D

D

PW

PW

PW

PinsPackageEcoPlan

(2)

Qty

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

25

25

1

40

Pb-Free

(RoHS)

Pb-Free

(RoHS)

TBD

Green(RoHS&

noSb/Br)

Lead/BallFinish

CUNIPDAU

CUNIPDAU

A42

CUNIPDAU

CUNIPDAU

CUNIPDAU

CUNIPDAU

CUNIPDAU

CUNIPDAU

CUNIPDAU

CUNIPDAU

CUNIPDAU

CUNIPDAU

CUNIPDAU

CUNIPDAU

MSLPeakTemp

(3)

N/AforPkgType

N/AforPkgType

N/AforPkgType

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

2500Green(RoHS&

noSb/Br)

2500Green(RoHS&

noSb/Br)

2500Green(RoHS&

noSb/Br)

40

40

250

250

250

90

90

90

Green(RoHS&

noSb/Br)

Green(RoHS&

noSb/Br)

Green(RoHS&

noSb/Br)

Green(RoHS&

noSb/Br)

Green(RoHS&

noSb/Br)

Green(RoHS&

noSb/Br)

Green(RoHS&

noSb/Br)

Green(RoHS&

noSb/Br)

Themarketingstatusvaluesaredefinedasfollows:

ACTIVE:Productdevicerecommendedfornewdesigns.

LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect.

NRND:isinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartin

anewdesign.

PREVIEW:smayormaynotbeavailable.

OBSOLETE:TIhasdiscontinuedtheproductionofthedevice.

(2)

EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheck

/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails.

TBD:ThePb-Free/Greenconversionplanhasnotbeendefined.

Pb-Free(RoHS):TI'sterms"Lead-Free"or"Pb-Free"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirements

forall6substances,includingtherequirementthatleadnotexceed0.1%esignedtobesoldered

athightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses.

Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieand

package,or2)ponentisotherwiseconsideredPb-Free(RoHS

compatible)asdefinedabove.

Green(RoHS&noSb/Br):TIdefines"Green"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflame

retardants(BrorSbdonotexceed0.1%byweightinhomogeneousmaterial)

(3)

MSL,PeakTemp.--TheMoistureSensitivityLevelratingaccordingtotheJEDECindustrystandardclassifications,andpeaksolder

temperature.

Addendum-Page1

芯天下--/

PACKAGEOPTIONADDENDUM

11-Nov-2009

ImportantInformationandDisclaimer:TheinformationprovidedonthispagerepresentsTI'sknowledgeandbeliefasofthedatethatitis

sitsknowledgeandbeliefoninformationprovidedbythirdparties,andmakesnorepresentationorwarrantyastothe

akenandcontinuestotake

reasonablestepstoproviderepresentativeandaccurateinformationbutmaynothaveconducteddestructivetestingorchemicalanalysison

Isuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimited

informationmaynotbeavailableforrelease.

InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTI

toCustomeronanannualbasis.

Addendum-Page2

芯天下--/

PACKAGEMATERIALSINFORMATION

29-Jul-2009

TAPEANDREELINFORMATION

*Alldimensionsarenominal

DevicePackagePackagePins

TypeDrawing

SOICD16

SPQReelReelA0

DiameterWidth(mm)

(mm)W1(mm)

330.016.46.5

B0

(mm)

10.3

K0

(mm)

2.1

P1

(mm)

8.0

WPin1

(mm)Quadrant

16.0Q1CD4048BM962500

PackMaterials-Page1

芯天下--/

PACKAGEMATERIALSINFORMATION

29-Jul-2009

*Alldimensionsarenominal

Device

CD4048BM96

PackageType

SOIC

PackageDrawing

D

Pins

16

SPQ

2500

Length(mm)

333.2

Width(mm)

345.9

Height(mm)

28.6

PackMaterials-Page2

芯天下--/

芯天下--/

芯天下--/

芯天下--/

芯天下--/

芯天下--/

芯天下--/

IMPORTANTNOTICE

TexasInstrumentsIncorporatedanditssubsidiaries(TI)reservetherighttomakecorrections,modifications,enhancements,improvements,

andotherchangestoitsproductsandseersshould

obtainthelatestrelevantinformationbeforeplacductsare

soldsubjecttoTI’stermsandconditionsofsalesuppliedatthetimeoforderacknowledgment.

TIwarrantsperformanceofitshardwareproductstothespecificationsapplicableatthetimeofsaleinaccordancewithTI’sstandard

gandotherqualitycontroltewhere

mandatedbygovernmentrequirements,testingofallparametersofeachproductisnotnecessarilyperformed.

TIassersareresponsiblefortheirproductsand

mizetherisksassociatedwithcustomerproductsandapplications,customersshouldprovide

adequatedesignandoperatingsafeguards.

TIdoesnotwarrantorrepresentthatanylicense,eitherexpressorimplied,isgrantedunderanyTIpatentright,copyright,maskworkright,

orotherTIintellectualpropertyrightrelatingtoanycombination,machine,ation

publishedbyTIregardingthird-partyproductsorservicesdoesnotconstitutealicensefromTItousesuchproductsorservicesora

uchinformationmayrequirealicensefromathirdpartyunderthepatentsorotherintellectual

propertyofthethirdparty,oralicensefromTIunderthepatentsorotherintellectualpropertyofTI.

ReproductionofTIinformationinTIdatabooksordatasheetsispermissibleonlyifreproductioniswithoutalterationandisaccompanied

byallassociatedwarranties,conditions,limitations,uctionofthisinformationwithalterationisanunfairanddeceptive

ationofthirdpartiesmaybesubjecttoadditional

restrictions.

ResaleofTIproductsorserviceswithstatementsdifferentfromorbeyondtheparametersstatedbyTIforthatproductorservicevoidsall

expressandanyimpliedwarrantiesfortheassocit

responsibleorliableforanysuchstatements.

TIproductsarenotauthorizedforuseinsafety-criticalapplications(suchaslifesupport)whereafailureoftheTIproductwouldreasonably

beexpectedtocauseseverepersonalinjuryordeath,unlessofficersofthepartieshaveexecutedanagreementspecificallygoverning

representthattheyhaveallnecessaryexpertiseinthesafetyandregulatoryramificationsoftheirapplications,and

acknowledgeandagreethattheyaresolelyresponsibleforalllegal,regulatoryandsafety-relatedrequirementsconcerningtheirproducts

andanyuseofTIproductsinsuchsafety-criticalapplications,notwithstandinganyapplications-relatedinformationorsupportthatmaybe

r,BuyersmustfullyindemnifyTIanditsrepresentativesagainstanydamagesarisingoutoftheuseofTIproductsin

suchsafety-criticalapplications.

TIproductsareneitherdesignednorintendedforuseinmilitary/aerospaceapplicationsorenvironmentsunlesstheTIproductsare

specificallydesignatedbyTIasmilitary-gradeor"enhancedplastic."OnlyproductsdesignatedbyTIasmilitary-grademeetmilitary

acknowledgeandagreethatanysuchuseofTIproductswhichTIhasnotdesignatedasmilitary-gradeissolelyat

theBuyer'srisk,andthattheyaresolelyresponsibleforcompliancewithalllegalandregulatoryrequirementsinconnectionwithsuchuse.

TIproductsareneitherdesignednorintendedforuseinautomotiveapplicationsorenvironmentsunlessthespecificTIproductsare

designatedbyTIascompliantwithISO/acknowledgeandagreethat,iftheyuseanynon-designated

productsinautomotiveapplications,TIwillnotberesponsibleforanyfailuretomeetsuchrequirements.

FollowingareURLswhereyoucanobtaininformationonotherTexasInstrumentsproductsandapplicationsolutions:

Products

Audio

Amplifiers

DataConverters

DLP®Products

DSP

ClocksandTimers

Interface

Logic

PowerMgmt

Microcontrollers

RFID

RF/IFandZigBee®Solutions

/audio

/clocks

/lprf

Applications

/communications

ComputersandPeripherals

ConsumerElectronics

EnergyandLighting

Industrial

Medical

Security

Space,AvionicsandDefense

Transportationand

Automotive

VideoandImaging

Wireless

/computers

/consumer-apps

/energy

/industrial

/medical

/security

/space-avionics-defense

/automotive

/video

/wireless-apps

MailingAddress:TexasInstruments,PostOfficeBox655303,Dallas,Texas75265

Copyright©2011,TexasInstrumentsIncorporated

芯天下--/

2024年9月19日发(作者:鲜于迈)

Data sheet acquired from Harris Semiconductor

SCHS045C − Revised October 2003

In addition to the eight input lines, an EXPAND

input is provided that permits the user to

increase the number of inputs into a CD4048B

(see Fig. 2). For example, two CD4048Bs can be

cascaded to provide a 16-input multifunction

gate. When the EXPAND input is not used, it

should be connected to V

SS

.

The CD4048B-series types are supplied in

16-lead hermetic dual-in-line ceramic packages

(F3A suffix), 16-lead dual-in-line plastic

packages (E suffix), 16-lead small-outline

packages (M, M96, MT, and NSR suffixes), and

16-lead thin shrink small-outline packages (PW

and PWR suffixes).

芯天下--/

Copyright© 2003, Texas Instruments Incorporated

芯天下--/

芯天下--/

芯天下--/

芯天下--/

PACKAGEOPTIONADDENDUM

11-Nov-2009

PACKAGINGINFORMATION

OrderableDevice

CD4048BE

CD4048BEE4

CD4048BF3A

CD4048BM

CD4048BM96

CD4048BM96E4

CD4048BM96G4

CD4048BME4

CD4048BMG4

CD4048BMT

CD4048BMTE4

CD4048BMTG4

CD4048BPW

CD4048BPWE4

CD4048BPWG4

(1)

Status

(1)

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

Package

Type

PDIP

PDIP

CDIP

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

SOIC

TSSOP

TSSOP

TSSOP

Package

Drawing

N

N

J

D

D

D

D

D

D

D

D

D

PW

PW

PW

PinsPackageEcoPlan

(2)

Qty

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

25

25

1

40

Pb-Free

(RoHS)

Pb-Free

(RoHS)

TBD

Green(RoHS&

noSb/Br)

Lead/BallFinish

CUNIPDAU

CUNIPDAU

A42

CUNIPDAU

CUNIPDAU

CUNIPDAU

CUNIPDAU

CUNIPDAU

CUNIPDAU

CUNIPDAU

CUNIPDAU

CUNIPDAU

CUNIPDAU

CUNIPDAU

CUNIPDAU

MSLPeakTemp

(3)

N/AforPkgType

N/AforPkgType

N/AforPkgType

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

Level-1-260C-UNLIM

2500Green(RoHS&

noSb/Br)

2500Green(RoHS&

noSb/Br)

2500Green(RoHS&

noSb/Br)

40

40

250

250

250

90

90

90

Green(RoHS&

noSb/Br)

Green(RoHS&

noSb/Br)

Green(RoHS&

noSb/Br)

Green(RoHS&

noSb/Br)

Green(RoHS&

noSb/Br)

Green(RoHS&

noSb/Br)

Green(RoHS&

noSb/Br)

Green(RoHS&

noSb/Br)

Themarketingstatusvaluesaredefinedasfollows:

ACTIVE:Productdevicerecommendedfornewdesigns.

LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect.

NRND:isinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartin

anewdesign.

PREVIEW:smayormaynotbeavailable.

OBSOLETE:TIhasdiscontinuedtheproductionofthedevice.

(2)

EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheck

/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails.

TBD:ThePb-Free/Greenconversionplanhasnotbeendefined.

Pb-Free(RoHS):TI'sterms"Lead-Free"or"Pb-Free"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirements

forall6substances,includingtherequirementthatleadnotexceed0.1%esignedtobesoldered

athightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses.

Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieand

package,or2)ponentisotherwiseconsideredPb-Free(RoHS

compatible)asdefinedabove.

Green(RoHS&noSb/Br):TIdefines"Green"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflame

retardants(BrorSbdonotexceed0.1%byweightinhomogeneousmaterial)

(3)

MSL,PeakTemp.--TheMoistureSensitivityLevelratingaccordingtotheJEDECindustrystandardclassifications,andpeaksolder

temperature.

Addendum-Page1

芯天下--/

PACKAGEOPTIONADDENDUM

11-Nov-2009

ImportantInformationandDisclaimer:TheinformationprovidedonthispagerepresentsTI'sknowledgeandbeliefasofthedatethatitis

sitsknowledgeandbeliefoninformationprovidedbythirdparties,andmakesnorepresentationorwarrantyastothe

akenandcontinuestotake

reasonablestepstoproviderepresentativeandaccurateinformationbutmaynothaveconducteddestructivetestingorchemicalanalysison

Isuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimited

informationmaynotbeavailableforrelease.

InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTI

toCustomeronanannualbasis.

Addendum-Page2

芯天下--/

PACKAGEMATERIALSINFORMATION

29-Jul-2009

TAPEANDREELINFORMATION

*Alldimensionsarenominal

DevicePackagePackagePins

TypeDrawing

SOICD16

SPQReelReelA0

DiameterWidth(mm)

(mm)W1(mm)

330.016.46.5

B0

(mm)

10.3

K0

(mm)

2.1

P1

(mm)

8.0

WPin1

(mm)Quadrant

16.0Q1CD4048BM962500

PackMaterials-Page1

芯天下--/

PACKAGEMATERIALSINFORMATION

29-Jul-2009

*Alldimensionsarenominal

Device

CD4048BM96

PackageType

SOIC

PackageDrawing

D

Pins

16

SPQ

2500

Length(mm)

333.2

Width(mm)

345.9

Height(mm)

28.6

PackMaterials-Page2

芯天下--/

芯天下--/

芯天下--/

芯天下--/

芯天下--/

芯天下--/

芯天下--/

IMPORTANTNOTICE

TexasInstrumentsIncorporatedanditssubsidiaries(TI)reservetherighttomakecorrections,modifications,enhancements,improvements,

andotherchangestoitsproductsandseersshould

obtainthelatestrelevantinformationbeforeplacductsare

soldsubjecttoTI’stermsandconditionsofsalesuppliedatthetimeoforderacknowledgment.

TIwarrantsperformanceofitshardwareproductstothespecificationsapplicableatthetimeofsaleinaccordancewithTI’sstandard

gandotherqualitycontroltewhere

mandatedbygovernmentrequirements,testingofallparametersofeachproductisnotnecessarilyperformed.

TIassersareresponsiblefortheirproductsand

mizetherisksassociatedwithcustomerproductsandapplications,customersshouldprovide

adequatedesignandoperatingsafeguards.

TIdoesnotwarrantorrepresentthatanylicense,eitherexpressorimplied,isgrantedunderanyTIpatentright,copyright,maskworkright,

orotherTIintellectualpropertyrightrelatingtoanycombination,machine,ation

publishedbyTIregardingthird-partyproductsorservicesdoesnotconstitutealicensefromTItousesuchproductsorservicesora

uchinformationmayrequirealicensefromathirdpartyunderthepatentsorotherintellectual

propertyofthethirdparty,oralicensefromTIunderthepatentsorotherintellectualpropertyofTI.

ReproductionofTIinformationinTIdatabooksordatasheetsispermissibleonlyifreproductioniswithoutalterationandisaccompanied

byallassociatedwarranties,conditions,limitations,uctionofthisinformationwithalterationisanunfairanddeceptive

ationofthirdpartiesmaybesubjecttoadditional

restrictions.

ResaleofTIproductsorserviceswithstatementsdifferentfromorbeyondtheparametersstatedbyTIforthatproductorservicevoidsall

expressandanyimpliedwarrantiesfortheassocit

responsibleorliableforanysuchstatements.

TIproductsarenotauthorizedforuseinsafety-criticalapplications(suchaslifesupport)whereafailureoftheTIproductwouldreasonably

beexpectedtocauseseverepersonalinjuryordeath,unlessofficersofthepartieshaveexecutedanagreementspecificallygoverning

representthattheyhaveallnecessaryexpertiseinthesafetyandregulatoryramificationsoftheirapplications,and

acknowledgeandagreethattheyaresolelyresponsibleforalllegal,regulatoryandsafety-relatedrequirementsconcerningtheirproducts

andanyuseofTIproductsinsuchsafety-criticalapplications,notwithstandinganyapplications-relatedinformationorsupportthatmaybe

r,BuyersmustfullyindemnifyTIanditsrepresentativesagainstanydamagesarisingoutoftheuseofTIproductsin

suchsafety-criticalapplications.

TIproductsareneitherdesignednorintendedforuseinmilitary/aerospaceapplicationsorenvironmentsunlesstheTIproductsare

specificallydesignatedbyTIasmilitary-gradeor"enhancedplastic."OnlyproductsdesignatedbyTIasmilitary-grademeetmilitary

acknowledgeandagreethatanysuchuseofTIproductswhichTIhasnotdesignatedasmilitary-gradeissolelyat

theBuyer'srisk,andthattheyaresolelyresponsibleforcompliancewithalllegalandregulatoryrequirementsinconnectionwithsuchuse.

TIproductsareneitherdesignednorintendedforuseinautomotiveapplicationsorenvironmentsunlessthespecificTIproductsare

designatedbyTIascompliantwithISO/acknowledgeandagreethat,iftheyuseanynon-designated

productsinautomotiveapplications,TIwillnotberesponsibleforanyfailuretomeetsuchrequirements.

FollowingareURLswhereyoucanobtaininformationonotherTexasInstrumentsproductsandapplicationsolutions:

Products

Audio

Amplifiers

DataConverters

DLP®Products

DSP

ClocksandTimers

Interface

Logic

PowerMgmt

Microcontrollers

RFID

RF/IFandZigBee®Solutions

/audio

/clocks

/lprf

Applications

/communications

ComputersandPeripherals

ConsumerElectronics

EnergyandLighting

Industrial

Medical

Security

Space,AvionicsandDefense

Transportationand

Automotive

VideoandImaging

Wireless

/computers

/consumer-apps

/energy

/industrial

/medical

/security

/space-avionics-defense

/automotive

/video

/wireless-apps

MailingAddress:TexasInstruments,PostOfficeBox655303,Dallas,Texas75265

Copyright©2011,TexasInstrumentsIncorporated

芯天下--/

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