2024年4月21日发(作者：滕琼岚)
覆铜板材料专业制造商
The professional manufacturer for CCL
产
品
资
料
Product Data
地址： 浙江省杭州市余杭镇金星工业园区
Address: Jinxing Industry Zone Yuhang Hangzhou Zhejiang
TEL: 86-
FAX: 86- PC: 311121
1
目录 / Catalog
板材 CCL
产品类别
Classification
板材型号
CCL Dsg.
特性简述
Feature
Tg
(DSC,℃)
页码
Page
常规FR-4
Conventional
FR-4
H140-1
/FR4-74
UV板
UV Blocking
135
or else Tg
3
无铅制程专用板
Lead-free
Compatible
H150
高耐热性中Tg板
Excellent thermal resistance &Mid-Tg
150 5
H170LF
高耐热性高Tg板
Excellent thermal resistance &Hi-Tg
170 7
无卤板
Halogen-free
Compatible
高CTI
High CTI
H1308
无卤板
Halogen-free
140
or else Tg
9
H1600 CTI 600 135 11
普通型UV板
CEM-3 H2130
Conventional, UV Blocking
散热性极佳，性价比高
Excellent thermal conductivity,
high cost performance
130 13
铝基板
Al-Substrate CCL
HA40系列 _ 15
附1. 半固化片规格Prepreg Spec.
Page17
附2. 覆铜板厚度公差表 / CCL thickness and tolerance list
2
Page 18
H140-1 / FR4-74
特性/ Features
Tg135±5℃ （DSC）
可依需求提供多种Tg值 / Different Tg available upon request Tg ：140±5℃、 Tg 150±5℃、 Tg 170±5℃
UV Blocking与 AOI兼容可提高PCB生产效率
UV Blocking and AOI compatible,so as to increase productivity efficiency
可依需求提供仪表专用的FR-4板材/ the meter appropriative FR-4 CCL upon request
可依需求提供具UV阻挡功能的自然色板材/ UV Blocking and natural color CCL upon request
可依需求提供不具UV阻挡功能的自然色板材（白料）/ No UV Blocking and natural color CCL upon request
应用领域/ Applications
电脑、通讯设备、仪器仪表、摄像机、 电视机、电子游戏机等.
Computer,Communication equipment, Instrumentation, VCR,Television, Electronic game machine, etc.
主要特性 / General properties
检测项目
Item
玻璃化转变温度Tg
剥离强度 1oz
Peel Strength
热应力
Thermal stress
弯曲强度
Flexural Strength
燃烧性Flammability
表面电阻Surface Resistivity
体积电阻VolumeResistivity
介电常数
Dielectric Constant
介质损耗角正切
Loss Tangent
耐电弧Arc Resistance
击穿电压
Dielectric Breakdown
吸水率Moisture Absorption
热分解温度Td
CTE
Z-axis
Alpha 1
Alpha 2
50 - 260 ℃
单位
Unit
℃
N/mm
S
N/mm
2
－
MΩ
MΩ·cm
－
－
S
KV
%
℃
ppm / ℃
ppm / ℃
%
min
V
TMA
IEC-60112
TMA
检测条件
Test Condition
DSC
288℃, 10S
288℃,solder dip
经向 LW
纬向CW
E 24/125
After moisture
After moisture
1 MHZ
C 24/23/50
1 MHZ
C 24/23/50
D48/50＋D0.5/23
D48/50＋D0.5/23
D24/23
Weight Loss 5%
规范值
Spec
135±5
≥1.40
＞10
≥415
≥345
UL94V-0
≥1.0×10
4
≥1.0×10
6
≤5.4
≤0.035
≥60
≥40
≤0.8
－
－
－
－
－
175～250
典型值
Typical Value
135.5
1.81
60 s
No delamination
580
485
V-0
5.16×10
7
5.07×10
8
4.6
0.015
125
58
0.15
306
65
305
4.5
2
175
T288
相比漏电起痕指数 CTI
Specimen Thickness : 1.6mm ;
Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water ;
E: Temperature conditioning ;
3
H140-1 / FR4-74
◆ 介电常数 / Dielectric constant
Dk
6
5
4
3
151050100
Frequency(MHz)
◆ 热处理后板材经纬向尺寸变化
Dimensional change in cross and length direction after heat treatment
尺
寸
变
化
率
D
i
m
e
n
s
i
o
n
a
l
c
h
a
n
g
e
%
0.01
经向 Length
wise
0
纬向 Cross
wise
-0.01
-0.02
处理前/untreated 105℃ 4h 150℃ 2h
处理条件
产品系列 / Purchasing information
厚度Thickness
0.15~3.2mm
铜箔Copper foil
18um ~ 105um
标准尺寸 Standard size
37"×49"、41"×49"、43"×49"
※ Other sheet size and thickness could be available upon request
4
H150 Lead-free
特性/ Features
Tg150±5℃ （DSC）
UV Blocking与 AOI兼容可提高PCB生产效率
UV Blocking and AOI compatible,so as to increase productivity efficiency
优异的耐热性，Td ≥325℃，T288≥5min ，适合于无铅焊工艺；
High thermal performance，Td ≥325℃ ,T288≥5min，suitable for lead-free process。
从环境温度到260℃ ，板材具备较低的膨胀系数；/ Lower CTE from ambient to 260℃。
应用领域/ Applications
适合于多层PCB、计算机及外围设备、通讯设备、办公自动设备、PCB无铅制程等。
Suitable for medium multilayer printed circuit board, computer, communication equipment, OA equipment,
lead-free PCB process etc.
主要特性 / General properties
检测项目
Item
玻璃化转变温度Tg
剥离强度 1oz Peel Strength
热应力
Thermal stress
弯曲强度
Flexural Strength
燃烧性Flammability
表面电阻Surface Resistivity
体积电阻VolumeResistivity
介电常数
Dielectric Constant
介质损耗角正切
Loss Tangent
耐电弧Arc Resistance
击穿电压
Dielectric Breakdown
吸水率Moisture Absorption
热分解温度Td
CTE
Z-axis
Alpha 1
Alpha 2
50 - 260 ℃
单位
Unit
℃
N/mm
S
N/mm
2
－
MΩ
MΩ·cm
－
－
S
KV
%
℃
ppm / ℃
ppm / ℃
%
min
V
TMA
IEC-60112
检测条件
Test Condition
DSC
288℃, 10S
288℃,solder dip
经向 LW
纬向CW
E 24/125
After moisture
After moisture
1 MHZ
C 24/23/50
1 MHZ
C 24/23/50
D48/50＋D0.5/23
D48/50＋D0.5/23
D24/23
Weight Loss 5%
TMA
规范值
Spec
150±5
≥1.05
＞10
≥415
≥345
UL94V-0
≥1.0×10
4
≥1.0×10
4
≤5.4
≤0.035
≥60
≥40
≤0.5
≥325
≤60
≤300
≤4.0
≥5
175～250
典型值
Typical Value
150.5
1.41
100 s
No delamination
570
465
V-0
6.12×10
7
6.25×10
8
4.5
0.016
125
57
0.16
338
52
285
3.8
12
175
T288
相比漏电起痕指数 CTI
Specimen Thickness : 1.6mm ;
Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water ;
E: Temperature conditioning ;
5
H150 Lead-free
◆
热压力容器蒸煮测试 /
PCT（High pressure cooker test ）
Solder Dipping
(288℃,10S)
PCT (E-120℃/ 105KPa)
Normal FR-4
H150
30min OK
OK
60min OK
OK
120min NG
OK
◆ 使用建议 / Suggestion for use
1、使用前请进行烘板处理：150 ℃、2h 。
Please baking the Laminate at 150 ℃、2 hours before using .
2、由于层间结合力较常规FR－4差，钻孔加工时请注意。
以典型的0.4～1.0mm钻嘴孔径为例，其建议钻孔参数如下：
钻刀转速：45~105 KRPM ， 进刀速度： 50~150 IPM
钻孔参数主要取决于孔的大小、内层厚度、层数、铜箔厚度和叠层厚度。
缩刀速度：500~1000 IPM， 最多使用次数：3000 HITS ( 若有填料，最多1000 HITS )
叠层高度：≤2pnls(2~6layers), 1pnl(≥8layers)
覆层材料：0.2mm Aluminum
Please pay attention to the Drilling for the interbedded energy is lower than the normal FR-4 .
Drilling parameters are mainly dependent on hole size, layer thickness, layer number, copper thickness and
stack height. The following drilling parameters are for reference only. Typical drilling parameters for
0.4~1.0 mm drills are as follows:
Spindle speed: 45~105 KRPM Feed rate: 50~150 IPM
Retract rate: 500~1000 IPM
Max. hit count: 3000 HITS ( if have fillers , max 1000 HITS )
Stack height: ≤2pnls(2~6layers), 1pnl(≥8layers) Entry Material: 0.2mm Aluminum
产品系列 / Purchasing information
厚度Thickness
0.15~3.2mm
铜箔Copper foil
18um ~ 105um
标准尺寸 Standard size
37"×49"、41"×49"、43"×49"
※ Other sheet size and thickness could be available upon request
6
H170LF Lead-free
特性/ Features
Tg170±5℃ （DSC）
UV Blocking与 AOI兼容可提高PCB生产效率
UV Blocking and AOI compatible,so as to increase productivity efficiency
优异的耐热性，Td ≥340℃，T288≥15min ，适合于无铅焊工艺；
High thermal performance，Td ≥340℃ ,T288≥15min，suitable for lead-free process。
从环境温度到260℃ ，板材具备较低的膨胀系数；/ Lower CTE from ambient to 260℃。
应用领域/ Applications
适合于高多层PCB、计算机及外围设备、通讯设备、办公自动设备、PCB无铅制程等。
Suitable for high-count layer PCB, computer, communication equipment, OA equipment,
lead-free PCB process etc.
主要特性 / General properties
检测项目
Item
玻璃化转变温度Tg
剥离强度 1oz Peel Strength
热应力
Thermal stress
弯曲强度
Flexural Strength
燃烧性Flammability
表面电阻Surface Resistivity
体积电阻VolumeResistivity
介电常数
Dielectric Constant
介质损耗角正切
Loss Tangent
耐电弧Arc Resistance
击穿电压
Dielectric Breakdown
吸水率Moisture Absorption
热分解温度Td
CTE
Z-axis
Alpha 1
Alpha 2
50 - 260 ℃
单位
Unit
℃
N/mm
S
N/mm
2
－
MΩ
MΩ·cm
－
－
S
KV
%
℃
ppm / ℃
ppm / ℃
%
min
V
TMA
IEC-60112
检测条件
Test Condition
DSC
288℃, 10S
288℃,solder dip
经向 LW
纬向CW
E 24/125
After moisture
After moisture
1 MHZ
C 24/23/50
1 MHZ
C 24/23/50
D48/50＋D0.5/23
D48/50＋D0.5/23
D24/23
Weight Loss 5%
TMA
规范值
Spec
170±5
≥1.05
＞10
≥415
≥345
UL94V-0
≥1.0×10
4
≥1.0×10
4
≤5.4
≤0.035
≥60
≥40
≤0.5
≥340
≤60
≤300
≤3.5
≥15
175～250
典型值
Typical Value
170.2
1.41
100 s
No delamination
580
482
V-0
2.52×10
7
3.21×10
8
4.6
0.016
122
58
0.16
347
51
281
3.3
19
175
T288
相比漏电起痕指数 CTI
Specimen Thickness : 1.6mm ;
Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water ;
E: Temperature conditioning ;
7
H170LF Lead-free
◆优异的耐热性 / Excellent thermal stress resistance
10
9
8
7
6
5
4
3
2
1
0
＞10
T
i
m
e
(
m
i
n
)
Test sample : H170LF and Normal FR-4 CCL Test Method : Solder dip 288℃
Test Results: H170LF is better than Normal FR-4 (time to delamination ).
Normal FR-4H170LF
◆ 使用建议 / Suggesti
on for use
1、使用前请进行烘板处理：150 ℃、2h 。
Please baking the Laminate at 150 ℃、2 hours before using.
2、由于层间结合力较常规FR－4差，钻孔加工时请注意。
钻孔参数主要取决于孔的大小、内层厚度、层数、铜箔厚度和叠层厚度。
以典型的0.4～1.0mm钻嘴孔径为例，其建议钻孔参数如下：
钻刀转速：45~105 KRPM ， 进刀速度： 50~150 IPM
缩刀速度：500~1000 IPM， 最多使用次数：3000 HITS ( 若有填料，最多1000 HITS )
叠层高度：≤2pnls(2~6layers), 1pnl(≥8layers)
覆层材料：0.2mm Aluminum
Please pay attention to the machining for the interbedded energy is lower than the normal FR-4 .
Drilling parameters are mainly dependent on hole size, layer thickness, layer number, copper thickness and
stack height. The following drilling parameters are for reference only. Typical drilling parameters for
0.4~1.0 mm drills are as follows:
Spindle speed: 45~105 KRPM Feed rate: 50~150 IPM
Retract rate: 500~1000 IPM
Max. hit count: 3000 HITS ( if have fillers , max 1000 HITS )
Stack height: ≤2pnls(2~6layers), 1pnl(≥8layers) Entry Material: 0.2mm Aluminum
产品系列 / Purchasing information
厚度Thickness
0.15~3.2mm
铜箔Copper foil
18um ~ 105um
标准尺寸 Standard size
37"×49"、41"×49"、43"×49"
※ Other sheet size and thickness could be available upon request
8
H1308 Halogen-free
特性/ Features
普通Tg无卤产品，UV Blocking与 AOI兼容
Normal Tg Halogen-free product, UV Blocking and AOI compatible
可依需求提供多种Tg值/ Different Tg available upon request Tg 150±5℃、Tg 170±5℃ ;
不含卤素、锑等成分 / Constituents free of halogen, antimony and etc.
阻燃性达到UL94V-0 / Flammability UL 94V-0 .
应用领域/ Applications
手机、电脑、通讯设备、仪器仪表、摄像机、电视机、电子游戏机等。
Mobile phone, Computer,Communication equipment , Instrumentation, VCR,Television, Electronic game
machine, etc.
主要特性 / General properties
检测项目
Item
玻璃化转变温度Tg
剥离强度 1oz
Peel Strength
热应力
Thermal stress
弯曲强度
Flexural Strength
燃烧性Flammability
表面电阻Surface Resistivity
体积电阻VolumeResistivity
介电常数
Dielectric Constant
介质损耗角正切
Loss Tangent
耐电弧Arc Resistance
击穿电压
Dielectric Breakdown
吸水率Moisture Absorption
热分解温度Td
CTE
Z-axis
Alpha 1
Alpha 2
50 - 260 ℃
单位
Unit
℃
N/mm
S
N/mm
2
－
MΩ
MΩ·cm
－
－
S
KV
%
℃
ppm / ℃
ppm / ℃
%
min
V
TMA
IEC-60112
检测条件
Test Condition
DSC
288℃, 10S
288℃,solder dip
经向 LW
纬向CW
E 24/125
After moisture
After moisture
1 MHZ
C 24/23/50
1 MHZ
C 24/23/50
D48/50＋D0.5/23
D48/50＋D0.5/23
D24/23
Weight Loss 5%
TMA
规范值
Spec
140±5
≥1.05
＞10
≥415
≥345
UL94V-1
≥1.0×10
4
≥1.0×10
6
≤5.4
≤0.035
≥60
≥40
≤0.5
≥310
≤60
≤300
≤4.0
≥5
175～250
典型值
Typical Value
141.8
1.39
100 s
No delamination
580
475
V-0
5.21×10
7
5.10×10
8
4.6
0.015
120
57
0.16
332
50
285
3.5
17
175
T288
相比漏电起痕指数 CTI
Specimen Thickness : 1.6mm ;
Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water ;
E: Temperature conditioning ;
9
H1308 Halogen-free
◆ 介电常数 / Dielectric constant
Dk
6
5
4
3
151050100
Frequency(MHz)
◆ 使用建议 / Suggestion for use
1、使用前请进行烘板处理：150 ℃、2h 。
Please baking the Laminate at 150 ℃、2 hours before using .
2、由于层间结合力较常规FR－4差，钻孔加工时请注意。
以典型的0.4～1.0mm钻嘴孔径为例，其建议钻孔参数如下：
钻刀转速：45~105 KRPM ， 进刀速度： 50~150 IPM
缩刀速度：500~1000 IPM， 最多使用次数：1000 HITS
叠层高度：≤2pnls(2~6layers), 1pnl(≥8layers)
覆层材料：0.2mm Aluminum
Please pay attention to the machining for the interbedded energy is lower than the normal FR-4 .
Drilling parameters are mainly dependent on hole size, layer thickness, layer number, copper thickness and
stack height. The following drilling parameters are for reference only. Typical drilling parameters for
0.4~1.0 mm drills are as follows:
Spindle speed: 45~105 KRPM Feed rate: 50~150 IPM
Retract rate: 500~1000 IPM Max. hit count: 1000 HITS
Stack height: ≤2pnls(2~6layers), 1pnl(≥8layers) Entry Material: 0.2mm Aluminum
钻孔参数主要取决于孔的大小、内层厚度、层数、铜箔厚度和叠层厚度。
产品系列 / Purchasing information
厚度Thickness
0.15~3.2mm
铜箔Copper foil
18um ~ 105um
标准尺寸 Standard size
37"×49"、41"×49"、43"×49"
※ Other sheet size and thickness could be available upon request
10
H1600 High CTI
特性/ Features
Tg135±5℃ （DSC）
优异的耐漏电起痕性，CTI≥600 / Excellent tracking resistance ,CTI ≥600
UV Blocking与 AOI兼容/UV Blocking and AOI compatible
优良的PCB加工性 / Good PCB processability
应用领域/ Applications
电源基板、电视机、电冰箱、洗衣机等。
Power base board、TV、refrigerator、 washing machine and etc.
主要特性 / General properties
检测项目
Item
玻璃化转变温度Tg
剥离强度 1oz
Peel Strength
热应力
Thermal stress
弯曲强度
Flexural Strength
燃烧性Flammability
表面电阻
SurfaceResistivity
体积电阻
Volume Resistivity
介电常数
Dielectric Constant
介质损耗角正切
Loss Tangent
耐电弧Arc Resistance
击穿电压
Dielectric Breakdown
吸水率Moisture Absorption
热分解温度Td
CTE
Z-axis
Alpha 1
Alpha 2
50 - 260 ℃
单位
Unit
℃
N/mm
S
N/mm
2
－
MΩ
MΩ·cm
－
－
S
KV
%
℃
ppm / ℃
ppm / ℃
%
min
V
TMA
IEC-60112
TMA
检测条件
Test Condition
DSC
288℃, 10S
288℃,solder dip
经向 LW
纬向CW
E 24/125
After moisture
After moisture
1 MHZ
C 24/23/50
1 MHZ
C 24/23/50
D48/50＋D0.5/23
D48/50＋D0.5/23
D24/23
Weight Loss 5%
规范值
Spec
135±5
≥1.40
＞10
≥415
≥345
UL94V-0
≥1.0×10
4
≥1.0×10
6
≤5.4
≤0.035
≥60
≥40
≤0.8
－
－
－
－
－
≥600
典型值
Typical Value
135.2
1.75
60 s
No delamination
577
470
V-0
5.12×10
7
5.25×10
8
4.6
0.015
120
57
0.15
305
68
315
4.5
2
600
T288
相比漏电起痕指数 CTI
Specimen Thickness : 1.6mm ;
Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water ;
E: Temperature conditioning ;
11
H1600 High CTI
◆ 介电常数 / Dielectric constant
Dk
6
5
4
3
151050100
Frequency(MHz)
◆ 热处理后板材经纬向尺寸变化
Dimensional change in cross and length direction after heat treatment
尺
寸
变
化
率
D
i
m
e
n
s
i
o
n
a
l
c
h
a
n
g
e
%
0.01
经向 Length
wise
0
纬向 Cross
wise
-0.01
-0.02
处理前/untreated 105℃ 4h 150℃ 2h
处理条件
产品系列 / Purchasing information
厚度Thickness
0.63~3.2mm
铜箔Copper foil
18um ~ 105um
标准尺寸 Standard size
37"×49"、41"×49"、43"×49"
※ Other sheet size and thickness could be available upon request
12
H2130 /
CEM-3
特性/ Features
优秀的机械加工性，可冲孔加工，钻孔加工钻头使用寿命可延长
Excellent mechanical processability, punching process applicable, longer drill bit life .
电性能与FR-4相当，加工工艺与FR-4相同
Electrical properties and PCB processing similar to FR-4.
可依需求提供高CTI的CEM-3板材/ High CTI CEM-3 available upon request （CTI 600）;
应用领域/ Applications
汽车电子、仪器仪表、信息家电、自动控制器、游戏机等。
Automotive electronics,apparatus and instrument,information household appliances,remote control unit,
game machine,and etc.
主要特性 / General properties
检测项目
Item
玻璃化转变温度Tg
剥离强度
1oz Peel Strength
热应力
Thermal stress
弯曲强度
Flexural Strength
燃烧性Flammability
表面电阻
Surface Resistivity
体积电阻
VolumeResistivity
介电常数
Dielectric Constant
介质损耗角正切
Loss Tangent
耐电弧Arc Resistance
击穿电压
Dielectric Breakdown
吸水率
Moisture Absorption
CTE
Z-axis
Alpha 1
Alpha 2
50 - 260 ℃
单位
Unit
℃
N/mm
S
N/mm
2
－
MΩ
MΩ·cm
－
－
S
KV
%
ppm / ℃
ppm / ℃
%
V IEC-60112
检测条件
Test Condition
DSC
260℃, 10S
260℃,solder dip
经向 LW
纬向CW
E 24/125
After moisture
After moisture
1 MHZ
C 24/23/50
1 MHZ
C 24/23/50
D48/50＋D0.5/23
D48/50＋D0.5/23
D24/23
TMA
规范值
Spec
≥120
≥1.05
＞10
≥276
≥186
UL94V-0
≥1.0×10
4
≥1.0×10
6
≤5.4
≤0.035
≥60
≥40
≤0.5
-
-
-
175～250
典型值
Typical Value
128.5
1.54
60s
No delamination
380
300
V-0
2.37×10
6
2.67×10
8
4.7
0.016
120
55
0.17
63
350
5.2
200 相比漏电起痕指数 CTI
Specimen Thickness : 1.6mm ;
Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water ;
E: Temperature conditioning ;
13
H2130 /
CEM-3
◆ 介电常数 / Dielectric constant
Dk
6
5
4
3
151050100
Frequency(MHz)
◆ 热处理后板材经纬向尺寸变化
Dimensional change in cross and length direction after heat treatment
尺
寸
变
化
率
D
i
m
e
n
s
i
o
n
a
l
c
h
a
n
g
e
%
0.03
0.02
0.01
0
-0.01
-0.02
-0.03
处理前/untreated 105℃ 4h 150℃ 2h
经向 Length
wise
纬向 Cross
wise
处理条件
产品系列 / Purchasing information
厚度Thickness
0.6~3.2mm
铜箔Copper foil
18um ~ 105um
标准尺寸 Standard size
37"×49"、41"×49"、43"×49"
※ Other sheet size and thickness could be available upon request
14
铝基板介绍
Al-Substrate CCL Introduction
类型Type 介绍Introduction
中高导热型 热导率1.0～2.0 W/ M·K，可满足中高端产品需求，性价比高；
High Thermal Conductivity Thermal conductivity 1.0～2.0 W/ M·K，It can fit the demand of high end
Type and mid-range products，with high cost performance.
基本结构Basic Structure
说明 / Instruction
导电层—电解铜箔 / Circuit Layer – Electrolysis copper foil
导热绝缘层—以最小的热阻提供电学上的绝缘，分为玻璃布增强型和无玻璃布增强型两种
Thermally Conductive Dielectric Layer –This offers electrical isolation with minimum thermal resistance.
two types: Fiberglass support & non-fiberglass support.
铝基层—是整个结构的支撑和热量的发散，材料为铝合金板
Aluminum SubstrateIt –supports the entire structure and conducts the heat.
The material is aluminum alloy plate.
特性/ Features
优异的散热性能 Excellent thermal conductivity
良好的尺寸稳定性能 Excellent dimensional stability
良好的机械加工性能 Excellent mechanical properties
电磁屏蔽性能 Excellent electromagnetic shielding
可直接外接散热装置 Can use external cooling device directly
优良的性价比 High cost performance
应用领域 / Application
LED照明电路
LED lighting circuit
电源电路 Power supply
混合集成电路 Hybrid integrated circuits
固态继电器 Solid State Relays
LCD背光源
LCD Backlights
需要高散热的领域 The area needs high heat dissipation
15
主要性能 Main property
典型值 Typical Value
项目
Item
热阻
Thermal Impedance
热导率
Thermal Conductivity
剥离强度
Peel Strength
热应力Thermal Stress
表面电阻
Surface Resistivity
体积电阻
Volume Resistivity
电气强度
Elecctrical Strength
介电常数（1MHz）
Dielectric Constant
耐电弧
Arc Resistance
处理条件
Test condition
A
Internal TO-220
A
ASTM 5470-D
单位
Units
指标值
Spec
类型1
Type1
类型2
Type2
0.45
2.0
℃/W
W/ M·K
≤1.0 0.7
1.0-2.01.3
A 1.95 1.84
N/mm ≥1.4
热应力后
1.85 1.73
288℃,solder dip
C96/35/90
E-24/125
C96/35/90
E-24/125
A
IPC-TM-650 2.5.6.2
C 24/23/50
IPC-TM-650 2.5.5.2
D48/50＋D0.5/23
IPC-TM-650 2.5.1
S ≥20
≥10
4
≥10
3
≥10
6
≥10
3
120S
No delamination
10
6
10
5
10
7
10
5
120S
No delamination
10
6
10
5
10
7
10
5
30
7.0
120
V-0
133.6
0.18
200
MΩ
MΩ·cm
KV/mm≥20 30
7.0 — —
S ≥60 120
燃烧性Flammability E-24/125
吸水率
Water Absorption
D-24/23
IPC-TM-650 2.6.2.1
— V-0 V-0
133.2 Tg DSC ℃ 130±5
% ≤0.5 0.17
CTI IEC60112 V ≥175 200
* 热阻系数均为1.6mm基材，铜箔厚度1oz下的测量值，热导率为绝缘层介质的热导率参数
* Thermal impedance is based on the measured value of 1.6mm base material with 1oz Copper foil.
Thermal conductivity is the parameters of thermally conductive dielectric layer.
产品规格Specification
标准尺寸Standard Size（mm）
导电层Circuit Layer
（电解铜箔Copper foil）
500mm×600mm、 500×1200mm、
600mm×1200mm、1100mm×1200mm
18μm、35μm、70μm、105μm（Hoz、1oz、2oz、3oz）
导热绝缘层厚度Thermally Conductive
75μm、100μm、125μm、150μm(3mil、4mil、5mil、6mil)
Dielectric Layer Thickness
铝基层厚度
Aluminum Substrate Thickness
1.0mm、1.2mm、1.5mm、2.0mm
※如有特殊要求，可定制Other sheet size and thickness could be available upon request
16
半固化片介绍/
Prepreg instruction
UV
Prepreg
我司的UV系列半固化片具有优良的粘结强度，优异的固化稳定性，作业窗口宽，可用于多层
板的制作，其燃烧特性符合UL94V-0级，压制后成品可达到IPC-4101/21相关要求。
The UV Prepreg have excellent bonding strength, excellent gel stability, with wide operating window.
Suitable for the multilayer printed circuit board. Flammability accord UL94V-0 grade. After press process,
the final product accord IPC-4101/21 standard 。
其规格spec参数如下：(Test method : IPC-TM-650)
玻璃布型号 树脂含量 (%) 凝胶化时间(s)流动度(%) 挥发份max
Fabric Type Resin content (%) Gel time (s) Resin flow (%)VC(%)
7628
7628
7628HRC
7628HRC
2116
1080
43 ± 3
45 ± 3
48 ± 3
50 ± 3
53 ± 3
63 ± 3
110 ± 20
110 ± 20
105 ± 20
100 ± 20
100 ± 20
100 ± 20
21 ± 3
23 ± 3
27 ± 3
28 ± 3
28 ± 3
37 ± 3
0.5
0.5
0.5
0.5
0.5
0.5
固化后厚度(μm)
Cured thickness (μm)
180～210（7.1~8.3 mil）
190～220（7.5~8.7 mil）
205～235（8.1~9.3 mil）
230～260（9.1~10.2 mil）
120～140（4.7~5.5 mil）
70～85（2.8~3.3 mil）
建议压制程式： Suggest cycle
一般建议料温70℃~120℃的升温
速率为1.5~2.5℃/min，同时料温
170℃以上维持30min为宜；
Commonly suggest the heat up rate
of the material Temp from 70℃ to
120℃ is 1.5~2.5℃/min ,and the
material Temp 170℃ above may as
well keep 30min appropriate .
储存条件：
温度≤20℃、湿度≤50%，保存时间3个月；温度≤5℃、密封条件下，保存时间6个月.
Storage Condition
: T≤20℃& ≤50%RH,Within 3 months; T≤5 ℃ Within 6 months (seal condition).
在上述要求内，我司可立即安排PP送样；若有特殊要求，由供需双方商定。Follow upwards condition,
Our company will arrange sample immediately. We can negotiation if you have special requirement.
17
覆铜板厚度公差表
CCL thickness and tolerance list
标准厚度mm
standard
thickness
厚度公差 mm / tolerance
Class B/L级 Class C/M级
0.025～0.119 ±0.018 ±0.013
0.120～0.164 ±0.025 ±0.018
0.165～0.299 ±0.038 ±0.025
0.300～0.499 ±0.050 ±0.038
0.500～0.785 ±0.064 ±0.050
0.786～1.039 ±0.100 ±0.075
1.040～1.674 ±0.130 ±0.075
1.675～2.564 ±0.180 ±0.100
2.565～3.579 ±0.230 ±0.130
3.580～6.350 ±0.300 ±0.150
※ 一般情况下，华正电子依照二级厚度公差（B/L级）要求接单作业，加严厚度公差（三级公差
C/M级）或特殊厚度公差要求可协商解决。
Commonly , we will accept the order form according to the Class B/L , the Class C/M or other special
tolerance could be available upon request.
※ Class B、C表示不含铜箔的板材厚度； Class L、M为含铜箔在内的板材厚度；
Class B、C figure the dielectric thickness ；Class L、M figure the overall thickness；
如下图 / As follows：
铜箔层
metal cladding
总厚度 overall thickness
Class L、M
铜箔层 metal cladding
绝缘层厚度 dielectric thickness
Class B、C
18
2024年4月21日发(作者：滕琼岚)
覆铜板材料专业制造商
The professional manufacturer for CCL
产
品
资
料
Product Data
地址： 浙江省杭州市余杭镇金星工业园区
Address: Jinxing Industry Zone Yuhang Hangzhou Zhejiang
TEL: 86-
FAX: 86- PC: 311121
1
目录 / Catalog
板材 CCL
产品类别
Classification
板材型号
CCL Dsg.
特性简述
Feature
Tg
(DSC,℃)
页码
Page
常规FR-4
Conventional
FR-4
H140-1
/FR4-74
UV板
UV Blocking
135
or else Tg
3
无铅制程专用板
Lead-free
Compatible
H150
高耐热性中Tg板
Excellent thermal resistance &Mid-Tg
150 5
H170LF
高耐热性高Tg板
Excellent thermal resistance &Hi-Tg
170 7
无卤板
Halogen-free
Compatible
高CTI
High CTI
H1308
无卤板
Halogen-free
140
or else Tg
9
H1600 CTI 600 135 11
普通型UV板
CEM-3 H2130
Conventional, UV Blocking
散热性极佳，性价比高
Excellent thermal conductivity,
high cost performance
130 13
铝基板
Al-Substrate CCL
HA40系列 _ 15
附1. 半固化片规格Prepreg Spec.
Page17
附2. 覆铜板厚度公差表 / CCL thickness and tolerance list
2
Page 18
H140-1 / FR4-74
特性/ Features
Tg135±5℃ （DSC）
可依需求提供多种Tg值 / Different Tg available upon request Tg ：140±5℃、 Tg 150±5℃、 Tg 170±5℃
UV Blocking与 AOI兼容可提高PCB生产效率
UV Blocking and AOI compatible,so as to increase productivity efficiency
可依需求提供仪表专用的FR-4板材/ the meter appropriative FR-4 CCL upon request
可依需求提供具UV阻挡功能的自然色板材/ UV Blocking and natural color CCL upon request
可依需求提供不具UV阻挡功能的自然色板材（白料）/ No UV Blocking and natural color CCL upon request
应用领域/ Applications
电脑、通讯设备、仪器仪表、摄像机、 电视机、电子游戏机等.
Computer,Communication equipment, Instrumentation, VCR,Television, Electronic game machine, etc.
主要特性 / General properties
检测项目
Item
玻璃化转变温度Tg
剥离强度 1oz
Peel Strength
热应力
Thermal stress
弯曲强度
Flexural Strength
燃烧性Flammability
表面电阻Surface Resistivity
体积电阻VolumeResistivity
介电常数
Dielectric Constant
介质损耗角正切
Loss Tangent
耐电弧Arc Resistance
击穿电压
Dielectric Breakdown
吸水率Moisture Absorption
热分解温度Td
CTE
Z-axis
Alpha 1
Alpha 2
50 - 260 ℃
单位
Unit
℃
N/mm
S
N/mm
2
－
MΩ
MΩ·cm
－
－
S
KV
%
℃
ppm / ℃
ppm / ℃
%
min
V
TMA
IEC-60112
TMA
检测条件
Test Condition
DSC
288℃, 10S
288℃,solder dip
经向 LW
纬向CW
E 24/125
After moisture
After moisture
1 MHZ
C 24/23/50
1 MHZ
C 24/23/50
D48/50＋D0.5/23
D48/50＋D0.5/23
D24/23
Weight Loss 5%
规范值
Spec
135±5
≥1.40
＞10
≥415
≥345
UL94V-0
≥1.0×10
4
≥1.0×10
6
≤5.4
≤0.035
≥60
≥40
≤0.8
－
－
－
－
－
175～250
典型值
Typical Value
135.5
1.81
60 s
No delamination
580
485
V-0
5.16×10
7
5.07×10
8
4.6
0.015
125
58
0.15
306
65
305
4.5
2
175
T288
相比漏电起痕指数 CTI
Specimen Thickness : 1.6mm ;
Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water ;
E: Temperature conditioning ;
3
H140-1 / FR4-74
◆ 介电常数 / Dielectric constant
Dk
6
5
4
3
151050100
Frequency(MHz)
◆ 热处理后板材经纬向尺寸变化
Dimensional change in cross and length direction after heat treatment
尺
寸
变
化
率
D
i
m
e
n
s
i
o
n
a
l
c
h
a
n
g
e
%
0.01
经向 Length
wise
0
纬向 Cross
wise
-0.01
-0.02
处理前/untreated 105℃ 4h 150℃ 2h
处理条件
产品系列 / Purchasing information
厚度Thickness
0.15~3.2mm
铜箔Copper foil
18um ~ 105um
标准尺寸 Standard size
37"×49"、41"×49"、43"×49"
※ Other sheet size and thickness could be available upon request
4
H150 Lead-free
特性/ Features
Tg150±5℃ （DSC）
UV Blocking与 AOI兼容可提高PCB生产效率
UV Blocking and AOI compatible,so as to increase productivity efficiency
优异的耐热性，Td ≥325℃，T288≥5min ，适合于无铅焊工艺；
High thermal performance，Td ≥325℃ ,T288≥5min，suitable for lead-free process。
从环境温度到260℃ ，板材具备较低的膨胀系数；/ Lower CTE from ambient to 260℃。
应用领域/ Applications
适合于多层PCB、计算机及外围设备、通讯设备、办公自动设备、PCB无铅制程等。
Suitable for medium multilayer printed circuit board, computer, communication equipment, OA equipment,
lead-free PCB process etc.
主要特性 / General properties
检测项目
Item
玻璃化转变温度Tg
剥离强度 1oz Peel Strength
热应力
Thermal stress
弯曲强度
Flexural Strength
燃烧性Flammability
表面电阻Surface Resistivity
体积电阻VolumeResistivity
介电常数
Dielectric Constant
介质损耗角正切
Loss Tangent
耐电弧Arc Resistance
击穿电压
Dielectric Breakdown
吸水率Moisture Absorption
热分解温度Td
CTE
Z-axis
Alpha 1
Alpha 2
50 - 260 ℃
单位
Unit
℃
N/mm
S
N/mm
2
－
MΩ
MΩ·cm
－
－
S
KV
%
℃
ppm / ℃
ppm / ℃
%
min
V
TMA
IEC-60112
检测条件
Test Condition
DSC
288℃, 10S
288℃,solder dip
经向 LW
纬向CW
E 24/125
After moisture
After moisture
1 MHZ
C 24/23/50
1 MHZ
C 24/23/50
D48/50＋D0.5/23
D48/50＋D0.5/23
D24/23
Weight Loss 5%
TMA
规范值
Spec
150±5
≥1.05
＞10
≥415
≥345
UL94V-0
≥1.0×10
4
≥1.0×10
4
≤5.4
≤0.035
≥60
≥40
≤0.5
≥325
≤60
≤300
≤4.0
≥5
175～250
典型值
Typical Value
150.5
1.41
100 s
No delamination
570
465
V-0
6.12×10
7
6.25×10
8
4.5
0.016
125
57
0.16
338
52
285
3.8
12
175
T288
相比漏电起痕指数 CTI
Specimen Thickness : 1.6mm ;
Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water ;
E: Temperature conditioning ;
5
H150 Lead-free
◆
热压力容器蒸煮测试 /
PCT（High pressure cooker test ）
Solder Dipping
(288℃,10S)
PCT (E-120℃/ 105KPa)
Normal FR-4
H150
30min OK
OK
60min OK
OK
120min NG
OK
◆ 使用建议 / Suggestion for use
1、使用前请进行烘板处理：150 ℃、2h 。
Please baking the Laminate at 150 ℃、2 hours before using .
2、由于层间结合力较常规FR－4差，钻孔加工时请注意。
以典型的0.4～1.0mm钻嘴孔径为例，其建议钻孔参数如下：
钻刀转速：45~105 KRPM ， 进刀速度： 50~150 IPM
钻孔参数主要取决于孔的大小、内层厚度、层数、铜箔厚度和叠层厚度。
缩刀速度：500~1000 IPM， 最多使用次数：3000 HITS ( 若有填料，最多1000 HITS )
叠层高度：≤2pnls(2~6layers), 1pnl(≥8layers)
覆层材料：0.2mm Aluminum
Please pay attention to the Drilling for the interbedded energy is lower than the normal FR-4 .
Drilling parameters are mainly dependent on hole size, layer thickness, layer number, copper thickness and
stack height. The following drilling parameters are for reference only. Typical drilling parameters for
0.4~1.0 mm drills are as follows:
Spindle speed: 45~105 KRPM Feed rate: 50~150 IPM
Retract rate: 500~1000 IPM
Max. hit count: 3000 HITS ( if have fillers , max 1000 HITS )
Stack height: ≤2pnls(2~6layers), 1pnl(≥8layers) Entry Material: 0.2mm Aluminum
产品系列 / Purchasing information
厚度Thickness
0.15~3.2mm
铜箔Copper foil
18um ~ 105um
标准尺寸 Standard size
37"×49"、41"×49"、43"×49"
※ Other sheet size and thickness could be available upon request
6
H170LF Lead-free
特性/ Features
Tg170±5℃ （DSC）
UV Blocking与 AOI兼容可提高PCB生产效率
UV Blocking and AOI compatible,so as to increase productivity efficiency
优异的耐热性，Td ≥340℃，T288≥15min ，适合于无铅焊工艺；
High thermal performance，Td ≥340℃ ,T288≥15min，suitable for lead-free process。
从环境温度到260℃ ，板材具备较低的膨胀系数；/ Lower CTE from ambient to 260℃。
应用领域/ Applications
适合于高多层PCB、计算机及外围设备、通讯设备、办公自动设备、PCB无铅制程等。
Suitable for high-count layer PCB, computer, communication equipment, OA equipment,
lead-free PCB process etc.
主要特性 / General properties
检测项目
Item
玻璃化转变温度Tg
剥离强度 1oz Peel Strength
热应力
Thermal stress
弯曲强度
Flexural Strength
燃烧性Flammability
表面电阻Surface Resistivity
体积电阻VolumeResistivity
介电常数
Dielectric Constant
介质损耗角正切
Loss Tangent
耐电弧Arc Resistance
击穿电压
Dielectric Breakdown
吸水率Moisture Absorption
热分解温度Td
CTE
Z-axis
Alpha 1
Alpha 2
50 - 260 ℃
单位
Unit
℃
N/mm
S
N/mm
2
－
MΩ
MΩ·cm
－
－
S
KV
%
℃
ppm / ℃
ppm / ℃
%
min
V
TMA
IEC-60112
检测条件
Test Condition
DSC
288℃, 10S
288℃,solder dip
经向 LW
纬向CW
E 24/125
After moisture
After moisture
1 MHZ
C 24/23/50
1 MHZ
C 24/23/50
D48/50＋D0.5/23
D48/50＋D0.5/23
D24/23
Weight Loss 5%
TMA
规范值
Spec
170±5
≥1.05
＞10
≥415
≥345
UL94V-0
≥1.0×10
4
≥1.0×10
4
≤5.4
≤0.035
≥60
≥40
≤0.5
≥340
≤60
≤300
≤3.5
≥15
175～250
典型值
Typical Value
170.2
1.41
100 s
No delamination
580
482
V-0
2.52×10
7
3.21×10
8
4.6
0.016
122
58
0.16
347
51
281
3.3
19
175
T288
相比漏电起痕指数 CTI
Specimen Thickness : 1.6mm ;
Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water ;
E: Temperature conditioning ;
7
H170LF Lead-free
◆优异的耐热性 / Excellent thermal stress resistance
10
9
8
7
6
5
4
3
2
1
0
＞10
T
i
m
e
(
m
i
n
)
Test sample : H170LF and Normal FR-4 CCL Test Method : Solder dip 288℃
Test Results: H170LF is better than Normal FR-4 (time to delamination ).
Normal FR-4H170LF
◆ 使用建议 / Suggesti
on for use
1、使用前请进行烘板处理：150 ℃、2h 。
Please baking the Laminate at 150 ℃、2 hours before using.
2、由于层间结合力较常规FR－4差，钻孔加工时请注意。
钻孔参数主要取决于孔的大小、内层厚度、层数、铜箔厚度和叠层厚度。
以典型的0.4～1.0mm钻嘴孔径为例，其建议钻孔参数如下：
钻刀转速：45~105 KRPM ， 进刀速度： 50~150 IPM
缩刀速度：500~1000 IPM， 最多使用次数：3000 HITS ( 若有填料，最多1000 HITS )
叠层高度：≤2pnls(2~6layers), 1pnl(≥8layers)
覆层材料：0.2mm Aluminum
Please pay attention to the machining for the interbedded energy is lower than the normal FR-4 .
Drilling parameters are mainly dependent on hole size, layer thickness, layer number, copper thickness and
stack height. The following drilling parameters are for reference only. Typical drilling parameters for
0.4~1.0 mm drills are as follows:
Spindle speed: 45~105 KRPM Feed rate: 50~150 IPM
Retract rate: 500~1000 IPM
Max. hit count: 3000 HITS ( if have fillers , max 1000 HITS )
Stack height: ≤2pnls(2~6layers), 1pnl(≥8layers) Entry Material: 0.2mm Aluminum
产品系列 / Purchasing information
厚度Thickness
0.15~3.2mm
铜箔Copper foil
18um ~ 105um
标准尺寸 Standard size
37"×49"、41"×49"、43"×49"
※ Other sheet size and thickness could be available upon request
8
H1308 Halogen-free
特性/ Features
普通Tg无卤产品，UV Blocking与 AOI兼容
Normal Tg Halogen-free product, UV Blocking and AOI compatible
可依需求提供多种Tg值/ Different Tg available upon request Tg 150±5℃、Tg 170±5℃ ;
不含卤素、锑等成分 / Constituents free of halogen, antimony and etc.
阻燃性达到UL94V-0 / Flammability UL 94V-0 .
应用领域/ Applications
手机、电脑、通讯设备、仪器仪表、摄像机、电视机、电子游戏机等。
Mobile phone, Computer,Communication equipment , Instrumentation, VCR,Television, Electronic game
machine, etc.
主要特性 / General properties
检测项目
Item
玻璃化转变温度Tg
剥离强度 1oz
Peel Strength
热应力
Thermal stress
弯曲强度
Flexural Strength
燃烧性Flammability
表面电阻Surface Resistivity
体积电阻VolumeResistivity
介电常数
Dielectric Constant
介质损耗角正切
Loss Tangent
耐电弧Arc Resistance
击穿电压
Dielectric Breakdown
吸水率Moisture Absorption
热分解温度Td
CTE
Z-axis
Alpha 1
Alpha 2
50 - 260 ℃
单位
Unit
℃
N/mm
S
N/mm
2
－
MΩ
MΩ·cm
－
－
S
KV
%
℃
ppm / ℃
ppm / ℃
%
min
V
TMA
IEC-60112
检测条件
Test Condition
DSC
288℃, 10S
288℃,solder dip
经向 LW
纬向CW
E 24/125
After moisture
After moisture
1 MHZ
C 24/23/50
1 MHZ
C 24/23/50
D48/50＋D0.5/23
D48/50＋D0.5/23
D24/23
Weight Loss 5%
TMA
规范值
Spec
140±5
≥1.05
＞10
≥415
≥345
UL94V-1
≥1.0×10
4
≥1.0×10
6
≤5.4
≤0.035
≥60
≥40
≤0.5
≥310
≤60
≤300
≤4.0
≥5
175～250
典型值
Typical Value
141.8
1.39
100 s
No delamination
580
475
V-0
5.21×10
7
5.10×10
8
4.6
0.015
120
57
0.16
332
50
285
3.5
17
175
T288
相比漏电起痕指数 CTI
Specimen Thickness : 1.6mm ;
Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water ;
E: Temperature conditioning ;
9
H1308 Halogen-free
◆ 介电常数 / Dielectric constant
Dk
6
5
4
3
151050100
Frequency(MHz)
◆ 使用建议 / Suggestion for use
1、使用前请进行烘板处理：150 ℃、2h 。
Please baking the Laminate at 150 ℃、2 hours before using .
2、由于层间结合力较常规FR－4差，钻孔加工时请注意。
以典型的0.4～1.0mm钻嘴孔径为例，其建议钻孔参数如下：
钻刀转速：45~105 KRPM ， 进刀速度： 50~150 IPM
缩刀速度：500~1000 IPM， 最多使用次数：1000 HITS
叠层高度：≤2pnls(2~6layers), 1pnl(≥8layers)
覆层材料：0.2mm Aluminum
Please pay attention to the machining for the interbedded energy is lower than the normal FR-4 .
Drilling parameters are mainly dependent on hole size, layer thickness, layer number, copper thickness and
stack height. The following drilling parameters are for reference only. Typical drilling parameters for
0.4~1.0 mm drills are as follows:
Spindle speed: 45~105 KRPM Feed rate: 50~150 IPM
Retract rate: 500~1000 IPM Max. hit count: 1000 HITS
Stack height: ≤2pnls(2~6layers), 1pnl(≥8layers) Entry Material: 0.2mm Aluminum
钻孔参数主要取决于孔的大小、内层厚度、层数、铜箔厚度和叠层厚度。
产品系列 / Purchasing information
厚度Thickness
0.15~3.2mm
铜箔Copper foil
18um ~ 105um
标准尺寸 Standard size
37"×49"、41"×49"、43"×49"
※ Other sheet size and thickness could be available upon request
10
H1600 High CTI
特性/ Features
Tg135±5℃ （DSC）
优异的耐漏电起痕性，CTI≥600 / Excellent tracking resistance ,CTI ≥600
UV Blocking与 AOI兼容/UV Blocking and AOI compatible
优良的PCB加工性 / Good PCB processability
应用领域/ Applications
电源基板、电视机、电冰箱、洗衣机等。
Power base board、TV、refrigerator、 washing machine and etc.
主要特性 / General properties
检测项目
Item
玻璃化转变温度Tg
剥离强度 1oz
Peel Strength
热应力
Thermal stress
弯曲强度
Flexural Strength
燃烧性Flammability
表面电阻
SurfaceResistivity
体积电阻
Volume Resistivity
介电常数
Dielectric Constant
介质损耗角正切
Loss Tangent
耐电弧Arc Resistance
击穿电压
Dielectric Breakdown
吸水率Moisture Absorption
热分解温度Td
CTE
Z-axis
Alpha 1
Alpha 2
50 - 260 ℃
单位
Unit
℃
N/mm
S
N/mm
2
－
MΩ
MΩ·cm
－
－
S
KV
%
℃
ppm / ℃
ppm / ℃
%
min
V
TMA
IEC-60112
TMA
检测条件
Test Condition
DSC
288℃, 10S
288℃,solder dip
经向 LW
纬向CW
E 24/125
After moisture
After moisture
1 MHZ
C 24/23/50
1 MHZ
C 24/23/50
D48/50＋D0.5/23
D48/50＋D0.5/23
D24/23
Weight Loss 5%
规范值
Spec
135±5
≥1.40
＞10
≥415
≥345
UL94V-0
≥1.0×10
4
≥1.0×10
6
≤5.4
≤0.035
≥60
≥40
≤0.8
－
－
－
－
－
≥600
典型值
Typical Value
135.2
1.75
60 s
No delamination
577
470
V-0
5.12×10
7
5.25×10
8
4.6
0.015
120
57
0.15
305
68
315
4.5
2
600
T288
相比漏电起痕指数 CTI
Specimen Thickness : 1.6mm ;
Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water ;
E: Temperature conditioning ;
11
H1600 High CTI
◆ 介电常数 / Dielectric constant
Dk
6
5
4
3
151050100
Frequency(MHz)
◆ 热处理后板材经纬向尺寸变化
Dimensional change in cross and length direction after heat treatment
尺
寸
变
化
率
D
i
m
e
n
s
i
o
n
a
l
c
h
a
n
g
e
%
0.01
经向 Length
wise
0
纬向 Cross
wise
-0.01
-0.02
处理前/untreated 105℃ 4h 150℃ 2h
处理条件
产品系列 / Purchasing information
厚度Thickness
0.63~3.2mm
铜箔Copper foil
18um ~ 105um
标准尺寸 Standard size
37"×49"、41"×49"、43"×49"
※ Other sheet size and thickness could be available upon request
12
H2130 /
CEM-3
特性/ Features
优秀的机械加工性，可冲孔加工，钻孔加工钻头使用寿命可延长
Excellent mechanical processability, punching process applicable, longer drill bit life .
电性能与FR-4相当，加工工艺与FR-4相同
Electrical properties and PCB processing similar to FR-4.
可依需求提供高CTI的CEM-3板材/ High CTI CEM-3 available upon request （CTI 600）;
应用领域/ Applications
汽车电子、仪器仪表、信息家电、自动控制器、游戏机等。
Automotive electronics,apparatus and instrument,information household appliances,remote control unit,
game machine,and etc.
主要特性 / General properties
检测项目
Item
玻璃化转变温度Tg
剥离强度
1oz Peel Strength
热应力
Thermal stress
弯曲强度
Flexural Strength
燃烧性Flammability
表面电阻
Surface Resistivity
体积电阻
VolumeResistivity
介电常数
Dielectric Constant
介质损耗角正切
Loss Tangent
耐电弧Arc Resistance
击穿电压
Dielectric Breakdown
吸水率
Moisture Absorption
CTE
Z-axis
Alpha 1
Alpha 2
50 - 260 ℃
单位
Unit
℃
N/mm
S
N/mm
2
－
MΩ
MΩ·cm
－
－
S
KV
%
ppm / ℃
ppm / ℃
%
V IEC-60112
检测条件
Test Condition
DSC
260℃, 10S
260℃,solder dip
经向 LW
纬向CW
E 24/125
After moisture
After moisture
1 MHZ
C 24/23/50
1 MHZ
C 24/23/50
D48/50＋D0.5/23
D48/50＋D0.5/23
D24/23
TMA
规范值
Spec
≥120
≥1.05
＞10
≥276
≥186
UL94V-0
≥1.0×10
4
≥1.0×10
6
≤5.4
≤0.035
≥60
≥40
≤0.5
-
-
-
175～250
典型值
Typical Value
128.5
1.54
60s
No delamination
380
300
V-0
2.37×10
6
2.67×10
8
4.7
0.016
120
55
0.17
63
350
5.2
200 相比漏电起痕指数 CTI
Specimen Thickness : 1.6mm ;
Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water ;
E: Temperature conditioning ;
13
H2130 /
CEM-3
◆ 介电常数 / Dielectric constant
Dk
6
5
4
3
151050100
Frequency(MHz)
◆ 热处理后板材经纬向尺寸变化
Dimensional change in cross and length direction after heat treatment
尺
寸
变
化
率
D
i
m
e
n
s
i
o
n
a
l
c
h
a
n
g
e
%
0.03
0.02
0.01
0
-0.01
-0.02
-0.03
处理前/untreated 105℃ 4h 150℃ 2h
经向 Length
wise
纬向 Cross
wise
处理条件
产品系列 / Purchasing information
厚度Thickness
0.6~3.2mm
铜箔Copper foil
18um ~ 105um
标准尺寸 Standard size
37"×49"、41"×49"、43"×49"
※ Other sheet size and thickness could be available upon request
14
铝基板介绍
Al-Substrate CCL Introduction
类型Type 介绍Introduction
中高导热型 热导率1.0～2.0 W/ M·K，可满足中高端产品需求，性价比高；
High Thermal Conductivity Thermal conductivity 1.0～2.0 W/ M·K，It can fit the demand of high end
Type and mid-range products，with high cost performance.
基本结构Basic Structure
说明 / Instruction
导电层—电解铜箔 / Circuit Layer – Electrolysis copper foil
导热绝缘层—以最小的热阻提供电学上的绝缘，分为玻璃布增强型和无玻璃布增强型两种
Thermally Conductive Dielectric Layer –This offers electrical isolation with minimum thermal resistance.
two types: Fiberglass support & non-fiberglass support.
铝基层—是整个结构的支撑和热量的发散，材料为铝合金板
Aluminum SubstrateIt –supports the entire structure and conducts the heat.
The material is aluminum alloy plate.
特性/ Features
优异的散热性能 Excellent thermal conductivity
良好的尺寸稳定性能 Excellent dimensional stability
良好的机械加工性能 Excellent mechanical properties
电磁屏蔽性能 Excellent electromagnetic shielding
可直接外接散热装置 Can use external cooling device directly
优良的性价比 High cost performance
应用领域 / Application
LED照明电路
LED lighting circuit
电源电路 Power supply
混合集成电路 Hybrid integrated circuits
固态继电器 Solid State Relays
LCD背光源
LCD Backlights
需要高散热的领域 The area needs high heat dissipation
15
主要性能 Main property
典型值 Typical Value
项目
Item
热阻
Thermal Impedance
热导率
Thermal Conductivity
剥离强度
Peel Strength
热应力Thermal Stress
表面电阻
Surface Resistivity
体积电阻
Volume Resistivity
电气强度
Elecctrical Strength
介电常数（1MHz）
Dielectric Constant
耐电弧
Arc Resistance
处理条件
Test condition
A
Internal TO-220
A
ASTM 5470-D
单位
Units
指标值
Spec
类型1
Type1
类型2
Type2
0.45
2.0
℃/W
W/ M·K
≤1.0 0.7
1.0-2.01.3
A 1.95 1.84
N/mm ≥1.4
热应力后
1.85 1.73
288℃,solder dip
C96/35/90
E-24/125
C96/35/90
E-24/125
A
IPC-TM-650 2.5.6.2
C 24/23/50
IPC-TM-650 2.5.5.2
D48/50＋D0.5/23
IPC-TM-650 2.5.1
S ≥20
≥10
4
≥10
3
≥10
6
≥10
3
120S
No delamination
10
6
10
5
10
7
10
5
120S
No delamination
10
6
10
5
10
7
10
5
30
7.0
120
V-0
133.6
0.18
200
MΩ
MΩ·cm
KV/mm≥20 30
7.0 — —
S ≥60 120
燃烧性Flammability E-24/125
吸水率
Water Absorption
D-24/23
IPC-TM-650 2.6.2.1
— V-0 V-0
133.2 Tg DSC ℃ 130±5
% ≤0.5 0.17
CTI IEC60112 V ≥175 200
* 热阻系数均为1.6mm基材，铜箔厚度1oz下的测量值，热导率为绝缘层介质的热导率参数
* Thermal impedance is based on the measured value of 1.6mm base material with 1oz Copper foil.
Thermal conductivity is the parameters of thermally conductive dielectric layer.
产品规格Specification
标准尺寸Standard Size（mm）
导电层Circuit Layer
（电解铜箔Copper foil）
500mm×600mm、 500×1200mm、
600mm×1200mm、1100mm×1200mm
18μm、35μm、70μm、105μm（Hoz、1oz、2oz、3oz）
导热绝缘层厚度Thermally Conductive
75μm、100μm、125μm、150μm(3mil、4mil、5mil、6mil)
Dielectric Layer Thickness
铝基层厚度
Aluminum Substrate Thickness
1.0mm、1.2mm、1.5mm、2.0mm
※如有特殊要求，可定制Other sheet size and thickness could be available upon request
16
半固化片介绍/
Prepreg instruction
UV
Prepreg
我司的UV系列半固化片具有优良的粘结强度，优异的固化稳定性，作业窗口宽，可用于多层
板的制作，其燃烧特性符合UL94V-0级，压制后成品可达到IPC-4101/21相关要求。
The UV Prepreg have excellent bonding strength, excellent gel stability, with wide operating window.
Suitable for the multilayer printed circuit board. Flammability accord UL94V-0 grade. After press process,
the final product accord IPC-4101/21 standard 。
其规格spec参数如下：(Test method : IPC-TM-650)
玻璃布型号 树脂含量 (%) 凝胶化时间(s)流动度(%) 挥发份max
Fabric Type Resin content (%) Gel time (s) Resin flow (%)VC(%)
7628
7628
7628HRC
7628HRC
2116
1080
43 ± 3
45 ± 3
48 ± 3
50 ± 3
53 ± 3
63 ± 3
110 ± 20
110 ± 20
105 ± 20
100 ± 20
100 ± 20
100 ± 20
21 ± 3
23 ± 3
27 ± 3
28 ± 3
28 ± 3
37 ± 3
0.5
0.5
0.5
0.5
0.5
0.5
固化后厚度(μm)
Cured thickness (μm)
180～210（7.1~8.3 mil）
190～220（7.5~8.7 mil）
205～235（8.1~9.3 mil）
230～260（9.1~10.2 mil）
120～140（4.7~5.5 mil）
70～85（2.8~3.3 mil）
建议压制程式： Suggest cycle
一般建议料温70℃~120℃的升温
速率为1.5~2.5℃/min，同时料温
170℃以上维持30min为宜；
Commonly suggest the heat up rate
of the material Temp from 70℃ to
120℃ is 1.5~2.5℃/min ,and the
material Temp 170℃ above may as
well keep 30min appropriate .
储存条件：
温度≤20℃、湿度≤50%，保存时间3个月；温度≤5℃、密封条件下，保存时间6个月.
Storage Condition
: T≤20℃& ≤50%RH,Within 3 months; T≤5 ℃ Within 6 months (seal condition).
在上述要求内，我司可立即安排PP送样；若有特殊要求，由供需双方商定。Follow upwards condition,
Our company will arrange sample immediately. We can negotiation if you have special requirement.
17
覆铜板厚度公差表
CCL thickness and tolerance list
标准厚度mm
standard
thickness
厚度公差 mm / tolerance
Class B/L级 Class C/M级
0.025～0.119 ±0.018 ±0.013
0.120～0.164 ±0.025 ±0.018
0.165～0.299 ±0.038 ±0.025
0.300～0.499 ±0.050 ±0.038
0.500～0.785 ±0.064 ±0.050
0.786～1.039 ±0.100 ±0.075
1.040～1.674 ±0.130 ±0.075
1.675～2.564 ±0.180 ±0.100
2.565～3.579 ±0.230 ±0.130
3.580～6.350 ±0.300 ±0.150
※ 一般情况下，华正电子依照二级厚度公差（B/L级）要求接单作业，加严厚度公差（三级公差
C/M级）或特殊厚度公差要求可协商解决。
Commonly , we will accept the order form according to the Class B/L , the Class C/M or other special
tolerance could be available upon request.
※ Class B、C表示不含铜箔的板材厚度； Class L、M为含铜箔在内的板材厚度；
Class B、C figure the dielectric thickness ；Class L、M figure the overall thickness；
如下图 / As follows：
铜箔层
metal cladding
总厚度 overall thickness
Class L、M
铜箔层 metal cladding
绝缘层厚度 dielectric thickness
Class B、C
18