2024年5月21日发(作者：勾语蝶)
R·I·T
Title: ASML PAS 5500 Job
Creation
Semiconductor & Microsystems
Fabrication Laboratory
Revision: E Rev Date: 04/27/2020
Approved by:
/ / / /
Process Engineer Equipment Engineer
1
SCOPE
The purpose of this document is to detail the creation of stepper jobs for the ASML PAS 5500. All users
are expected to have read and understood this document. It is not a substitute for in-person training on the
system and is not sufficient to qualify a user on the system. Failure to follow guidelines in this document
may result in loss of privileges.
2
REFERENCE DOCUMENTS
Batch Control PAS 5500 Training Module
Reticle Design Manual
PAS 5500 User Guide
PAS 5500 Job Definition
PAS Global Alignment Strategies
PAS 5500 Steppers up to and including /300 Stepper Introduction
3
INTRODUCTION
3.1 Overview - These instructions provide an overview of creating stepper jobs for the ASML
PAS 5500/200. Up to 30 layers can be done in a single job. In a job, Wafer Layout will
define how the die are arranged on the wafer and Layer Layout will define the details of
each layer. The maximum square field size on the wafer is X=22mm and Y=22mm.
Information Needed to Write a Job
3.4.1
3.1.2
3.4.3
3.4.4
3.4.5
Cell Size – This is the step size of the reticle image on the wafer, including streets.
Number of Die per Cell
Number of Levels
Image Size – This is the reticle image on the wafer.
Location and number of alignment marks
3.2
RIT SMFL
Page 1 of 9
R·I·T
Title: ASML PAS 5500 Job Creation
Semiconductor & Microsystems
Fabrication Laboratory
Revision: E Rev Date: 04/27/2020
Figure 1. Sign conventions on the ASML Stepper. Shown at top is the standard SMFL
multiple field array, chrome side down, with the center of the reticle at (0, 0).
4
RETICLE ALIGNMENT TO A WAFER
RIT SMFL Page 2 of 9
2024年5月21日发(作者：勾语蝶)
R·I·T
Title: ASML PAS 5500 Job
Creation
Semiconductor & Microsystems
Fabrication Laboratory
Revision: E Rev Date: 04/27/2020
Approved by:
/ / / /
Process Engineer Equipment Engineer
1
SCOPE
The purpose of this document is to detail the creation of stepper jobs for the ASML PAS 5500. All users
are expected to have read and understood this document. It is not a substitute for in-person training on the
system and is not sufficient to qualify a user on the system. Failure to follow guidelines in this document
may result in loss of privileges.
2
REFERENCE DOCUMENTS
Batch Control PAS 5500 Training Module
Reticle Design Manual
PAS 5500 User Guide
PAS 5500 Job Definition
PAS Global Alignment Strategies
PAS 5500 Steppers up to and including /300 Stepper Introduction
3
INTRODUCTION
3.1 Overview - These instructions provide an overview of creating stepper jobs for the ASML
PAS 5500/200. Up to 30 layers can be done in a single job. In a job, Wafer Layout will
define how the die are arranged on the wafer and Layer Layout will define the details of
each layer. The maximum square field size on the wafer is X=22mm and Y=22mm.
Information Needed to Write a Job
3.4.1
3.1.2
3.4.3
3.4.4
3.4.5
Cell Size – This is the step size of the reticle image on the wafer, including streets.
Number of Die per Cell
Number of Levels
Image Size – This is the reticle image on the wafer.
Location and number of alignment marks
3.2
RIT SMFL
Page 1 of 9
R·I·T
Title: ASML PAS 5500 Job Creation
Semiconductor & Microsystems
Fabrication Laboratory
Revision: E Rev Date: 04/27/2020
Figure 1. Sign conventions on the ASML Stepper. Shown at top is the standard SMFL
multiple field array, chrome side down, with the center of the reticle at (0, 0).
4
RETICLE ALIGNMENT TO A WAFER
RIT SMFL Page 2 of 9