2024年10月29日发(作者：校夏波)
MOS FET Relays
Compact, General-purpose, Analog-
switching MOS FET Relays, with
Dielectric Strength of 2.5 kVAC between
I/O Using Optical Isolation.
•Upgraded G3VM-61 A/D Series.
•Switches minute analog signals.
•Leakage current of 1 µA max. when output relay is open.
RoHS compliant
.!
Note:
G3VM-61A1/D1
The actual product is marked differently from the image
shown here.
■Application Examples
•Measurement devices
•Security systems
•Amusement machines
■List of Models
Contact form
SPST-NO
Terminals
PCB terminals
Surface-mounting
terminals
Load voltage (peak value)
60 VAC
Model
G3VM-61A1
G3VM-61D1
G3VM-61D1(TR)---1,500
Number per stick
100
Number per tape
---
■Dimensions
Note:All units are in millimeters unless otherwise indicated.
4.58±
0.25
G3VM-61A1
G3VM-61D1
4.58±
0.25
6.4±
0.25
7.62±
0.25
0.8±
0.25
3.65
−0.25
+0.15
6.4±
0.25
7.62±
0.25
3.65
−0.25
0.25
+0.1
−0.05
+0.15
Note:The actual product
is marked different-
ly from the image
shown here.
2.5 min.
1.2±
0.15
0.5±
0.1
2.54±
0.25
7.85 to 8.80
Weight: 0.25 g
Note:The actual product
is marked different-
ly from the image
shown here.
1.0
min.
10.0 max.
4.0
+0.25
−0.2
1.0 min.
1.2±
0.15
2.54±
0.25
Weight: 0.25 g
■Terminal Arrangement/Internal Connections (Top View)
G3VM-61A1
43
G3VM-61D1
43
12
12
■PCB Dimensions (Bottom View)
G3VM-61A1
2.54
2.54
Four 0.8-dia. holes
(0.61)
■Actual Mounting Pad Dimensions
(Recommended Value, Top View)
G3VM-61D1
8.3 to 8.8
2.54
(1.52)
(0.61)
(1.52)
1.3
1.5
10
G3VM-61A1/D1
■Absolute Maximum Ratings (Ta = 25°C)
Item
InputLED forward current
Repetitive peak LED forward
current
LED forward current reduc-
tion rate
LED reverse voltage
Connection temperature
OutputOutput dielectric strength
Continuous load current
ON current reduction rate
Connection temperature
Dielectric strength between input and
output (See note 1.)
Operating temperature
Storage temperature
Soldering temperature (10 s)
Symbol
I
F
I
FP
∆ I
F
/°C
V
R
T
j
V
OFF
I
O
∆ I
ON
/°C
T
j
V
I-O
T
a
T
stg
---
1
−0.5
5
125
60
500
−5.0
125
2,500
−40 to +85
260
Rating
50
A
mA/°C
V
°C
V
mA
mA/°C
°C
Vrms
°C
°C
AC for 1 min
With no icing or condensation
With no icing or condensation
10 s
Ta ≥ 25°C
Unit
mA
100 µs pulses, 100 pps
Ta ≥ 25°C
Measurement Conditions
G3VM-61A1/D1
Note: dielectric strength between the input and
output was checked by applying voltage be-
tween all pins as a group on the LED side and
all pins as a group on the light-receiving side.
−55 to +125°C
■Electrical Characteristics (Ta = 25°C)
Item
InputLED forward voltage
Reverse current
Capacity between terminals
Trigger LED forward current
OutputMaximum resistance with output ON
Current leakage when the relay is
open
Capacity between I/O terminals
Insulation resistance
Turn-ON time
Turn-OFF time
Symbol
V
F
I
R
C
T
I
FT
R
ON
I
LEAK
C
I-O
R
I-O
tON
tOFF
Mini-
mum
1.0
---
---
---
---
---
---
1,000
---
---
Typical
1.15
---
30
1.6
1
---
0.8
---
0.8
0.1
Maxi-
mum
1.3
10
---
3
2
1.0
---
---
2.0
0.5
V
µA
pF
mA
Ω
µA
pF
MΩ
ms
ms
UnitMeasurement
conditions
I
F
= 10 mA
V
R
= 5 V
V = 0, f = 1 MHz
I
O
= 500 mA
I
F
= 5 mA,
I
O
= 500 mA
V
OFF
= 60 V
f = 1 MHz, Vs = 0 V
V
I-O
= 500 VDC,
RoH ≤ 60%
I
F
= 5 mA, R
L
= 200 Ω,
V
DD
= 20 V (See note 2.)
V
OUT
I
F
Note:-ON and Turn-OFF
Times
I
F
1
2
4
3
R
L
V
DD
V
OUT
10%
t
ON
90%
t
OFF
■Recommended Operating Conditions
Use the G3VM under the following conditions so that the Relay will operate properly.
Item
Output dielectric strength
Operating LED forward current
Continuous load current
Operating temperature
I
F
I
O
T
a
Symbol
V
DD
---
5
---
− 20
Minimum
---
7.5
---
---
Typical
48
25
500
65
Maximum
V
mA
mA
°C
Unit
■Engineering Data
Load Current vs. Ambient Temperature
G3VM-61A1(D1)
L
o
a
d
c
u
r
r
e
n
t
(
m
A
)
600
■Safety Precautions
Refer to “Common Precautions” for all G3VM models.
500
400
300
200
100
0
−20
Ambient temperature (°C)
11
G3VM Series
Common Precautions
!WARNING
Be sure to turn OFF the power when wiring the Relay, other-
wise an electric shock may be received.
!WARNING
Do not touch the charged terminals of the SSR, otherwise an
electric shock may be received.
!Caution
Do not apply overvoltage or overcurrent to the I/O circuits of the
SSR, otherwise the SSR may malfunction or burn.
!Caution
Be sure to wire and solder the Relay under the proper soldering
conditions, otherwise the Relay in operation may generate ex-
cessive heat and the Relay may burn.
Typical Relay Driving Circuit Examples
C-MOS
Load
Transistor
10 to 100 kΩ
Load
Use the following formula to obtain the LED current limiting resis-
tance value to assure that the relay operates accurately.
R
1
=
V
CC
− V
OL
− V
F
(ON)
5 to 20 mA
Use the following formula to obtain the LED forward voltage value
to assure that the relay releases accurately.
V
F (OFF)
= V
CC
− V
OH
< 0.8 V
4
G3VM Series
Protection from Surge Voltage on the Input
Terminals
If any reversed surge voltage is imposed on the input terminals,
insert a diode in parallel to the input terminals as shown in the fol-
lowing circuit diagram and do not impose a reversed voltage value
of 3V or more.
Surge Voltage Protection Circuit Example
Protection from Spike Voltage on the Output
Terminals
If a spike voltage exceeding the absolute maximum rated value is
generated between the output terminals, insert a C-R snubber or
clamping diode in parallel to the load as shown in the following
circuit diagram to limit the spike voltage.
Spike Voltage Protection Circuit Example
Unused Terminals (6-pin models only)
Terminal 3 is connected to the internal circuit. Do not connect
anything to terminal 3 externally.
Pin Strength for Automatic Mounting
n order to maintain the characteristics of the relay, the force
imposed on any pin of the relay for automatic mounting must not
exceed the following.
In direction A: 1.96 N
In direction B: 1.96 N
G3VM Series
Load Connection
Do not short-circuit the input and output terminals while the relay
is operating or the relay may malfunction.
AC Connection
Load
DC Single Connection
Load
Load
DC Parallel Connection
Load
G3VM Series
Solder Mounting
Perform solder mounting under the following recommended con-
ditions to prevent the temperature of the Relays from rising.
Through-hole Mounting (Once Only)
Solder typePreheatingSoldering
Lead solder150°
C230 to 260
°
C
SnPb60 to 120 s10 s max.
Lead-free solder150°
C245 to 260
°
C
SnAgCu
60 to 120 s10 s max.
Note:We recommend that the suitability of solder mounting be
verified under actual conditions.
Surface Mounting DIP or SOP Packages (Twice Max.)
Solder typePreheatingSoldering
Lead solder140→
160
°
C210
°
CPeak
SnPb
60 to 120 s30 s max.240°
C max.
Lead-free solder180→
190
°
C230
°
CPeak
SnAgCu60 to 120 s30 to 50 s260°
C max.
Surface Mounting SSOP Packages (Twice Max.)
Solder typePreheatingSoldering
Lead solder140→
160
°
C210
°
CPeak
SnPb
60 to 120 s30 s max.240°
C max.
Lead-free solder150→
180
°
C230
°
CPeak
SnAgCu120 s max.30 s max.250°
C max.
Note: recommend that the suitability of solder mounting
be verified under actual conditions.
cut SSOPs are packaged without humidity resis-
tance. Use manual soldering to mount them.
Manual Soldering (Once Only)
Manually solder at 350
°
C for 3 s or less or at 260
°
C for 10 s or
less.
SSOP Handling Precautions
Component packages can crack if surface-mounted components
that have absorbed moisture are subjected to thermal stress
when mounting. To prevent this, observe the following precau-
tions.
ed components can be stored in the packaging at 5
to 30
°
C and a humidity of 90% max., but they should be
used within 12 months.
the packaging has been opened, components can be
stored at 5 to 30
°
C and a humidity of 60% max., but they
should be mounted within 168 hours.
, after opening the packaging, the humidity indicator turns
pink to the 30% mark or the expiration data is exceeded,
bake the components while they are still on the taping reel,
and use them within 72 hours. Do not bake the same com-
ponents more than once.
Baking conditions: 60
±
5
°
C, 64 to 72 h
Expiration date: 12 months from the seal date
(given on the label)
4.f the same components are baked repeatedly, the tape
detachment strength will change, causing problems when
mounting. When mounting using dehumidifying measures,
always take countermeasures against component damage
from static electricity.
not throw or drop components. If the laminated packag-
ing material is damaged, airtightness will be lost.
cut SSOPs are packaged without humidity resistance.
Use manual soldering to mount them.
5
2024年10月29日发(作者：校夏波)
MOS FET Relays
Compact, General-purpose, Analog-
switching MOS FET Relays, with
Dielectric Strength of 2.5 kVAC between
I/O Using Optical Isolation.
•Upgraded G3VM-61 A/D Series.
•Switches minute analog signals.
•Leakage current of 1 µA max. when output relay is open.
RoHS compliant
.!
Note:
G3VM-61A1/D1
The actual product is marked differently from the image
shown here.
■Application Examples
•Measurement devices
•Security systems
•Amusement machines
■List of Models
Contact form
SPST-NO
Terminals
PCB terminals
Surface-mounting
terminals
Load voltage (peak value)
60 VAC
Model
G3VM-61A1
G3VM-61D1
G3VM-61D1(TR)---1,500
Number per stick
100
Number per tape
---
■Dimensions
Note:All units are in millimeters unless otherwise indicated.
4.58±
0.25
G3VM-61A1
G3VM-61D1
4.58±
0.25
6.4±
0.25
7.62±
0.25
0.8±
0.25
3.65
−0.25
+0.15
6.4±
0.25
7.62±
0.25
3.65
−0.25
0.25
+0.1
−0.05
+0.15
Note:The actual product
is marked different-
ly from the image
shown here.
2.5 min.
1.2±
0.15
0.5±
0.1
2.54±
0.25
7.85 to 8.80
Weight: 0.25 g
Note:The actual product
is marked different-
ly from the image
shown here.
1.0
min.
10.0 max.
4.0
+0.25
−0.2
1.0 min.
1.2±
0.15
2.54±
0.25
Weight: 0.25 g
■Terminal Arrangement/Internal Connections (Top View)
G3VM-61A1
43
G3VM-61D1
43
12
12
■PCB Dimensions (Bottom View)
G3VM-61A1
2.54
2.54
Four 0.8-dia. holes
(0.61)
■Actual Mounting Pad Dimensions
(Recommended Value, Top View)
G3VM-61D1
8.3 to 8.8
2.54
(1.52)
(0.61)
(1.52)
1.3
1.5
10
G3VM-61A1/D1
■Absolute Maximum Ratings (Ta = 25°C)
Item
InputLED forward current
Repetitive peak LED forward
current
LED forward current reduc-
tion rate
LED reverse voltage
Connection temperature
OutputOutput dielectric strength
Continuous load current
ON current reduction rate
Connection temperature
Dielectric strength between input and
output (See note 1.)
Operating temperature
Storage temperature
Soldering temperature (10 s)
Symbol
I
F
I
FP
∆ I
F
/°C
V
R
T
j
V
OFF
I
O
∆ I
ON
/°C
T
j
V
I-O
T
a
T
stg
---
1
−0.5
5
125
60
500
−5.0
125
2,500
−40 to +85
260
Rating
50
A
mA/°C
V
°C
V
mA
mA/°C
°C
Vrms
°C
°C
AC for 1 min
With no icing or condensation
With no icing or condensation
10 s
Ta ≥ 25°C
Unit
mA
100 µs pulses, 100 pps
Ta ≥ 25°C
Measurement Conditions
G3VM-61A1/D1
Note: dielectric strength between the input and
output was checked by applying voltage be-
tween all pins as a group on the LED side and
all pins as a group on the light-receiving side.
−55 to +125°C
■Electrical Characteristics (Ta = 25°C)
Item
InputLED forward voltage
Reverse current
Capacity between terminals
Trigger LED forward current
OutputMaximum resistance with output ON
Current leakage when the relay is
open
Capacity between I/O terminals
Insulation resistance
Turn-ON time
Turn-OFF time
Symbol
V
F
I
R
C
T
I
FT
R
ON
I
LEAK
C
I-O
R
I-O
tON
tOFF
Mini-
mum
1.0
---
---
---
---
---
---
1,000
---
---
Typical
1.15
---
30
1.6
1
---
0.8
---
0.8
0.1
Maxi-
mum
1.3
10
---
3
2
1.0
---
---
2.0
0.5
V
µA
pF
mA
Ω
µA
pF
MΩ
ms
ms
UnitMeasurement
conditions
I
F
= 10 mA
V
R
= 5 V
V = 0, f = 1 MHz
I
O
= 500 mA
I
F
= 5 mA,
I
O
= 500 mA
V
OFF
= 60 V
f = 1 MHz, Vs = 0 V
V
I-O
= 500 VDC,
RoH ≤ 60%
I
F
= 5 mA, R
L
= 200 Ω,
V
DD
= 20 V (See note 2.)
V
OUT
I
F
Note:-ON and Turn-OFF
Times
I
F
1
2
4
3
R
L
V
DD
V
OUT
10%
t
ON
90%
t
OFF
■Recommended Operating Conditions
Use the G3VM under the following conditions so that the Relay will operate properly.
Item
Output dielectric strength
Operating LED forward current
Continuous load current
Operating temperature
I
F
I
O
T
a
Symbol
V
DD
---
5
---
− 20
Minimum
---
7.5
---
---
Typical
48
25
500
65
Maximum
V
mA
mA
°C
Unit
■Engineering Data
Load Current vs. Ambient Temperature
G3VM-61A1(D1)
L
o
a
d
c
u
r
r
e
n
t
(
m
A
)
600
■Safety Precautions
Refer to “Common Precautions” for all G3VM models.
500
400
300
200
100
0
−20
Ambient temperature (°C)
11
G3VM Series
Common Precautions
!WARNING
Be sure to turn OFF the power when wiring the Relay, other-
wise an electric shock may be received.
!WARNING
Do not touch the charged terminals of the SSR, otherwise an
electric shock may be received.
!Caution
Do not apply overvoltage or overcurrent to the I/O circuits of the
SSR, otherwise the SSR may malfunction or burn.
!Caution
Be sure to wire and solder the Relay under the proper soldering
conditions, otherwise the Relay in operation may generate ex-
cessive heat and the Relay may burn.
Typical Relay Driving Circuit Examples
C-MOS
Load
Transistor
10 to 100 kΩ
Load
Use the following formula to obtain the LED current limiting resis-
tance value to assure that the relay operates accurately.
R
1
=
V
CC
− V
OL
− V
F
(ON)
5 to 20 mA
Use the following formula to obtain the LED forward voltage value
to assure that the relay releases accurately.
V
F (OFF)
= V
CC
− V
OH
< 0.8 V
4
G3VM Series
Protection from Surge Voltage on the Input
Terminals
If any reversed surge voltage is imposed on the input terminals,
insert a diode in parallel to the input terminals as shown in the fol-
lowing circuit diagram and do not impose a reversed voltage value
of 3V or more.
Surge Voltage Protection Circuit Example
Protection from Spike Voltage on the Output
Terminals
If a spike voltage exceeding the absolute maximum rated value is
generated between the output terminals, insert a C-R snubber or
clamping diode in parallel to the load as shown in the following
circuit diagram to limit the spike voltage.
Spike Voltage Protection Circuit Example
Unused Terminals (6-pin models only)
Terminal 3 is connected to the internal circuit. Do not connect
anything to terminal 3 externally.
Pin Strength for Automatic Mounting
n order to maintain the characteristics of the relay, the force
imposed on any pin of the relay for automatic mounting must not
exceed the following.
In direction A: 1.96 N
In direction B: 1.96 N
G3VM Series
Load Connection
Do not short-circuit the input and output terminals while the relay
is operating or the relay may malfunction.
AC Connection
Load
DC Single Connection
Load
Load
DC Parallel Connection
Load
G3VM Series
Solder Mounting
Perform solder mounting under the following recommended con-
ditions to prevent the temperature of the Relays from rising.
Through-hole Mounting (Once Only)
Solder typePreheatingSoldering
Lead solder150°
C230 to 260
°
C
SnPb60 to 120 s10 s max.
Lead-free solder150°
C245 to 260
°
C
SnAgCu
60 to 120 s10 s max.
Note:We recommend that the suitability of solder mounting be
verified under actual conditions.
Surface Mounting DIP or SOP Packages (Twice Max.)
Solder typePreheatingSoldering
Lead solder140→
160
°
C210
°
CPeak
SnPb
60 to 120 s30 s max.240°
C max.
Lead-free solder180→
190
°
C230
°
CPeak
SnAgCu60 to 120 s30 to 50 s260°
C max.
Surface Mounting SSOP Packages (Twice Max.)
Solder typePreheatingSoldering
Lead solder140→
160
°
C210
°
CPeak
SnPb
60 to 120 s30 s max.240°
C max.
Lead-free solder150→
180
°
C230
°
CPeak
SnAgCu120 s max.30 s max.250°
C max.
Note: recommend that the suitability of solder mounting
be verified under actual conditions.
cut SSOPs are packaged without humidity resis-
tance. Use manual soldering to mount them.
Manual Soldering (Once Only)
Manually solder at 350
°
C for 3 s or less or at 260
°
C for 10 s or
less.
SSOP Handling Precautions
Component packages can crack if surface-mounted components
that have absorbed moisture are subjected to thermal stress
when mounting. To prevent this, observe the following precau-
tions.
ed components can be stored in the packaging at 5
to 30
°
C and a humidity of 90% max., but they should be
used within 12 months.
the packaging has been opened, components can be
stored at 5 to 30
°
C and a humidity of 60% max., but they
should be mounted within 168 hours.
, after opening the packaging, the humidity indicator turns
pink to the 30% mark or the expiration data is exceeded,
bake the components while they are still on the taping reel,
and use them within 72 hours. Do not bake the same com-
ponents more than once.
Baking conditions: 60
±
5
°
C, 64 to 72 h
Expiration date: 12 months from the seal date
(given on the label)
4.f the same components are baked repeatedly, the tape
detachment strength will change, causing problems when
mounting. When mounting using dehumidifying measures,
always take countermeasures against component damage
from static electricity.
not throw or drop components. If the laminated packag-
ing material is damaged, airtightness will be lost.
cut SSOPs are packaged without humidity resistance.
Use manual soldering to mount them.
5