2024年3月21日发(作者：由子萱)
DATACON'S 8800 FC SMART LINE
High Versatility
The market of RFID chip attach comprises two worlds: Direct chip attach (attaching the
chip directly on an antenna web) and Indirect chip attach (attaching the chips onto an
interposer/strap, which is subsequently mounted onto the antenna). There are a lot of
different interconnection possibilities: FC soldering (C4, GBS-gold bump soldering) and
adhesive FC bonding (NCP, ACP).
In a surrounding of emergency technology the Datacon 8800 FC Smart Line is the
constant factor - flexible enough to deal with all kinds of chips, substrates and
interconnection technologies - and versatile enough to keep up with future changes in
main stream RFID Production.
Complete Reel to Reel Solution
Datacon's 8800 FC Smart Line is a complete equipment solution based on reel to reel
production. After spooling up the product is finished - optionally tested and provided with
bad marks for the rejects. Datacon's skilled process and application engineers can help
setting up the process and train operators.
Process Reliability
The heart of the 8800 FC Smart Line is the 8800 FC Quantum flip chip bonder, proven
equipment in high volume production. It provides dispense and fluxing capability, flip chip
pick & place and inspection capability. To achieve to speed without impacting process
time the 8800 FC platform is equipped with two independent assembly systems
comprising two flip units picking the dies from one wafer, two bond head, two dipping
units and two substrate and upward looking camera systems. This unique concept
established Datacon's key to high speed process reliability: "Don't sacrifice process time
to guarantee process stability".
8800 FC Smart Line - drives down chip assembly costs
The 8800 FC Smart Line is designed for both RFID direct chip attach and indirect chip
attach. Around the 8800 FC flip chip bonder with highest through put and accuracy, an
integrated high speed dispenser and a heated press form and a perfect production line.
Highlights
Integrated dispensing system
Post-dispense inspection
Dual-head bonding system
25 slot SEMI standard wafer magazines
Thermo-controlled heated press
Spooler system
Wafer mapping according to SEMI standard with ALPS® conversion licence
Core Specifications
Direct and indirect chip attach (both strap and antenna web)
NCP, ACP, Soldering (C4,GBS)
Heated gang press
Up to 10,000 UPH
40 µm @ 3s
Endless substrate, up to 15" width
High speed dot or volumetric dispensing
Post dispense, post bond inspection
Datacon's and Meco's joint RFID solution
2024年3月21日发(作者：由子萱)
DATACON'S 8800 FC SMART LINE
High Versatility
The market of RFID chip attach comprises two worlds: Direct chip attach (attaching the
chip directly on an antenna web) and Indirect chip attach (attaching the chips onto an
interposer/strap, which is subsequently mounted onto the antenna). There are a lot of
different interconnection possibilities: FC soldering (C4, GBS-gold bump soldering) and
adhesive FC bonding (NCP, ACP).
In a surrounding of emergency technology the Datacon 8800 FC Smart Line is the
constant factor - flexible enough to deal with all kinds of chips, substrates and
interconnection technologies - and versatile enough to keep up with future changes in
main stream RFID Production.
Complete Reel to Reel Solution
Datacon's 8800 FC Smart Line is a complete equipment solution based on reel to reel
production. After spooling up the product is finished - optionally tested and provided with
bad marks for the rejects. Datacon's skilled process and application engineers can help
setting up the process and train operators.
Process Reliability
The heart of the 8800 FC Smart Line is the 8800 FC Quantum flip chip bonder, proven
equipment in high volume production. It provides dispense and fluxing capability, flip chip
pick & place and inspection capability. To achieve to speed without impacting process
time the 8800 FC platform is equipped with two independent assembly systems
comprising two flip units picking the dies from one wafer, two bond head, two dipping
units and two substrate and upward looking camera systems. This unique concept
established Datacon's key to high speed process reliability: "Don't sacrifice process time
to guarantee process stability".
8800 FC Smart Line - drives down chip assembly costs
The 8800 FC Smart Line is designed for both RFID direct chip attach and indirect chip
attach. Around the 8800 FC flip chip bonder with highest through put and accuracy, an
integrated high speed dispenser and a heated press form and a perfect production line.
Highlights
Integrated dispensing system
Post-dispense inspection
Dual-head bonding system
25 slot SEMI standard wafer magazines
Thermo-controlled heated press
Spooler system
Wafer mapping according to SEMI standard with ALPS® conversion licence
Core Specifications
Direct and indirect chip attach (both strap and antenna web)
NCP, ACP, Soldering (C4,GBS)
Heated gang press
Up to 10,000 UPH
40 µm @ 3s
Endless substrate, up to 15" width
High speed dot or volumetric dispensing
Post dispense, post bond inspection
Datacon's and Meco's joint RFID solution