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MPC2106CDG66中文资料

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2024年3月28日发(作者:臧清一)

元器件交易网

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document

by MPC2105C/D

512KB and 1MB BurstRAM

Secondary Cache Modules for

PowerPC™ PReP/CHRP Platforms

The MPC2105C and the MPC2106C are designed to provide burstable, high

performance L2 cache for the PowerPC 60x microprocessor family in conformance

with the PowerPC Reference Platform (PReP) and the PowerPC Common Hardware

Reference Platform (CHRP) specifications.

The MPC2105C and MPC2106C utilize synchronous BurstRAMs. The modules

are configured as 64K x 72, and 128K x 72 bits in a 178 (89 x 2) pin DIMM format.

The MPC2105C uses four of the 3 V 64K x 18; the MPC2106C uses eight of the 3

V 64K x 18. For tag bits, a 5 V cache tag RAM configured as 16K x 12 for tag field plus

16K x 2 for valid and dirty status bits is used.

Bursts can be initiated with the ADS signal. Subsequent burst addresses are

generated internal to the BurstRAM by the CNTEN signal.

Write cycles are internally self timed and are initiated by the rising edge of the clock

(CLKx) inputs. Eight write enables are provided for byte write control.

Presence detect pins are available for auto configuration of the cache control.

The module family pinout will support 5 V and 3.3 V components for a clear path

to lower voltage and power savings. Both power supplies must be connected.

All of these cache modules are plug and pin compatible with each other.

PowerPC–style Burst Counter on Chip

Flow–Through Data I/O

Plug and Pin Compatibility

Multiple Clock Pins for Reduced Loading

All Cache Data and Tag I/Os are LVTTL (3.3 V) Compatible

Three State Outputs

Byte Write Capability

Fast Module Clock Rates: Up to 66 MHz

Fast SRAM Access Times: 10 ns for Tag RAM Match

9 ns for Data RAM

Decoupling Capacitors for Each Fast Static RAM

High Quality Multi–Layer FR4 PWB With Separate Power and Ground Planes

178 Pin Card Edge Module

Burndy Connector, Part Number: ELF178KSC–3Z50

MPC2105C

MPC2106C

178–LEAD CARD EDGE

TOP VIEW

MPC2105C CASE 1132A–01

MPC2106C CASE 1132–01

1

24

25

47

48

89

The PowerPC name is a trademark of IBM Corp., used under license therefrom.

10/14/97

©

Motorola, Inc. 1997

MOTOROLA FAST SRAM

MPC2105C•MPC2106C

1

元器件交易网

MPC2105C BLOCK DIAGRAM

V

SS

69F618CTQ

ADS0

CNTEN0

CG0

SA

ADSC

ADV

G

SE1

SBA

DQA

SBB

DQB

K

CWE0

DH0 – DH7 + DP0

CWE1

DH8 – DH15 + DP1

CLK0

SRAM TIE OFF

CWE2

DH16 – DH23 + DP2

CWE3

DH24 – DH31 + DP3

CLK0

V

DD

BA13 – BA28

’244

A13 – A28

69F618CTQ

SA

ADSC

ADV

G

SE1

SBA

DQA

SBB

DQB

K

SE2

SGW

SW

ZZ

69F618CTQ

SA

ADSC

ADV

G

SE1

SBA

DQA

SBB

DQB

K

CWE4

DL0 – DL7 + DP4

CWE5

DL8 – DL15 + DP5

CLK1

ADSP

69F618CTQ

SA

ADSC

ADV

G

SE1

SBA

DQA

SBB

DQB

K

CWE6

DL16 – DL23 + DP6

CWE7

DL24 – DL31 + DP7

CLK1

TAG: 16K x 12 + V + D

A13 – A26

A1 – A12

TCLR

TWE

CLK2

MATCH

DIRTYOUT

VALIDIN

DIRTYIN

TG

A0 – A13

TAG0 –11

RESET

SW

TW

K

MATCH

DIRTYQ

VALIDD

DIRTYD

TG

TT1, WTD, E1

SFUNC, SG

TAH, TAG, TAD

E2, PWRDN

V

CCQ

TA, VALIDQ

WTQ

V

CC

V

SS

V

CC

via 100 Ω

V

DD

NC

V

CC

A0

CLK3

CLK4

ALE

ADS1

CNTEN1

CG1

ADDR0

ADDR1

PD3

= NC

= NC

= NC

= NC

= NC

= NC

= NC

= NC

= NC

J3

PD2

J2

PD1

J1

PD0

Note:BA28 is tied to SA0 on SRAM;

BA27 is tied to SA1 on SRAM;

STANDBY is tied to SE3 on SRAM.

J0

MPC2105C•MPC2106C

2

MOTOROLA FAST SRAM

2024年3月28日发(作者:臧清一)

元器件交易网

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document

by MPC2105C/D

512KB and 1MB BurstRAM

Secondary Cache Modules for

PowerPC™ PReP/CHRP Platforms

The MPC2105C and the MPC2106C are designed to provide burstable, high

performance L2 cache for the PowerPC 60x microprocessor family in conformance

with the PowerPC Reference Platform (PReP) and the PowerPC Common Hardware

Reference Platform (CHRP) specifications.

The MPC2105C and MPC2106C utilize synchronous BurstRAMs. The modules

are configured as 64K x 72, and 128K x 72 bits in a 178 (89 x 2) pin DIMM format.

The MPC2105C uses four of the 3 V 64K x 18; the MPC2106C uses eight of the 3

V 64K x 18. For tag bits, a 5 V cache tag RAM configured as 16K x 12 for tag field plus

16K x 2 for valid and dirty status bits is used.

Bursts can be initiated with the ADS signal. Subsequent burst addresses are

generated internal to the BurstRAM by the CNTEN signal.

Write cycles are internally self timed and are initiated by the rising edge of the clock

(CLKx) inputs. Eight write enables are provided for byte write control.

Presence detect pins are available for auto configuration of the cache control.

The module family pinout will support 5 V and 3.3 V components for a clear path

to lower voltage and power savings. Both power supplies must be connected.

All of these cache modules are plug and pin compatible with each other.

PowerPC–style Burst Counter on Chip

Flow–Through Data I/O

Plug and Pin Compatibility

Multiple Clock Pins for Reduced Loading

All Cache Data and Tag I/Os are LVTTL (3.3 V) Compatible

Three State Outputs

Byte Write Capability

Fast Module Clock Rates: Up to 66 MHz

Fast SRAM Access Times: 10 ns for Tag RAM Match

9 ns for Data RAM

Decoupling Capacitors for Each Fast Static RAM

High Quality Multi–Layer FR4 PWB With Separate Power and Ground Planes

178 Pin Card Edge Module

Burndy Connector, Part Number: ELF178KSC–3Z50

MPC2105C

MPC2106C

178–LEAD CARD EDGE

TOP VIEW

MPC2105C CASE 1132A–01

MPC2106C CASE 1132–01

1

24

25

47

48

89

The PowerPC name is a trademark of IBM Corp., used under license therefrom.

10/14/97

©

Motorola, Inc. 1997

MOTOROLA FAST SRAM

MPC2105C•MPC2106C

1

元器件交易网

MPC2105C BLOCK DIAGRAM

V

SS

69F618CTQ

ADS0

CNTEN0

CG0

SA

ADSC

ADV

G

SE1

SBA

DQA

SBB

DQB

K

CWE0

DH0 – DH7 + DP0

CWE1

DH8 – DH15 + DP1

CLK0

SRAM TIE OFF

CWE2

DH16 – DH23 + DP2

CWE3

DH24 – DH31 + DP3

CLK0

V

DD

BA13 – BA28

’244

A13 – A28

69F618CTQ

SA

ADSC

ADV

G

SE1

SBA

DQA

SBB

DQB

K

SE2

SGW

SW

ZZ

69F618CTQ

SA

ADSC

ADV

G

SE1

SBA

DQA

SBB

DQB

K

CWE4

DL0 – DL7 + DP4

CWE5

DL8 – DL15 + DP5

CLK1

ADSP

69F618CTQ

SA

ADSC

ADV

G

SE1

SBA

DQA

SBB

DQB

K

CWE6

DL16 – DL23 + DP6

CWE7

DL24 – DL31 + DP7

CLK1

TAG: 16K x 12 + V + D

A13 – A26

A1 – A12

TCLR

TWE

CLK2

MATCH

DIRTYOUT

VALIDIN

DIRTYIN

TG

A0 – A13

TAG0 –11

RESET

SW

TW

K

MATCH

DIRTYQ

VALIDD

DIRTYD

TG

TT1, WTD, E1

SFUNC, SG

TAH, TAG, TAD

E2, PWRDN

V

CCQ

TA, VALIDQ

WTQ

V

CC

V

SS

V

CC

via 100 Ω

V

DD

NC

V

CC

A0

CLK3

CLK4

ALE

ADS1

CNTEN1

CG1

ADDR0

ADDR1

PD3

= NC

= NC

= NC

= NC

= NC

= NC

= NC

= NC

= NC

J3

PD2

J2

PD1

J1

PD0

Note:BA28 is tied to SA0 on SRAM;

BA27 is tied to SA1 on SRAM;

STANDBY is tied to SE3 on SRAM.

J0

MPC2105C•MPC2106C

2

MOTOROLA FAST SRAM

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