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CuClad 6250和6700低熔点结合薄膜说明书

IT圈 admin 2024-09-26 51浏览 0评论

2024年9月26日发(作者：景宛白)

CuClad

Bonding

Films

CuClad® 6250 and 6700 Bonding Films

CuClad 6250 and 6700 low melting point bonding films have been developed for lamination of stripline or other

multilayer circuits fabricated from CuClad or other Rogers’ PTFE-based laminates. Dielectric constants of 6250 and

6700 bonding films fall in the midrange of CuClad and DiClad® Microwave Printed Circuit Board Substrates product

lines and ensure uniform reproducibility of electrical performance.

Shelf Life and Storage: There are no shelf-life limitations for CuClad 6250 or 6700 when material is stored away

from direct sunlight and in the original sealed package at no greater than 25°C (77°F) and 70% relative humidity.

The film rolls should be stored on edge (standing upright) or suspended by the roll cores to avoid creating creased

areas or flat spots due to roll weight.

Property

Dielectric Constant @ 10 GHz

Dissipation Factor @ 10 GHz

Dielectric Strength

Volume Resistivity

Surface Resistivity

Arc Resistance

Water Absorption

Thermal Conductivity

Brittle Temperature

Crystalline Melt Point

Continuous Use

Temperature

Density

Units

V/mil

Ohm-cm

Ohms

sec

W/m-k

°C

°F (°C)

(g/cm

)

Test Method

IPC TM-650

ASTM D-149

ASTM D-257

ASTM D-495

ASTM D-570

Hot Stage

ASTM D-1505

6250

2.32

0.0013

1000 min

0.17

-60

165 (75)/10

0.93

6700

2.35

0.0025

2500

130-140

0.005

0.17

364 (184)

350 (176)

2.1

Results listed above are typical properties; they are not to be used as specification limits. The above information creates

no expressed or implied warranties. The properties of laminates may vary, depending on the design and application.

Material Availability

6250 0.0015” (0.04mm)

6700 0.0015" (0.04mm)

0.0030" (0.08mm)

Width: 24” only

Lengths: 30ft or 150ft

12"x18" (305mm X 457mm)

Sheets

24"x18" (610mm X 457mm)

Width: 24” only

Rolls

Lengths: 30ft or 150ft

12"x18" (305mm X 457mm)

Sheets

24"x18" (610mm X 457mm)

Rolls

Results listed above are typical properties; they are not to be used as specification limits. The above information creates

no expressed or implied warranties. The properties of laminates may vary, depending on the design and application.

Processing Recommendations

Preparation of Surfaces to be Bonded

1. Etched copper circuitry or copper ground/power planes should be treated with a light microetch prior to lamination.

Copper surfaces should not be mechanically scrubbed (rotating or oscillating brush) or pumice scrubbed.

2. Etched-off PTFE surfaces should be dry and clean, free of all process chemical residues as well as dust, dirt, grease,

oils, fingerprints, etc. Thorough rinsing with clean, deionized water followed by forced air drying may be sufficient. A

flush or dip in clean (isopropyl alcohol) IPA will aid in drying. Do not swab or wipe surfaces.

3. As-etched copper clad surfaces may not require treatment to promote bonding immediately after etching the

copper; however, for unclad PTFE laminates or PTFE surfaces that have been wiped, rubbed or handled carelessly

prior to lamination, it is strongly recommended:

• Sodium metal based chemical surface preparation, using Tetra-Etch® Fluoropolymer Etchant (W.L. Gore) or

Fluoroetch® Fluoropolymer Etchant (Acton Technologies), is recommended to maximize adhesion of bonding

film to the PTFE surfaces.

• Gas plasma cycles have also been shown as effective to promote adhesion to PTFE surfaces; this applies not only to

plated through hole preparation, but also to multilayer lamination.

4. Panels should be stored in a clean, dry environment. Layup and lamination should be done as soon as possible,

preferably within 24 hours of etching/surface preparation.

5. CuClad 6250 and 6700 bonding films come ready to use and require no preparation. Handling/ cutting of material

should take place in a clean, dust-free environment. The operator should use gloves to prevent transfer of oils and

acids from hands or fingers.

Bonding Process

1. Lay the bonding film between the layers to be laminated. Be sure to use enough film to encapsulate the

thickness of copper traces and patterns and to provide additional thickness as dielectric if required.

2. It is recommended that a thermocouple be placed into the laminate at the edge of the bond line (outside the

working area of the MLB) to measure actual working temperature at the bonding interface.

3. Preheat the press to the approximate bonding temperature required:

• For CuClad 6250 Bonding Film, a set temperature of 275°F is suggested (bonding will occur at temperatures

between 250°F and 300°F).

• For CuClad 6700 Bonding Film, a set temperature of 450°F is suggested (bonding will occur at temperatures

between 390°F and 440°F).

4. Apply pressure of approximately 100 psi. Pressure as high as 200 psi may be used if lower pressure does not result

in sufficient flow for more complex circuit fill. Sufficient padding should be used to develop uniform pressure, or

spotty bonds/blisters may occur.

5. Hold in the press until the temperature at the bond interface reaches the critical point:

• For CuClad 6250, this should be a minimum of 250°F (max, 300°F).

• For CuClad 6700, this should be a minimum of 400°F (max, 475°F).

6. Hold at temperature for an additional 10 minutes (for 6250) or 15 minutes (for 6700). This step is critical.

Insufficient time at temperature will result in a failed or spotty bond.

7. Cool under pressure at a maximum cool-down rate of 10°F/min.

• For CuClad 6250, cool to under 125°F before removing from the press.

• For CuClad 6700, cool to under 200°F before removing from the press.

Note: Transfer to a cooling press for cool down under pressure to maximize available hot-press availability is

acceptable. Transfer should be made, while still hot, and material should not be allowed to sit on cold surfaces during

transfer. Cool down pressure should equal the hot pressure. Forced cooling greater than 10

F/min or without

adequate pressure may result in partial debonding or board warpage.

Results listed above are typical properties; they are not to be used as specification limits. The above information creates

no expressed or implied warranties. The properties of laminates may vary, depending on the design and application.

The information in this data sheet is intended to assist you in designing with Rogers’ circuit materials. It is not intended to and does not

create any warranties express or implied, including any warranty of merchantability or fitness for a particular purpose or that the results

shown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of Rogers’ circuit

materials for each application.

These commodities, technology and software are exported from the United States in accordance with the Export Administration regulations.

Diversion contrary to U.S. law prohibited.

The Rogers’ logo, Helping power, protect, connect our world, DiClad and CuClad are trademarks of Rogers Corporation or one of its

subsidiaries.

FluoroEtch is a registered trademark of Acton Technologies, Pittston, PA. Tetra-Etch is a trademark of W.L. Gore & Associates.