2024年4月17日发(作者：藏欣可)
pcb行业et名词解释
1. PCB (Printed Circuit Board):
A PCB is a flat board made of non-conductive material, usually
fiberglass, on which electronic components are mounted and
interconnected. It provides mechanical support to the components
and also serves as a pathway for electrical current to flow between
different components.
2. ET (Electric Testing):
ET refers to the testing process conducted on PCBs to ensure that
the electrical connections are correct and the board is functioning
properly. It involves the use of specialized equipment to apply
electrical signals to the PCB and measure the corresponding
responses.
3. FR4:
FR4 is the most common type of material used for PCB fabrication.
It is a flame retardant epoxy resin reinforced by woven fiberglass
cloth. FR4 offers good mechanical strength, fire resistance, and
electrical insulation properties, making it ideal for various PCB
applications.
4. DFM (Design for Manufacturability):
DFM is a design approach that focuses on designing PCBs in a
way that maximizes their manufacturability and efficiency. It
considers factors such as component placement, routing, and layer
stackup to ensure that the design can be efficiently translated into a
physical PCB.
5. DFT (Design for Testability):
DFT refers to the design practices employed to enhance the
testability of a PCB. It involves incorporating features such as test
points, access probes, and boundary scan cells to facilitate the
testing process and improve fault coverage during the ET phase.
6. SMT (Surface Mount Technology):
SMT is a method of electronic component mounting where the
components are directly soldered onto the surface of the PCB. It
eliminates the need for through-hole components, reducing the size
and weight of the PCB and enabling high-density designs.
7. Through-Hole Technology:
Through-Hole Technology, or TH technology, is the traditional
method of component mounting where the components have leads
that are inserted into drilled holes on the PCB and then soldered.
TH technology provides robust mechanical connections but limits
the density of the PCB.
8. Pad:
A pad is a small conducting area on the PCB where an electronic
component is soldered. It provides electrical connectivity between
the component and the PCB traces.
9. Trace:
A trace is a conductive path on the PCB that connects various
components and their corresponding pads. It allows the flow of
electrical current between different parts of the circuit.
10. Via:
A via is a conductive hole on the PCB that connects different
layers of the board. It allows electrical signals to pass through and
facilitates the routing of traces between layers.
11. Gerber Files:
Gerber files are the standard format used to describe PCB designs
to PCB manufacturers. They contain information about the PCB
layers, component placement, traces, pads, and other design details
needed for manufacturing.
12. IPC (Institute for Printed Circuits):
IPC is an international trade association representing the PCB and
electronics assembly industries. It develops and publishes industry
standards and specifications related to PCB design, manufacturing,
and assembly.
13. NPTH (Non-Plated Through-Hole):
NPTH refers to the holes on the PCB that are not plated. These
holes are used for mechanical fastening, such as mounting the
board to the chassis, and do not require electrical connectivity.
14. BGA (Ball Grid Array):
BGA is a type of surface mount packaging used for integrated
circuits. Instead of leads, the IC is mounted onto the PCB using an
array of tiny solder balls, which provide electrical connections
between the IC and the PCB.
15. Megatron:
Megatron is a type of automatic optical inspection (AOI) system
used in PCB manufacturing. It uses high-resolution cameras to
scan the PCB for defects and compares the scans to a reference
image to identify any discrepancies.
2024年4月17日发(作者：藏欣可)
pcb行业et名词解释
1. PCB (Printed Circuit Board):
A PCB is a flat board made of non-conductive material, usually
fiberglass, on which electronic components are mounted and
interconnected. It provides mechanical support to the components
and also serves as a pathway for electrical current to flow between
different components.
2. ET (Electric Testing):
ET refers to the testing process conducted on PCBs to ensure that
the electrical connections are correct and the board is functioning
properly. It involves the use of specialized equipment to apply
electrical signals to the PCB and measure the corresponding
responses.
3. FR4:
FR4 is the most common type of material used for PCB fabrication.
It is a flame retardant epoxy resin reinforced by woven fiberglass
cloth. FR4 offers good mechanical strength, fire resistance, and
electrical insulation properties, making it ideal for various PCB
applications.
4. DFM (Design for Manufacturability):
DFM is a design approach that focuses on designing PCBs in a
way that maximizes their manufacturability and efficiency. It
considers factors such as component placement, routing, and layer
stackup to ensure that the design can be efficiently translated into a
physical PCB.
5. DFT (Design for Testability):
DFT refers to the design practices employed to enhance the
testability of a PCB. It involves incorporating features such as test
points, access probes, and boundary scan cells to facilitate the
testing process and improve fault coverage during the ET phase.
6. SMT (Surface Mount Technology):
SMT is a method of electronic component mounting where the
components are directly soldered onto the surface of the PCB. It
eliminates the need for through-hole components, reducing the size
and weight of the PCB and enabling high-density designs.
7. Through-Hole Technology:
Through-Hole Technology, or TH technology, is the traditional
method of component mounting where the components have leads
that are inserted into drilled holes on the PCB and then soldered.
TH technology provides robust mechanical connections but limits
the density of the PCB.
8. Pad:
A pad is a small conducting area on the PCB where an electronic
component is soldered. It provides electrical connectivity between
the component and the PCB traces.
9. Trace:
A trace is a conductive path on the PCB that connects various
components and their corresponding pads. It allows the flow of
electrical current between different parts of the circuit.
10. Via:
A via is a conductive hole on the PCB that connects different
layers of the board. It allows electrical signals to pass through and
facilitates the routing of traces between layers.
11. Gerber Files:
Gerber files are the standard format used to describe PCB designs
to PCB manufacturers. They contain information about the PCB
layers, component placement, traces, pads, and other design details
needed for manufacturing.
12. IPC (Institute for Printed Circuits):
IPC is an international trade association representing the PCB and
electronics assembly industries. It develops and publishes industry
standards and specifications related to PCB design, manufacturing,
and assembly.
13. NPTH (Non-Plated Through-Hole):
NPTH refers to the holes on the PCB that are not plated. These
holes are used for mechanical fastening, such as mounting the
board to the chassis, and do not require electrical connectivity.
14. BGA (Ball Grid Array):
BGA is a type of surface mount packaging used for integrated
circuits. Instead of leads, the IC is mounted onto the PCB using an
array of tiny solder balls, which provide electrical connections
between the IC and the PCB.
15. Megatron:
Megatron is a type of automatic optical inspection (AOI) system
used in PCB manufacturing. It uses high-resolution cameras to
scan the PCB for defects and compares the scans to a reference
image to identify any discrepancies.