2024年10月31日发(作者：蔚寄松)
元器件交易网
FFPF30U60DN
FFPF30U60DN
Features
•High voltage and high reliability
•High speed switching
•Low forward voltage
Applications
•
•
•
•
General purpose
Switching mode power supply
Free-wheeling diode for motor application
Power switching circuits
TO-220F
1 2 3
1. Anode e 3. Anode
ULTRA FAST RECOVERY POWER RECTIFIER
Absolute Maximum Ratings
(per diode) T
C
=25°C unless otherwise noted
Symbol
V
RRM
I
F(AV)
I
FSM
T
J,
T
STG
Parameter
Peak Repetitive Reverse Voltage
Average Rectified Forward Current @ T
C
= 100°C
Non-repetitive Peak Surge Current
60Hz Single Half-Sine Wave
Operating Junction and Storage Temperature
Value
600
30
180
- 65 to +150
Units
V
A
A
°C
Thermal Characteristics
Symbol
R
θJC
Parameter
Maximum Thermal Resistance, Junction to Case
Value
0.8
Units
°C/W
Electrical Characteristics
(per diode) T
C
=25 °C unless otherwise noted
Symbol
V
FM
*
Parameter
Maximum Instantaneous Forward Voltage
I
F
= 30A
I
F
= 30A
Maximum Instantaneous Reverse Current
@ rated V
R
Maximum Reverse Recovery Time
Maximum Reverse Recovery Current
Maximum Reverse Recovery Charge
(I
F
=30A, di/dt = 200A/µs)
1.0
.
2.3
2.1
µA
T
C
= 25 °C
T
C
= 100 °C
15
150
90
8
360
ns
A
nC
mJ
Units
V
T
C
= 25 °C
T
C
= 100 °C
I
RM
*
t
rr
I
rr
Q
rr
W
AVL
Avalanche Energy
* Pulse Test: Pulse Width=300µs, Duty Cycle=2%
©2000 Fairchild Semiconductor InternationalRev. F, September 2000
元器件交易网
FFPF30U60DN
Typical Characteristics
60
1000
10
T
C
= 100C
o
R
e
v
e
r
s
e
C
u
r
r
e
n
t
,
I
R
[
µ
A
]
100
F
o
r
w
a
r
d
C
u
r
r
e
n
t
,
I
F
[
A
]
T
C
= 100C
o
10
T
C
= 25C
1
o
1
T
C
= 25C
0.1
o
0.01
0.1
0.00.51.01.52.02.53.0
1E-3
100600
Forward Voltage , V
F
[V]Reverse Voltage , V
R
[V]
Figure 1. Typical Forward Voltage Drop
vs. Forward Current
300
100
Figure 2. Typical Reverse Current
vs. Reverse Voltage
R
e
v
e
r
s
e
R
e
c
o
v
e
r
y
T
i
m
e
,
t
r
r
[
n
s
]
Typical Capacitance
at 0V = 278 pF
I
F
= 30A
90
T
C
= 25C
o
C
a
p
a
c
i
t
a
n
c
e
,
C
j
[
p
F
]
200
80
70
100
60
50
0.1110100
40
100500
Reverse Voltage , V
R
[V]
di/dt [A/
µ
s]
Figure 3. Typical Junction Capacitance
Figure 4. Typical Reverse Recovery Time
vs. di/dt
50
R
e
v
e
r
s
e
R
e
c
o
v
e
r
y
C
u
r
r
e
n
t
,
I
r
r
[
A
]
14
12
10
8
6
4
2
0
100
I
F
= 30A
o
T
C
= 25C
F
(
A
V
)
[
A
]
A
v
e
r
a
g
e
F
o
r
w
a
r
d
C
u
r
r
e
n
t
,
I
16
40
30
20
10
500
0
6080100120
o
140160
di/dt [A/
µ
s]
Case Temperature , T
C
[C]
Figure 5. Typical Reverse Recovery Current
vs. di/dt
©2000 Fairchild Semiconductor International
Figure 6. Forward Current Derating Curve
Rev. F, September 2000
C
D
元器件交易网
FFPF30U60DN
Package Dimensions
TO-220F
3
.
3
0
±
0
.
1
0
10.16
±0.20
(7.00)
ø3.18
±0.10
2.54
±0.20
(0.70)
6
.
6
8
±
0
.
2
0
1
5
.
8
0
±
0
.
2
0
(1.00x45°)
MAX1.47
9
.
7
5
±
0
.
3
0
0.80
±0.10
(
3
)
0
°
0.35
±0.10
2.54TYP
[2.54
±0.20
]
#1
0.50
–0.05
2.54TYP
[2.54
±0.20
]
4
.
7
0
±
0
.
2
0
+0.10
2.76
±0.20
9.40
±0.20
Dimensions in Millimeters
Rev. F, September 2000
©2000 Fairchild Semiconductor International
1
5
.
8
7
±
0
.
2
0
元器件交易网
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
Bottomless™
CoolFET™
CROSSVOLT™
DOME™
E
2
CMOS
TM
EnSigna
TM
FACT™
FACT Quiet Series™
FAST
®
DISCLAIMER
FASTr™
GlobalOptoisolator™
GTO™
HiSeC™
ISOPLANAR™
MICROWIRE™
OPTOLOGIC™
OPTOPLANAR™
POP™
PowerTrench
®
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
UHC™
VCX™
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or2. A critical component is any component of a life
support device or system whose failure to perform can
systems which, (a) are intended for surgical implant into
be reasonably expected to cause the failure of the life
the body, or (b) support or sustain life, or (c) whose
support device or system, or to affect its safety or
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
effectiveness.
reasonably expected to result in significant injury to the
user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Advance Information
Product Status
Formative or
In Design
Definition
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
PreliminaryFirst Production
No Identification NeededFull Production
ObsoleteNot In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. F1
2024年10月31日发(作者：蔚寄松)
元器件交易网
FFPF30U60DN
FFPF30U60DN
Features
•High voltage and high reliability
•High speed switching
•Low forward voltage
Applications
•
•
•
•
General purpose
Switching mode power supply
Free-wheeling diode for motor application
Power switching circuits
TO-220F
1 2 3
1. Anode e 3. Anode
ULTRA FAST RECOVERY POWER RECTIFIER
Absolute Maximum Ratings
(per diode) T
C
=25°C unless otherwise noted
Symbol
V
RRM
I
F(AV)
I
FSM
T
J,
T
STG
Parameter
Peak Repetitive Reverse Voltage
Average Rectified Forward Current @ T
C
= 100°C
Non-repetitive Peak Surge Current
60Hz Single Half-Sine Wave
Operating Junction and Storage Temperature
Value
600
30
180
- 65 to +150
Units
V
A
A
°C
Thermal Characteristics
Symbol
R
θJC
Parameter
Maximum Thermal Resistance, Junction to Case
Value
0.8
Units
°C/W
Electrical Characteristics
(per diode) T
C
=25 °C unless otherwise noted
Symbol
V
FM
*
Parameter
Maximum Instantaneous Forward Voltage
I
F
= 30A
I
F
= 30A
Maximum Instantaneous Reverse Current
@ rated V
R
Maximum Reverse Recovery Time
Maximum Reverse Recovery Current
Maximum Reverse Recovery Charge
(I
F
=30A, di/dt = 200A/µs)
1.0
.
2.3
2.1
µA
T
C
= 25 °C
T
C
= 100 °C
15
150
90
8
360
ns
A
nC
mJ
Units
V
T
C
= 25 °C
T
C
= 100 °C
I
RM
*
t
rr
I
rr
Q
rr
W
AVL
Avalanche Energy
* Pulse Test: Pulse Width=300µs, Duty Cycle=2%
©2000 Fairchild Semiconductor InternationalRev. F, September 2000
元器件交易网
FFPF30U60DN
Typical Characteristics
60
1000
10
T
C
= 100C
o
R
e
v
e
r
s
e
C
u
r
r
e
n
t
,
I
R
[
µ
A
]
100
F
o
r
w
a
r
d
C
u
r
r
e
n
t
,
I
F
[
A
]
T
C
= 100C
o
10
T
C
= 25C
1
o
1
T
C
= 25C
0.1
o
0.01
0.1
0.00.51.01.52.02.53.0
1E-3
100600
Forward Voltage , V
F
[V]Reverse Voltage , V
R
[V]
Figure 1. Typical Forward Voltage Drop
vs. Forward Current
300
100
Figure 2. Typical Reverse Current
vs. Reverse Voltage
R
e
v
e
r
s
e
R
e
c
o
v
e
r
y
T
i
m
e
,
t
r
r
[
n
s
]
Typical Capacitance
at 0V = 278 pF
I
F
= 30A
90
T
C
= 25C
o
C
a
p
a
c
i
t
a
n
c
e
,
C
j
[
p
F
]
200
80
70
100
60
50
0.1110100
40
100500
Reverse Voltage , V
R
[V]
di/dt [A/
µ
s]
Figure 3. Typical Junction Capacitance
Figure 4. Typical Reverse Recovery Time
vs. di/dt
50
R
e
v
e
r
s
e
R
e
c
o
v
e
r
y
C
u
r
r
e
n
t
,
I
r
r
[
A
]
14
12
10
8
6
4
2
0
100
I
F
= 30A
o
T
C
= 25C
F
(
A
V
)
[
A
]
A
v
e
r
a
g
e
F
o
r
w
a
r
d
C
u
r
r
e
n
t
,
I
16
40
30
20
10
500
0
6080100120
o
140160
di/dt [A/
µ
s]
Case Temperature , T
C
[C]
Figure 5. Typical Reverse Recovery Current
vs. di/dt
©2000 Fairchild Semiconductor International
Figure 6. Forward Current Derating Curve
Rev. F, September 2000
C
D
元器件交易网
FFPF30U60DN
Package Dimensions
TO-220F
3
.
3
0
±
0
.
1
0
10.16
±0.20
(7.00)
ø3.18
±0.10
2.54
±0.20
(0.70)
6
.
6
8
±
0
.
2
0
1
5
.
8
0
±
0
.
2
0
(1.00x45°)
MAX1.47
9
.
7
5
±
0
.
3
0
0.80
±0.10
(
3
)
0
°
0.35
±0.10
2.54TYP
[2.54
±0.20
]
#1
0.50
–0.05
2.54TYP
[2.54
±0.20
]
4
.
7
0
±
0
.
2
0
+0.10
2.76
±0.20
9.40
±0.20
Dimensions in Millimeters
Rev. F, September 2000
©2000 Fairchild Semiconductor International
1
5
.
8
7
±
0
.
2
0
元器件交易网
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
Bottomless™
CoolFET™
CROSSVOLT™
DOME™
E
2
CMOS
TM
EnSigna
TM
FACT™
FACT Quiet Series™
FAST
®
DISCLAIMER
FASTr™
GlobalOptoisolator™
GTO™
HiSeC™
ISOPLANAR™
MICROWIRE™
OPTOLOGIC™
OPTOPLANAR™
POP™
PowerTrench
®
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
UHC™
VCX™
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or2. A critical component is any component of a life
support device or system whose failure to perform can
systems which, (a) are intended for surgical implant into
be reasonably expected to cause the failure of the life
the body, or (b) support or sustain life, or (c) whose
support device or system, or to affect its safety or
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
effectiveness.
reasonably expected to result in significant injury to the
user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Advance Information
Product Status
Formative or
In Design
Definition
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
PreliminaryFirst Production
No Identification NeededFull Production
ObsoleteNot In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. F1